Arvind Chandrasekaran

Person

Los Angeles, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Panelized backside processing for thin semiconductors
- Patent number 9,252,128
- Issue date Feb 2, 2016
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side interconnected CMOS for stacked integrated circuits
- Patent number 8,912,043
- Issue date Dec 16, 2014
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfabricated pillar fins for thermal management
- Patent number 8,877,563
- Issue date Nov 4, 2014
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid package construction with wire bond and through silicon vias
- Patent number 8,803,305
- Issue date Aug 12, 2014
- QUALCOMM Incorporated
- Ratibor Radojcic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect sensor for detecting delamination
- Patent number 8,618,539
- Issue date Dec 31, 2013
- QUALCOMM Incorporated
- Brian Matthew Henderson
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...
- Patent number 8,557,680
- Issue date Oct 15, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side interconnected CMOS for stacked integrated circuits
- Patent number 8,525,342
- Issue date Sep 3, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous thin semiconductor wafer surface features
- Patent number 8,513,089
- Issue date Aug 20, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive sidewall for microbumps
- Patent number 8,482,125
- Issue date Jul 9, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive coupler between package substrate and system board
- Patent number 8,451,581
- Issue date May 28, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discontinuous thin semiconductor wafer surface features
- Patent number 8,445,994
- Issue date May 21, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die-based packaging interconnect
- Patent number 8,391,018
- Issue date Mar 5, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing susceptibility to electrostatic discharge damage during di...
- Patent number 8,354,300
- Issue date Jan 15, 2013
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die parallel plate capacitor
- Patent number 8,310,061
- Issue date Nov 13, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panelized backside processing for thin semiconductors
- Patent number 8,294,280
- Issue date Oct 23, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfabricated pillar fins for thermal management
- Patent number 8,283,776
- Issue date Oct 9, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...
- Patent number 8,242,543
- Issue date Aug 14, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable feature interface that induces a balanced stress to preven...
- Patent number 8,076,762
- Issue date Dec 13, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via bridge interconnect
- Patent number 7,969,009
- Issue date Jun 28, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic measuring tool to measure through-silicon via depth
- Patent number 7,900,519
- Issue date Mar 8, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DUAL-SIDE INTERCONNECTED CMOS FOR STACKED INTEGRATED CIRCUITS
- Publication number 20130302943
- Publication date Nov 14, 2013
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFABRICATED PILLAR FINS FOR THERMAL MANAGEMENT
- Publication number 20130237015
- Publication date Sep 12, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SIDEWALL FOR MICROBUMPS
- Publication number 20130105559
- Publication date May 2, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS THIN SEMICONDUCTOR WAFER SURFACE FEATURES
- Publication number 20130084686
- Publication date Apr 4, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER-TO-WAFER BONDING FOR DISSIMILAR SEMICONDUCTOR D...
- Publication number 20120276716
- Publication date Nov 1, 2012
- QULCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANELIZED BACKSIDE PROCESSING FOR THIN SEMICONDUCTORS
- Publication number 20120040497
- Publication date Feb 16, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforced Wafer-Level Molding to Reduce Warpage
- Publication number 20120025362
- Publication date Feb 2, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated shielding for a package-on-package system
- Publication number 20120012991
- Publication date Jan 19, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Sidewall for Microbumps
- Publication number 20120012998
- Publication date Jan 19, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Side Interconnected CMOS For Stacked Integrated Circuits
- Publication number 20110248403
- Publication date Oct 13, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PROCESSING TO REDUCE WAFER LEVEL WARPAGE
- Publication number 20110221053
- Publication date Sep 15, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon via Bridge Interconnect
- Publication number 20110215472
- Publication date Sep 8, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Susceptibility to Electrostatic Discharge Damage during Di...
- Publication number 20110204504
- Publication date Aug 25, 2011
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Preparation of Die for Improved Bonding Strength
- Publication number 20110193211
- Publication date Aug 11, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing Arrangements of Vias
- Publication number 20110193212
- Publication date Aug 11, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfabricated Pillar Fins For Thermal Management
- Publication number 20110180925
- Publication date Jul 28, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Coupler Between Package Substrate and System Board
- Publication number 20110170231
- Publication date Jul 14, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hybrid Package Construction With Wire Bond And Through Silicon Vias
- Publication number 20110115064
- Publication date May 19, 2011
- QUALCOMM Incorporated
- Ratibor Radojcic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Sensor for Detecting Delamination
- Publication number 20110101347
- Publication date May 5, 2011
- QUALCOMM Incorporated
- Brian Matthew Henderson
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Die-Based Packaging Interconnect
- Publication number 20110075393
- Publication date Mar 31, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Wafer-To-Wafer Bonding For Dissimilar Semiconductor D...
- Publication number 20110049694
- Publication date Mar 3, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Variable Feature Interface That Induces A Balanced Stress To Preven...
- Publication number 20110037156
- Publication date Feb 17, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
- Publication number 20110012239
- Publication date Jan 20, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Balance Layer on Semiconductor Wafer Backside
- Publication number 20100314725
- Publication date Dec 16, 2010
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic Measuring Tool to Measure Through-Silicon Via Depth
- Publication number 20100313652
- Publication date Dec 16, 2010
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- G01 - MEASURING TESTING
Information Patent Application
Discontinuous Thin Semiconductor Wafer Surface Features
- Publication number 20100283131
- Publication date Nov 11, 2010
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Panelized Backside Processing for Thin Semiconductors
- Publication number 20100283160
- Publication date Nov 11, 2010
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scribe-Line Through Silicon Vias
- Publication number 20100200957
- Publication date Aug 12, 2010
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Parallel Plate Capacitor
- Publication number 20100148373
- Publication date Jun 17, 2010
- QUAL COMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Integrated in a Semiconductor Chip
- Publication number 20100127937
- Publication date May 27, 2010
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- G06 - COMPUTING CALCULATING COUNTING

Arvind Chandrasekaran

Person

Patents Grantslast 30 patents

Panelized backside processing for thin semiconductors

Dual-side interconnected CMOS for stacked integrated circuits

Microfabricated pillar fins for thermal management

Hybrid package construction with wire bond and through silicon vias

Interconnect sensor for detecting delamination

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...

Dual-side interconnected CMOS for stacked integrated circuits

Discontinuous thin semiconductor wafer surface features

Conductive sidewall for microbumps

Passive coupler between package substrate and system board

Discontinuous thin semiconductor wafer surface features

Semiconductor die-based packaging interconnect

Reducing susceptibility to electrostatic discharge damage during di...

Stacked die parallel plate capacitor

Panelized backside processing for thin semiconductors

Microfabricated pillar fins for thermal management

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...

Variable feature interface that induces a balanced stress to preven...

Through silicon via bridge interconnect

Microfluidic measuring tool to measure through-silicon via depth

Patents Applicationslast 30 patents

DUAL-SIDE INTERCONNECTED CMOS FOR STACKED INTEGRATED CIRCUITS

MICROFABRICATED PILLAR FINS FOR THERMAL MANAGEMENT

CONDUCTIVE SIDEWALL FOR MICROBUMPS

DISCONTINUOUS THIN SEMICONDUCTOR WAFER SURFACE FEATURES

SEMICONDUCTOR WAFER-TO-WAFER BONDING FOR DISSIMILAR SEMICONDUCTOR D...

PANELIZED BACKSIDE PROCESSING FOR THIN SEMICONDUCTORS

Reinforced Wafer-Level Molding to Reduce Warpage

Integrated shielding for a package-on-package system

Conductive Sidewall for Microbumps

Dual-Side Interconnected CMOS For Stacked Integrated Circuits

PRE-PROCESSING TO REDUCE WAFER LEVEL WARPAGE

Through Silicon via Bridge Interconnect

Reducing Susceptibility to Electrostatic Discharge Damage during Di...

Surface Preparation of Die for Improved Bonding Strength

Systems and Methods Providing Arrangements of Vias

Microfabricated Pillar Fins For Thermal Management

Passive Coupler Between Package Substrate and System Board

Hybrid Package Construction With Wire Bond And Through Silicon Vias

Interconnect Sensor for Detecting Delamination

Semiconductor Die-Based Packaging Interconnect

Semiconductor Wafer-To-Wafer Bonding For Dissimilar Semiconductor D...

Variable Feature Interface That Induces A Balanced Stress To Preven...

Barrier Layer On Polymer Passivation For Integrated Circuit Packaging

Stress Balance Layer on Semiconductor Wafer Backside

Microfluidic Measuring Tool to Measure Through-Silicon Via Depth

Discontinuous Thin Semiconductor Wafer Surface Features

Panelized Backside Processing for Thin Semiconductors

Scribe-Line Through Silicon Vias

Stacked Die Parallel Plate Capacitor

Antenna Integrated in a Semiconductor Chip