Baltazar Canete

Follow

Person

Waiblingen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,410,996
- Issue date Sep 10, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for assembling various dice in a single...
- Patent number 10,332,864
- Issue date Jun 25, 2019
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Re-Routable Clip for Leadframe Based Product
- Publication number 20190259689
- Publication date Aug 22, 2019
- Dialog Semiconductor (UK) Limited
- Tung Ching Lui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuit Package For Assembling Various Dice In A Single...
- Publication number 20180158804
- Publication date Jun 7, 2018
- Dialog Semiconductor (UK) Limited
- Melvin Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...
- Publication number 20180025965
- Publication date Jan 25, 2018
- Dialog Semiconductor (UK) Limited
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Heat Slug to Enhance Substrate Thermal Conductivity
- Publication number 20140355215
- Publication date Dec 4, 2014
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS