Benjamin A. Bonner

Person

San Mateo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
CVD based metal/semiconductor OHMIC contact for high volume manufac...
- Patent number 9,153,486
- Issue date Oct 6, 2015
- Lam Research Corporation
- Reza Arghavani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus with grooved subpad
- Patent number 7,601,050
- Issue date Oct 13, 2009
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Materials for chemical mechanical polishing
- Patent number 7,429,210
- Issue date Sep 30, 2008
- Applied Materials, Inc.
- Benjamin A. Bonner
- B24 - GRINDING POLISHING
Information Patent Grant
Materials for chemical mechanical polishing
- Patent number 7,179,159
- Issue date Feb 20, 2007
- Applied Materials, Inc.
- Benjamin A. Bonner
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier head with a modified flexible membrane
- Patent number 6,855,043
- Issue date Feb 15, 2005
- Applied Materials, Inc.
- Jianshe Tang
- B24 - GRINDING POLISHING
Information Patent Grant
Closed loop control over delivery of liquid material to semiconduct...
- Patent number 6,834,777
- Issue date Dec 28, 2004
- Applied Materials, Inc.
- Thomas H. Osterheld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and compositions for chemical mechanical polishing shallow...
- Patent number 6,811,470
- Issue date Nov 2, 2004
- Applied Materials Inc.
- Benjamin A. Bonner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Closed loop control over delivery of liquid material to semiconduct...
- Patent number 6,561,381
- Issue date May 13, 2003
- Applied Materials, Inc.
- Thomas H. Osterheld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utility wafer for chemical mechanical polishing
- Patent number 6,361,405
- Issue date Mar 26, 2002
- Applied Materials, Inc.
- Jeffrey D. David
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate polishing with reduced contamination
- Patent number 6,251,001
- Issue date Jun 26, 2001
- Applied Materials, Inc.
- Jay D. Pinson
- B24 - GRINDING POLISHING
Information Patent Grant
Method of post CMP defect stability improvement
- Patent number 6,220,941
- Issue date Apr 24, 2001
- Applied Materials, Inc.
- Boris Fishkin
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CVD BASED METAL/SEMICONDUCTOR OHMIC CONTACT FOR HIGH VOLUME MANUFAC...
- Publication number 20140308812
- Publication date Oct 16, 2014
- Reza Arghavani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING POLISHING SHEET
- Publication number 20140237905
- Publication date Aug 28, 2014
- Applied Materials, Inc.
- Benjamin A. Bonner
- B24 - GRINDING POLISHING
Information Patent Application
Partial Contact Wafer Retaining Ring Apparatus
- Publication number 20100120335
- Publication date May 13, 2010
- Novellus Systems, Inc.
- Haoquan Fang
- B24 - GRINDING POLISHING
Information Patent Application
MONOLITHIC LINEAR POLISHING SHEET
- Publication number 20100112919
- Publication date May 6, 2010
- APPLIED MATERIALS, INC.
- Benjamin A. Bonner
- B24 - GRINDING POLISHING
Information Patent Application
LEADER AND TRAILER FOR LINEAR POLISHING SHEET
- Publication number 20090088051
- Publication date Apr 2, 2009
- APPLIED MATERIALS, INC.
- Gregory E. Menk
- B24 - GRINDING POLISHING
Information Patent Application
HIGH SELECTIVITY SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20070218693
- Publication date Sep 20, 2007
- Applied Materials, Inc.
- Benjamin A. Bonner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Smart polishing media assembly for planarizing substrates
- Publication number 20070212976
- Publication date Sep 13, 2007
- APPLIED MATERIALS, INC.
- Peter McReynolds
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus with grooved subpad
- Publication number 20070197141
- Publication date Aug 23, 2007
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
Polishing system with spiral-grooved subpad
- Publication number 20070197147
- Publication date Aug 23, 2007
- Applied Materials, Inc.
- Erik S. Rondum
- B24 - GRINDING POLISHING
Information Patent Application
MATERIALS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20070117500
- Publication date May 24, 2007
- APPLIED MATERIALS, INC.
- BENJAMIN A. BONNER
- B24 - GRINDING POLISHING
Information Patent Application
Materials for chemical mechanical polishing
- Publication number 20060246831
- Publication date Nov 2, 2006
- Benjamin A. Bonner
- B24 - GRINDING POLISHING
Information Patent Application
High selectivity slurry compositions for chemical mechanical polishing
- Publication number 20060097219
- Publication date May 11, 2006
- Applied Materials, Inc.
- Benjamin A. Bonner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Closed loop control over delivery of liquid material to semiconduct...
- Publication number 20030189060
- Publication date Oct 9, 2003
- Applied Materials, Inc.
- Thomas H. Osterheld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and compositions for chemical mechanical polishing shallow...
- Publication number 20030036339
- Publication date Feb 20, 2003
- APPLIED MATERIALS, INC.
- Benjamin A. Bonner
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Multi-step polish process to control uniformity when using a select...
- Publication number 20020100743
- Publication date Aug 1, 2002
- Benjamin A. Bonner
- B24 - GRINDING POLISHING
Information Patent Application
Utility wafer for chemical mechanical polishing
- Publication number 20020028635
- Publication date Mar 7, 2002
- DAVID et al
- Jeffrey D. David
- B24 - GRINDING POLISHING

Benjamin A. Bonner

Person

Patents Grantslast 30 patents

CVD based metal/semiconductor OHMIC contact for high volume manufac...

Polishing apparatus with grooved subpad

Materials for chemical mechanical polishing

Materials for chemical mechanical polishing

Carrier head with a modified flexible membrane

Closed loop control over delivery of liquid material to semiconduct...

Methods and compositions for chemical mechanical polishing shallow...

Closed loop control over delivery of liquid material to semiconduct...

Utility wafer for chemical mechanical polishing

Substrate polishing with reduced contamination

Method of post CMP defect stability improvement

Patents Applicationslast 30 patents

CVD BASED METAL/SEMICONDUCTOR OHMIC CONTACT FOR HIGH VOLUME MANUFAC...

METHOD OF FORMING POLISHING SHEET

Partial Contact Wafer Retaining Ring Apparatus

MONOLITHIC LINEAR POLISHING SHEET

LEADER AND TRAILER FOR LINEAR POLISHING SHEET

HIGH SELECTIVITY SLURRY COMPOSITIONS FOR CHEMICAL MECHANICAL POLISHING

Smart polishing media assembly for planarizing substrates

Polishing apparatus with grooved subpad

Polishing system with spiral-grooved subpad

MATERIALS FOR CHEMICAL MECHANICAL POLISHING

Materials for chemical mechanical polishing

High selectivity slurry compositions for chemical mechanical polishing

Closed loop control over delivery of liquid material to semiconduct...

Methods and compositions for chemical mechanical polishing shallow...

Multi-step polish process to control uniformity when using a select...

Utility wafer for chemical mechanical polishing