Anthony C. Tsui

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bi-directional, reverse blocking battery switch
- Patent number 8,558,368
- Issue date Oct 15, 2013
- GEM Services, Inc.
- James Harnden
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package featuring flip-chip die sandwiched between me...
- Patent number 8,358,017
- Issue date Jan 22, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 8,120,154
- Issue date Feb 21, 2012
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having features formed by stamping
- Patent number 8,106,493
- Issue date Jan 31, 2012
- GEM Services, Inc.
- Anthony C. Tsui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bi-directional, reverse blocking battery switch
- Patent number 8,097,945
- Issue date Jan 17, 2012
- James Harnden
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device package having features formed by stamping
- Patent number 7,838,339
- Issue date Nov 23, 2010
- GEM Services, Inc.
- Anthony C. Tsui
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interconnection of lead frame to die utilizing flip chip process
- Patent number 7,691,670
- Issue date Apr 6, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vertical planar DMOSFET with self-aligned contact
- Patent number 6,277,695
- Issue date Aug 21, 2001
- Siliconix Incorporated
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package with directly connected leads
- Patent number 6,249,041
- Issue date Jun 19, 2001
- Siliconix Incorporated
- Y. Mohammed Kasem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate circuit devices in an intra-package configuration and asse...
- Patent number 6,066,890
- Issue date May 23, 2000
- Siliconix Incorporated
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...
- Publication number 20130105974
- Publication date May 2, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
- Publication number 20130017652
- Publication date Jan 17, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20130009296
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
- Publication number 20130009297
- Publication date Jan 10, 2013
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME
- Publication number 20120181677
- Publication date Jul 19, 2012
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20120181676
- Publication date Jul 19, 2012
- GEM Service, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH
- Publication number 20120056261
- Publication date Mar 8, 2012
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...
- Publication number 20110291254
- Publication date Dec 1, 2011
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20110024886
- Publication date Feb 3, 2011
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20100140762
- Publication date Jun 10, 2010
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...
- Publication number 20090283919
- Publication date Nov 19, 2009
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS
- Publication number 20090273065
- Publication date Nov 5, 2009
- GEM Services, Inc.
- Mohammad Eslamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
- Publication number 20090250796
- Publication date Oct 8, 2009
- GEM Services, Inc.
- Anthony C. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH
- Publication number 20090179265
- Publication date Jul 16, 2009
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...
- Publication number 20080135991
- Publication date Jun 12, 2008
- GEM Services, Inc.
- James Harnden
- H01 - BASIC ELECTRIC ELEMENTS

Anthony C. Tsui

Person

Patents Grantslast 30 patents

Bi-directional, reverse blocking battery switch

Semiconductor package featuring flip-chip die sandwiched between me...

Interconnection of lead frame to die utilizing flip chip process

Semiconductor device package having features formed by stamping

Bi-directional, reverse blocking battery switch

Semiconductor device package having features formed by stamping

Interconnection of lead frame to die utilizing flip chip process

Method of forming vertical planar DMOSFET with self-aligned contact

IC chip package with directly connected leads

Separate circuit devices in an intra-package configuration and asse...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

POWER SEMICONDUCTOR DEVICE PACKAGING

BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

SEMICONDUCTOR PACKAGE FEATURING FLIP-CHIP DIE SANDWICHED BETWEEN ME...

INTERCONNECTION OF LEAD FRAME TO DIE UTILIZING FLIP CHIP PROCESS

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

BI-DIRECTIONAL, REVERSE BLOCKING BATTERY SWITCH

SEMICONDUCTOR DEVICE PACKAGE FEATURING ENCAPSULATED LEADFRAME WITH...