TREA

Atsushi Chono

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  • Fujisawa, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Plating apparatus
    • Patent number RE39123
    • Issue date Jun 13, 2006
    • Ebara Corporation
    • Fumio Kuriyama
    • 205 - Electrolysis: processes, compositions used therein, and methods of prep...
  • Information Patent Grant

    Substrate plating apparatus
    • Patent number 6,929,722
    • Issue date Aug 16, 2005
    • Ebara Corporation
    • Akihisa Hongo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Substrate plating apparatus and method
    • Patent number 6,793,794
    • Issue date Sep 21, 2004
    • Ebara Corporation
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Substrate plating apparatus
    • Patent number 6,582,580
    • Issue date Jun 24, 2003
    • Ebara Corporation
    • Akihisa Hongo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating device
    • Patent number 6,517,689
    • Issue date Feb 11, 2003
    • Ebara Corporation
    • Akihisa Hongo
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Plating apparatus for detecting the conductivity between plating co...
    • Patent number 6,500,317
    • Issue date Dec 31, 2002
    • Ebara Corporation
    • Junichiro Yoshioka
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Plating apparatus
    • Patent number 6,379,520
    • Issue date Apr 30, 2002
    • Ebara Corporation
    • Fumio Kuriyama
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Substrate plating device
    • Patent number 6,365,017
    • Issue date Apr 2, 2002
    • Ebara Corporation
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Wafer plating jig
    • Patent number 6,365,020
    • Issue date Apr 2, 2002
    • Ebara Corporation
    • Junichiro Yoshioka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Substrate plating apparatus
    • Patent number 6,294,059
    • Issue date Sep 25, 2001
    • Ebara Corporation
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Substrate plating apparatus
    • Publication number 20040163947
    • Publication date Aug 26, 2004
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Substrate plating apparatus
    • Publication number 20020139683
    • Publication date Oct 3, 2002
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Substrate plating apparatus
    • Publication number 20020005359
    • Publication date Jan 17, 2002
    • Akihisa Hongo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR