Benson Chan

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bidirectional AC-DC converter with multilevel power factor correction
- Patent number 11,689,115
- Issue date Jun 27, 2023
- The Research Foundation for the State University o
- Kalyan Yenduri
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrically conductive adhesive (ECA) for multilayer device interc...
- Patent number 9,451,693
- Issue date Sep 20, 2016
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Human being tracking and monitoring system
- Patent number 9,007,202
- Issue date Apr 14, 2015
- Benson Chan
- G08 - SIGNALLING
Information Patent Grant
Circuitized substrate utilizing three smooth-sided conductive layer...
- Patent number 8,502,082
- Issue date Aug 6, 2013
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying force to electrical contacts on a printed circui...
- Patent number 8,196,281
- Issue date Jun 12, 2012
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spring actuated clamping mechanism
- Patent number 8,028,390
- Issue date Oct 4, 2011
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density connector for interconnecting fine pitch circuit packa...
- Patent number 7,972,178
- Issue date Jul 5, 2011
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lighting assembly and lamp utilizing same
- Patent number 7,841,741
- Issue date Nov 30, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- F21 - LIGHTING
Information Patent Grant
Circuitized substrate with internal cooling structure and electrica...
- Patent number 7,738,249
- Issue date Jun 15, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate with internal optical pathwa...
- Patent number 7,713,767
- Issue date May 11, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with shielded signal lines and plated-thru-ho...
- Patent number 7,679,005
- Issue date Mar 16, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for tracking goods
- Patent number 7,552,091
- Issue date Jun 23, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making circuitized substrate with internal optical pathway
- Patent number 7,541,058
- Issue date Jun 2, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and test assembly for testing electronic devices
- Patent number 7,501,839
- Issue date Mar 10, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G01 - MEASURING TESTING
Information Patent Grant
Electronic card assembly
- Patent number 7,441,709
- Issue date Oct 28, 2008
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Non-oriented wire in elastomer electrical contact
- Patent number 7,252,515
- Issue date Aug 7, 2007
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-oriented wire in elastomer electrical contact
- Patent number 7,204,697
- Issue date Apr 17, 2007
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making high speed circuit board
- Patent number 7,152,319
- Issue date Dec 26, 2006
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency device for tracking goods
- Patent number 7,142,121
- Issue date Nov 28, 2006
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical coupler replication arrangement and process
- Patent number 7,108,809
- Issue date Sep 19, 2006
- International Business Machines Corporation
- Benson Chan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High speed circuitized substrate with reduced thru-hole stub, metho...
- Patent number 6,995,322
- Issue date Feb 7, 2006
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-oriented wire in elastomer electrical contact
- Patent number 6,981,880
- Issue date Jan 3, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board interposer sub-assembly and method
- Patent number 6,974,915
- Issue date Dec 13, 2005
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrates utilizing three smooth-sided conductive laye...
- Patent number 6,964,884
- Issue date Nov 15, 2005
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an interposer sub-assembly in a printed wiring board
- Patent number 6,892,451
- Issue date May 17, 2005
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical coupling of substrates by conductive buttons
- Patent number 6,848,914
- Issue date Feb 1, 2005
- International Business Machines Corporation
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed circuit board and method for fabrication
- Patent number 6,828,514
- Issue date Dec 7, 2004
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly of opto-electronic module with improved heat sink
- Patent number 6,822,875
- Issue date Nov 23, 2004
- International Business Machines Corporation
- Benson Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device with chip level precision alignment
- Patent number 6,741,778
- Issue date May 25, 2004
- International Business Machines Corporation
- Benson Chan
- G02 - OPTICS
Information Patent Grant
Fiber optic connections and method for using same
- Patent number 6,712,527
- Issue date Mar 30, 2004
- International Business Machines Corporation
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bidirectional AC-DC Converter With Multilevel Power Factor Correction
- Publication number 20220109381
- Publication date Apr 7, 2022
- The Research Foundation for The State University of New York
- Kalyan Yenduri
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...
- Publication number 20130033827
- Publication date Feb 7, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM
- Publication number 20120260063
- Publication date Oct 11, 2012
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPRING ACTUATED CLAMPING MECHANISM
- Publication number 20110197430
- Publication date Aug 18, 2011
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKA...
- Publication number 20100323558
- Publication date Dec 23, 2010
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Spring actuated clamping mechanism
- Publication number 20090320280
- Publication date Dec 31, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with internal cooling structure and electrica...
- Publication number 20090109624
- Publication date Apr 30, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making circuitized substrate with internal optical pathwa...
- Publication number 20090093073
- Publication date Apr 9, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G02 - OPTICS
Information Patent Application
Method of making circuitized substrate with internal optical pathway
- Publication number 20090092353
- Publication date Apr 9, 2009
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G02 - OPTICS
Information Patent Application
LED lighting assembly and lamp utilizing same
- Publication number 20080238323
- Publication date Oct 2, 2008
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- F21 - LIGHTING
Information Patent Application
Non-oriented wire in elastomer electrical contact
- Publication number 20070111558
- Publication date May 17, 2007
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer and test assembly for testing electronic devices
- Publication number 20070075726
- Publication date Apr 5, 2007
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G01 - MEASURING TESTING
Information Patent Application
Electronic card assembly
- Publication number 20060213973
- Publication date Sep 28, 2006
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuitized substrate with shielded signal lines and plated-thru-ho...
- Publication number 20060214010
- Publication date Sep 28, 2006
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuitized substrate utilizing three smooth-sided conductive layer...
- Publication number 20060180343
- Publication date Aug 17, 2006
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making printed circuit board with varying depth conductiv...
- Publication number 20060121722
- Publication date Jun 8, 2006
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-oriented wire in elastomer electrical contact
- Publication number 20060057867
- Publication date Mar 16, 2006
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and system for tracking goods
- Publication number 20050289019
- Publication date Dec 29, 2005
- Maines Paper and Food Services, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NON-ORIENTED WIRE IN ELASTOMER ELECTRICAL CONTACT
- Publication number 20050282409
- Publication date Dec 22, 2005
- International Business Machines Corporation
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Radio frequency device for tracking goods
- Publication number 20050270160
- Publication date Dec 8, 2005
- Maines Paper and Food Service, Inc.
- Benson Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of making an interposer sub-assembly in a printed wiring board
- Publication number 20050064740
- Publication date Mar 24, 2005
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High speed circuitized substrate with reduced thru-hole stub, metho...
- Publication number 20050039950
- Publication date Feb 24, 2005
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High speed circuit board and method for fabrication
- Publication number 20040231888
- Publication date Nov 25, 2004
- Endicott Interconnect Technologies, Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High speed circuit board and method for fabrication
- Publication number 20040150969
- Publication date Aug 5, 2004
- Endicott Interconnect Technologies Inc.
- Benson Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical coupler replication arrangement and process
- Publication number 20040061248
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Benson Chan
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
STACKED OPTICAL COUPLER
- Publication number 20030174970
- Publication date Sep 18, 2003
- International Business Machines Corporation
- Benson Chan
- G02 - OPTICS
Information Patent Application
Method of making an interposer sub-assembly in a printed wiring board
- Publication number 20030116351
- Publication date Jun 26, 2003
- International Business Machines Corporation
- William Louis Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical coupling of substrates by conductive buttons
- Publication number 20030073329
- Publication date Apr 17, 2003
- International Business Machines Corporation
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly of opto-electronic module with improved heat sink
- Publication number 20030059176
- Publication date Mar 27, 2003
- International Business Machines Corporation
- Benson Chan
- G02 - OPTICS
Information Patent Application
PROCESSING PROTECTIVE PLUG INSERT FOR OPTICAL MODULES
- Publication number 20030002837
- Publication date Jan 2, 2003
- International Business Machines Corporation
- Benson Chan
- G02 - OPTICS

Benson Chan

Person

Patents Grantslast 30 patents

Bidirectional AC-DC converter with multilevel power factor correction

Electrically conductive adhesive (ECA) for multilayer device interc...

Human being tracking and monitoring system

Circuitized substrate utilizing three smooth-sided conductive layer...

Method of applying force to electrical contacts on a printed circui...

Spring actuated clamping mechanism

High density connector for interconnecting fine pitch circuit packa...

LED lighting assembly and lamp utilizing same

Circuitized substrate with internal cooling structure and electrica...

Method of making circuitized substrate with internal optical pathwa...

Circuitized substrate with shielded signal lines and plated-thru-ho...

Method and system for tracking goods

Method of making circuitized substrate with internal optical pathway

Interposer and test assembly for testing electronic devices

Electronic card assembly

Non-oriented wire in elastomer electrical contact

Non-oriented wire in elastomer electrical contact

Method of making high speed circuit board

Radio frequency device for tracking goods

Optical coupler replication arrangement and process

High speed circuitized substrate with reduced thru-hole stub, metho...

Non-oriented wire in elastomer electrical contact

Printed wiring board interposer sub-assembly and method

Circuitized substrates utilizing three smooth-sided conductive laye...

Method of making an interposer sub-assembly in a printed wiring board

Electrical coupling of substrates by conductive buttons

High speed circuit board and method for fabrication

Assembly of opto-electronic module with improved heat sink

Optical device with chip level precision alignment

Fiber optic connections and method for using same

Patents Applicationslast 30 patents

Bidirectional AC-DC Converter With Multilevel Power Factor Correction

ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...

MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM

SPRING ACTUATED CLAMPING MECHANISM

HIGH DENSITY CONNECTOR FOR INTERCONNECTING FINE PITCH CIRCUIT PACKA...

Spring actuated clamping mechanism

Circuitized substrate with internal cooling structure and electrica...

Method of making circuitized substrate with internal optical pathwa...

Method of making circuitized substrate with internal optical pathway

LED lighting assembly and lamp utilizing same

Non-oriented wire in elastomer electrical contact

Interposer and test assembly for testing electronic devices

Electronic card assembly

Circuitized substrate with shielded signal lines and plated-thru-ho...

Circuitized substrate utilizing three smooth-sided conductive layer...

Method of making printed circuit board with varying depth conductiv...

Non-oriented wire in elastomer electrical contact

Method and system for tracking goods

NON-ORIENTED WIRE IN ELASTOMER ELECTRICAL CONTACT

Radio frequency device for tracking goods

Method of making an interposer sub-assembly in a printed wiring board

High speed circuitized substrate with reduced thru-hole stub, metho...

High speed circuit board and method for fabrication

High speed circuit board and method for fabrication

Optical coupler replication arrangement and process

STACKED OPTICAL COUPLER

Method of making an interposer sub-assembly in a printed wiring board

Electrical coupling of substrates by conductive buttons

Assembly of opto-electronic module with improved heat sink

PROCESSING PROTECTIVE PLUG INSERT FOR OPTICAL MODULES