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Andrew M. Bayless
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor die edge protection for semiconductor device assembli...
Patent number
12,100,661
Issue date
Sep 24, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with recessed pads for die stack interconnect...
Patent number
12,087,697
Issue date
Sep 10, 2024
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrates with heat transfer structures for bonding a stack of mic...
Patent number
11,961,818
Issue date
Apr 16, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin die release for semiconductor device assembly
Patent number
11,791,212
Issue date
Oct 17, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating microelectronic devices and related microelec...
Patent number
11,784,050
Issue date
Oct 10, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Disposing protective cover film and underfill layer over singulated...
Patent number
11,784,092
Issue date
Oct 10, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die edge protection for semiconductor device assembli...
Patent number
11,776,908
Issue date
Oct 3, 2023
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for semiconductor die edge protection and semiconductor die...
Patent number
11,764,096
Issue date
Sep 19, 2023
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with recessed pads for die stack interconnect...
Patent number
11,715,696
Issue date
Aug 1, 2023
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Separation method and assembly for chip-on-wafer processing
Patent number
11,676,955
Issue date
Jun 13, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Recessed semiconductor devices, and associated systems and methods
Patent number
11,646,269
Issue date
May 9, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for temperature modification and reduction of...
Patent number
11,515,171
Issue date
Nov 29, 2022
Micron Technology, Inc.
Xiaopeng Qu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and apparatus for temperature modification in bonding stack...
Patent number
11,410,961
Issue date
Aug 9, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for protection of dielectric films during mic...
Patent number
11,289,360
Issue date
Mar 29, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package cooling by coil cavity
Patent number
11,239,129
Issue date
Feb 1, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for wafer handling and processing
Patent number
11,195,740
Issue date
Dec 7, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for reducing heat transfer in semiconductor assemblies, and...
Patent number
11,189,609
Issue date
Nov 30, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processes for adjusting dimensions of dielectric bond line material...
Patent number
11,189,590
Issue date
Nov 30, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for manufacturing semiconductor devices
Patent number
10,971,471
Issue date
Apr 6, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier removal by use of multilayer foil
Patent number
10,861,765
Issue date
Dec 8, 2020
Micron Technology, Inc.
James M. Derderian
B32 - LAYERED PRODUCTS
Information
Patent Grant
Bond chucks having individually-controllable regions, and associate...
Patent number
10,770,422
Issue date
Sep 8, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond chucks having individually-controllable regions, and associate...
Patent number
10,770,421
Issue date
Sep 8, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package cooling by coil cavity
Patent number
10,763,186
Issue date
Sep 1, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for processing device structures
Patent number
10,749,071
Issue date
Aug 18, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems enabling lower-stress processing of semiconductor device st...
Patent number
10,679,967
Issue date
Jun 9, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for processing semiconductor dice and fabricating assemblie...
Patent number
10,559,495
Issue date
Feb 11, 2020
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier removal by use of multilayer foil
Patent number
10,431,519
Issue date
Oct 1, 2019
Micron Technology, Inc.
James M. Derderian
B32 - LAYERED PRODUCTS
Information
Patent Grant
Methods and system for processing semiconductor device structures
Patent number
10,403,598
Issue date
Sep 3, 2019
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-metal-on-insulator structures, methods of forming suc...
Patent number
10,325,926
Issue date
Jun 18, 2019
Micron Technology, Inc.
Sanh D. Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for processing semiconductor device structures
Patent number
10,326,044
Issue date
Jun 18, 2019
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
NON-CONDUCTIVE FILM FILLET CONTROL IN SEMICONDUCTOR DEVICE ASSEMBLY
Publication number
20250132279
Publication date
Apr 24, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
Publication number
20250046730
Publication date
Feb 6, 2025
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS WITH THINNING-BASED ALIGNMENT MARK AND METHODS OF MANUFAC...
Publication number
20250046731
Publication date
Feb 6, 2025
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLI...
Publication number
20250015000
Publication date
Jan 9, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
Publication number
20240429172
Publication date
Dec 26, 2024
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR SUBSTRATE WITH A SACRIFICIAL ANNULUS
Publication number
20240222184
Publication date
Jul 4, 2024
Micron Technology, Inc.
Jeremy E. Minnich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
Publication number
20240153910
Publication date
May 9, 2024
MICRON TECHNOLGY, INC.
Andrew M. BAYLESS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
Publication number
20240063184
Publication date
Feb 22, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20240055366
Publication date
Feb 15, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY INTERCONNECTION PILLARS AND ASSOCIATE...
Publication number
20240038707
Publication date
Feb 1, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE...
Publication number
20240006223
Publication date
Jan 4, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLI...
Publication number
20240006320
Publication date
Jan 4, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES AND RELATED METHODS OF FABRICATING MICROELE...
Publication number
20240006179
Publication date
Jan 4, 2024
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY
Publication number
20230420300
Publication date
Dec 28, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
Publication number
20230352413
Publication date
Nov 2, 2023
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH SYSTEM AND METHOD FOR SMOOTHING SURFA...
Publication number
20230317511
Publication date
Oct 5, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEPARATION METHOD AND ASSEMBLY FOR CHIP-ON-WAFER PROCESSING
Publication number
20230268334
Publication date
Aug 24, 2023
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...
Publication number
20220375893
Publication date
Nov 24, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECESSED SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AND METHODS
Publication number
20220352077
Publication date
Nov 3, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING MICROELECTRONIC DEVICES AND RELATED MICROELEC...
Publication number
20220344161
Publication date
Oct 27, 2022
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH RECESSED PADS FOR DIE STACK INTERCONNECT...
Publication number
20220344270
Publication date
Oct 27, 2022
Micron Technology, Inc.
Ruei Ying Sheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE EDGE PROTECTION FOR SEMICONDUCTOR DEVICE ASSEMBLI...
Publication number
20220336366
Publication date
Oct 20, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING MICROELECTRONIC DEVICES AND RELATED MICROEL...
Publication number
20220336280
Publication date
Oct 20, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE...
Publication number
20220013401
Publication date
Jan 13, 2022
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEPARATION METHOD AND ASSEMBLY FOR CHIP-ON-WAFER PROCESSING
Publication number
20210391316
Publication date
Dec 16, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION AND REDUCTION OF...
Publication number
20210384042
Publication date
Dec 9, 2021
Micron Technology, Inc.
Xiaopeng Qu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS FOR REDUCING HEAT TRANSFER IN SEMICONDUCTOR ASSEMBLIES, AND...
Publication number
20210343692
Publication date
Nov 4, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR TEMPERATURE MODIFICATION IN BONDING STACK...
Publication number
20210296192
Publication date
Sep 23, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPOSING PROTECTIVE COVER FILM AND UNDERFILL LAYER OVER SINGULATED...
Publication number
20210272846
Publication date
Sep 2, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR PROTECTION OF DIELECTRIC FILMS DURING MIC...
Publication number
20210183682
Publication date
Jun 17, 2021
Micron Technology, Inc.
Andrew M. Bayless
H01 - BASIC ELECTRIC ELEMENTS