Axel Preusse

Person

Radebeul, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure including a layer of a first metal between...
- Patent number 9,620,453
- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Inc.
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 9,305,878
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES, INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact elements of a semiconductor device formed by electroless pl...
- Patent number 8,951,900
- Issue date Feb 10, 2015
- GLOBALFOUNDRIES Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 8,932,911
- Issue date Jan 13, 2015
- GLOBALFOUNDRIES, INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstructure device including a metallization structure with self...
- Patent number 8,883,610
- Issue date Nov 11, 2014
- GLOBALFOUNDRIES Inc.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact elements of a semiconductor device formed by electroless pl...
- Patent number 8,450,197
- Issue date May 28, 2013
- GLOBALFOUNDRIES Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact elements of semiconductor devices formed on the basis of a...
- Patent number 8,389,401
- Issue date Mar 5, 2013
- GLOBALFOUNDRIES Inc.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cap layer of increased electrode potential for copper-based m...
- Patent number 8,314,494
- Issue date Nov 20, 2012
- Advanced Micro Devices, Inc.
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing superior electromigration performance and reducing deteri...
- Patent number 8,153,524
- Issue date Apr 10, 2012
- Advanced Micro Devices, Inc.
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for electrochemically depositing an alloy having a chemic...
- Patent number 7,985,329
- Issue date Jul 26, 2011
- Advanced Micro Devices, Inc.
- Axel Preusse
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming a metal directly on a conductive barrier layer by...
- Patent number 7,981,793
- Issue date Jul 19, 2011
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing bubbles from a process liquid
- Patent number 7,947,158
- Issue date May 24, 2011
- GLOBALFOUNDRIES Inc.
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Reducing leakage in dielectric materials including metal regions in...
- Patent number 7,781,329
- Issue date Aug 24, 2010
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a copper-based metallization layer including a co...
- Patent number 7,745,327
- Issue date Jun 29, 2010
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing bubbles from a process liquid
- Patent number 7,615,103
- Issue date Nov 10, 2009
- Advanced Micro Devices, Inc.
- Helge Hartz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for metal deposition by electroless plating using an acti...
- Patent number 7,560,381
- Issue date Jul 14, 2009
- Advanced Micro Devices, Inc.
- Markus Nopper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a metal layer over a patterned dielectric by wet...
- Patent number 7,517,782
- Issue date Apr 14, 2009
- Advanced Micro Devices, Inc.
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of reworking a semiconductor structure
- Patent number 7,476,552
- Issue date Jan 13, 2009
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming interconnect structures with reduced electro...
- Patent number 7,375,031
- Issue date May 20, 2008
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing wafer contamination by removing under-metal laye...
- Patent number 7,169,664
- Issue date Jan 30, 2007
- Advanced Micro Devices, Inc.
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for controlling ion distribution during plating o...
- Patent number 6,974,530
- Issue date Dec 13, 2005
- Advanced Micro Devices, Inc.
- Matthias Bonkass
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of electroplating copper over a patterned dielectric layer t...
- Patent number 6,958,247
- Issue date Oct 25, 2005
- Advanced Micro Devices, Inc.
- Gerd Marxsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal layer over patterned dielectric by electr...
- Patent number 6,951,816
- Issue date Oct 4, 2005
- Advanced Micro Devices, Inc.
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for treating a substrate electrochemically whi...
- Patent number 6,841,056
- Issue date Jan 11, 2005
- Advanced Micro Devices, Inc.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for improving the manufacturing of metal damascen...
- Patent number 6,774,030
- Issue date Aug 10, 2004
- Advanced Micro Devices, Inc.
- Gerd Marxsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electrochemical metal deposition
- Patent number 6,761,812
- Issue date Jul 13, 2004
- Advanced Micro Devices, Inc.
- Axel Preusse
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of forming metal lines having improved uniformity on a subst...
- Patent number 6,620,726
- Issue date Sep 16, 2003
- Advanced Micro Devices, Inc.
- Axel Preusse
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING A LAYER OF A FIRST METAL BETWEEN...
- Publication number 20160104638
- Publication date Apr 14, 2016
- GLOBALFOUNDRIES INC.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20150097291
- Publication date Apr 9, 2015
- GLOBALFOUNDRIES, Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20140239503
- Publication date Aug 28, 2014
- GLOBALFOUNDRIES, Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ELEMENTS OF A SEMICONDUCTOR DEVICE FORMED BY ELECTROLESS PL...
- Publication number 20130237057
- Publication date Sep 12, 2013
- GLOBALFOUNDRIES INC.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Elements of a Semiconductor Device Formed by Electroless Pl...
- Publication number 20110244679
- Publication date Oct 6, 2011
- GLOBALFOUNDRIES INC.
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES FORMED ON THE BASIS OF A...
- Publication number 20110156270
- Publication date Jun 30, 2011
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ELECTROMIGRATION PERFORMANCE OF COPPER LINES IN METALLIZAT...
- Publication number 20100289125
- Publication date Nov 18, 2010
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROVIDING SUPERIOR ELECTROMIGRATION PERFORMANCE AND REDUCING DETERI...
- Publication number 20100221911
- Publication date Sep 2, 2010
- Oliver Aubel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF...
- Publication number 20100133648
- Publication date Jun 3, 2010
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REMOVING BUBBLES FROM A PROCESS LIQUID
- Publication number 20100024724
- Publication date Feb 4, 2010
- Advanced Micro Devices, Inc.
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REDUCING LEAKAGE IN DIELECTRIC MATERIALS INCLUDING METAL REGIONS IN...
- Publication number 20090325375
- Publication date Dec 31, 2009
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CAP LAYER OF INCREASED ELECTRODE POTENTIAL FOR COPPER-BASED M...
- Publication number 20090243109
- Publication date Oct 1, 2009
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL DIRECTLY ON A CONDUCTIVE BARRIER LAYER BY...
- Publication number 20090061629
- Publication date Mar 5, 2009
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL DIRECTLY ON A CONDUCTIVE BARRIER LAYER BY...
- Publication number 20090061621
- Publication date Mar 5, 2009
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CO...
- Publication number 20080206986
- Publication date Aug 28, 2008
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY ELEC...
- Publication number 20080182409
- Publication date Jul 31, 2008
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CO...
- Publication number 20080182406
- Publication date Jul 31, 2008
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A METALLIZATION LAYER STACK WITH A...
- Publication number 20070178690
- Publication date Aug 2, 2007
- Markus Nopper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY WET...
- Publication number 20070166982
- Publication date Jul 19, 2007
- Axel Preusse
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Technique for forming interconnect structures with reduced electro...
- Publication number 20060246721
- Publication date Nov 2, 2006
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for electrochemically depositing an alloy having a chemic...
- Publication number 20060219565
- Publication date Oct 5, 2006
- Axel Preusse
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Technique for metal deposition by electroless plating using an acti...
- Publication number 20060194431
- Publication date Aug 31, 2006
- Markus Nopper
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of reworking a semiconductor structure
- Publication number 20060194349
- Publication date Aug 31, 2006
- Axel Preusse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for controlling a substrate position in an electr...
- Publication number 20060193992
- Publication date Aug 31, 2006
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for removing bubbles from a process liquid
- Publication number 20060169579
- Publication date Aug 3, 2006
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System and method for an increased bath lifetime in a single-use pl...
- Publication number 20050241947
- Publication date Nov 3, 2005
- Markus Nopper
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Storage tank for process liquids with a reduced amount of bubbles
- Publication number 20050067288
- Publication date Mar 31, 2005
- Helge Hartz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for automatically controlling a current distribut...
- Publication number 20050067290
- Publication date Mar 31, 2005
- Matthias Bonkass
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of reducing wafer contamination by removing under-metal laye...
- Publication number 20040251518
- Publication date Dec 16, 2004
- Axel Preusse
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of electroplating copper over a patterned dielectric layer t...
- Publication number 20040214423
- Publication date Oct 28, 2004
- Gerd Marxsen
- H01 - BASIC ELECTRIC ELEMENTS

Axel Preusse

Person

Patents Grantslast 30 patents

Semiconductor structure including a layer of a first metal between...

Integrated circuits and methods for fabricating integrated circuits...

Contact elements of a semiconductor device formed by electroless pl...

Integrated circuits and methods for fabricating integrated circuits...

Microstructure device including a metallization structure with self...

Contact elements of a semiconductor device formed by electroless pl...

Contact elements of semiconductor devices formed on the basis of a...

Metal cap layer of increased electrode potential for copper-based m...

Providing superior electromigration performance and reducing deteri...

Technique for electrochemically depositing an alloy having a chemic...

Method of forming a metal directly on a conductive barrier layer by...

Apparatus and method for removing bubbles from a process liquid

Reducing leakage in dielectric materials including metal regions in...

Method of forming a copper-based metallization layer including a co...

Apparatus and method for removing bubbles from a process liquid

Technique for metal deposition by electroless plating using an acti...

Method of forming a metal layer over a patterned dielectric by wet...

Method of reworking a semiconductor structure

Technique for forming interconnect structures with reduced electro...

Method of reducing wafer contamination by removing under-metal laye...

Method and system for controlling ion distribution during plating o...

Method of electroplating copper over a patterned dielectric layer t...

Method of forming a metal layer over patterned dielectric by electr...

Apparatus and method for treating a substrate electrochemically whi...

Method and system for improving the manufacturing of metal damascen...

Apparatus and method for electrochemical metal deposition

Method of forming metal lines having improved uniformity on a subst...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE INCLUDING A LAYER OF A FIRST METAL BETWEEN...

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

CONTACT ELEMENTS OF A SEMICONDUCTOR DEVICE FORMED BY ELECTROLESS PL...

Contact Elements of a Semiconductor Device Formed by Electroless Pl...

CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES FORMED ON THE BASIS OF A...

ENHANCED ELECTROMIGRATION PERFORMANCE OF COPPER LINES IN METALLIZAT...

PROVIDING SUPERIOR ELECTROMIGRATION PERFORMANCE AND REDUCING DETERI...

MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF...

APPARATUS AND METHOD FOR REMOVING BUBBLES FROM A PROCESS LIQUID

REDUCING LEAKAGE IN DIELECTRIC MATERIALS INCLUDING METAL REGIONS IN...

METAL CAP LAYER OF INCREASED ELECTRODE POTENTIAL FOR COPPER-BASED M...

METHOD OF FORMING A METAL DIRECTLY ON A CONDUCTIVE BARRIER LAYER BY...

METHOD OF FORMING A METAL DIRECTLY ON A CONDUCTIVE BARRIER LAYER BY...

METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CO...

METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY ELEC...

METHOD OF FORMING A COPPER-BASED METALLIZATION LAYER INCLUDING A CO...

SEMICONDUCTOR DEVICE COMPRISING A METALLIZATION LAYER STACK WITH A...

METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY WET...

Technique for forming interconnect structures with reduced electro...

Technique for electrochemically depositing an alloy having a chemic...

Technique for metal deposition by electroless plating using an acti...

Method of reworking a semiconductor structure

Method and system for controlling a substrate position in an electr...

Apparatus and method for removing bubbles from a process liquid

System and method for an increased bath lifetime in a single-use pl...

Storage tank for process liquids with a reduced amount of bubbles

Method and system for automatically controlling a current distribut...

Method of reducing wafer contamination by removing under-metal laye...

Method of electroplating copper over a patterned dielectric layer t...