Anthony David Lisi

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for fabrication of an air gap-containing interconnect struc...
- Patent number 8,952,539
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Lawrence A. Clevenger
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Structures and methods for air gap integration
- Patent number 8,896,120
- Issue date Nov 25, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabrication of an air gap-containing interconnect struc...
- Patent number 8,642,252
- Issue date Feb 4, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Air gap-containing interconnect structure having photo-patternable...
- Patent number 8,629,561
- Issue date Jan 14, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integration with through silicon vias having mult...
- Patent number 8,399,180
- Issue date Mar 19, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for air gap interconnect integration using photo-patternable...
- Patent number 8,241,992
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversing tone of patterns on integrated circuit and nanoscale fabr...
- Patent number 8,183,694
- Issue date May 22, 2012
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of patterning insulating layers using etching techniques th...
- Patent number 8,058,176
- Issue date Nov 15, 2011
- Samsung Electronics Co., Ltd.
- Wan-jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-lithographic dimensioned air gap formation and related structure
- Patent number 7,943,480
- Issue date May 17, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for reversing tone of patterns on integerated circuit and s...
- Patent number 7,939,446
- Issue date May 10, 2011
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene wiring fabrication methods incorporating dielectric cap e...
- Patent number 7,470,616
- Issue date Dec 30, 2008
- International Business Machines Corporation
- Hakeem S. B. Akinmade-Yusuff
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREFERENTIAL SHRINK AND BIAS CONTROL IN CONTACT SHRINK ETCH
- Publication number 20140357080
- Publication date Dec 4, 2014
- TOKYO ELECTRON LIMITED
- Anthony D. LISI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATION OF AN AIR GAP-CONTAINING INTERCONNECT STRUC...
- Publication number 20140131880
- Publication date May 15, 2014
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Reversing Tone of Patterns on Integrated Circuit and Pat...
- Publication number 20130022930
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR AIR GAP INTERCONNECT INTEGRATION USING PHOTO-PATTERNABLE...
- Publication number 20120280398
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR AIR GAP INTERCONNECT INTEGRATION
- Publication number 20110272810
- Publication date Nov 10, 2011
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR AIR GAP INTEGRATION
- Publication number 20110260326
- Publication date Oct 27, 2011
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATION OF AN AIR GAP-CONTAINING INTERCONNECT STRUC...
- Publication number 20110221062
- Publication date Sep 15, 2011
- International Business Machines Corporation
- Lawrence A. Clevenger
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Three Dimensional Integration With Through Silicon Vias Having Mult...
- Publication number 20110171582
- Publication date Jul 14, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CONTROL USING SIGNAL REPRESENTATIVE OF A THROTTLE VALVE POS...
- Publication number 20110168671
- Publication date Jul 14, 2011
- International Business Machines Corporation
- John M. Yamartino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Reversing Tone of Patterns on Integrated Circuit and St...
- Publication number 20110121457
- Publication date May 26, 2011
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR REVERSING TONE OF PATTERNS ON INTEGERATED CIRCUIT AND S...
- Publication number 20110108989
- Publication date May 12, 2011
- International Business Machines Corporation
- Lawerence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reversing tone of patterns on integrated circuit and pat...
- Publication number 20110020753
- Publication date Jan 27, 2011
- International Business Machines Corporation
- Lawrence A. Clevenger
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DAMASCENE WIRING FABRICATION METHODS INCORPORATING DIELECTRIC CAP E...
- Publication number 20090283912
- Publication date Nov 19, 2009
- Hakeem B.S. AKINMADE-YUSUFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-LITHOGRAPHIC DIMENSIONED AIR GAP FORMATION AND RELATED STRUCTURE
- Publication number 20090200636
- Publication date Aug 13, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Patterning Insulating Layers Using Etching Techniques th...
- Publication number 20090081873
- Publication date Mar 26, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Wan-jae Park
- H01 - BASIC ELECTRIC ELEMENTS

Anthony David Lisi

Person

Patents Grantslast 30 patents

Methods for fabrication of an air gap-containing interconnect struc...

Structures and methods for air gap integration

Methods for fabrication of an air gap-containing interconnect struc...

Air gap-containing interconnect structure having photo-patternable...

Three dimensional integration with through silicon vias having mult...

Method for air gap interconnect integration using photo-patternable...

Reversing tone of patterns on integrated circuit and nanoscale fabr...

Methods of patterning insulating layers using etching techniques th...

Sub-lithographic dimensioned air gap formation and related structure

Process for reversing tone of patterns on integerated circuit and s...

Damascene wiring fabrication methods incorporating dielectric cap e...

Patents Applicationslast 30 patents

METHOD FOR PREFERENTIAL SHRINK AND BIAS CONTROL IN CONTACT SHRINK ETCH

METHODS FOR FABRICATION OF AN AIR GAP-CONTAINING INTERCONNECT STRUC...

Method for Reversing Tone of Patterns on Integrated Circuit and Pat...

METHOD FOR AIR GAP INTERCONNECT INTEGRATION USING PHOTO-PATTERNABLE...

STRUCTURE AND METHOD FOR AIR GAP INTERCONNECT INTEGRATION

STRUCTURES AND METHODS FOR AIR GAP INTEGRATION

METHODS FOR FABRICATION OF AN AIR GAP-CONTAINING INTERCONNECT STRUC...

Three Dimensional Integration With Through Silicon Vias Having Mult...

PROCESS CONTROL USING SIGNAL REPRESENTATIVE OF A THROTTLE VALVE POS...

Process for Reversing Tone of Patterns on Integrated Circuit and St...

PROCESS FOR REVERSING TONE OF PATTERNS ON INTEGERATED CIRCUIT AND S...

Method for reversing tone of patterns on integrated circuit and pat...

DAMASCENE WIRING FABRICATION METHODS INCORPORATING DIELECTRIC CAP E...

SUB-LITHOGRAPHIC DIMENSIONED AIR GAP FORMATION AND RELATED STRUCTURE

Methods of Patterning Insulating Layers Using Etching Techniques th...