Beomseok Choi

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
High-throughput additively manufactured power delivery vias and traces
- Patent number 12,170,244
- Issue date Dec 17, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling channel in magnetics
- Patent number 12,100,541
- Issue date Sep 24, 2024
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery structures
- Patent number 12,087,682
- Issue date Sep 10, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two stage multi-input multi-output regulator
- Patent number 12,074,514
- Issue date Aug 27, 2024
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated multi-die partitioned voltage regulator
- Patent number 11,710,720
- Issue date Jul 25, 2023
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system with package stiffening magnetic inductor core...
- Patent number 11,527,489
- Issue date Dec 13, 2022
- Intel Corporation
- Michael J. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-level distributed clamps
- Patent number 11,380,652
- Issue date Jul 5, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cross-domain power transfer voltage regulators
- Patent number 11,353,900
- Issue date Jun 7, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigurable inductor
- Patent number 11,211,866
- Issue date Dec 28, 2021
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20240355725
- Publication date Oct 24, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE TH...
- Publication number 20240186270
- Publication date Jun 6, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
- Publication number 20240114622
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BO...
- Publication number 20240113000
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...
- Publication number 20240063183
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES
- Publication number 20240063133
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...
- Publication number 20230207492
- Publication date Jun 29, 2023
- Aleksandar ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES
- Publication number 20230096368
- Publication date Mar 30, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...
- Publication number 20230097714
- Publication date Mar 30, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...
- Publication number 20230095063
- Publication date Mar 30, 2023
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES
- Publication number 20230095654
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD TO INTEGRATE THREE-DIMENSIONAL PASSIVE COMPONE...
- Publication number 20220415854
- Publication date Dec 29, 2022
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE INTERCONNECTS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20220416393
- Publication date Dec 29, 2022
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTIGUOUS SHIELD STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING H...
- Publication number 20220399305
- Publication date Dec 15, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20220102339
- Publication date Mar 31, 2022
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY
- Publication number 20220102344
- Publication date Mar 31, 2022
- Intel Corporation
- Han Wui THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO STAGE MULTI-INPUT MULTI-OUTPUT REGULATOR
- Publication number 20220094256
- Publication date Mar 24, 2022
- Intel Corporation
- Kaladhar RADHAKRISHNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MAGNETIC WIRES AND THEIR APPLICATIONS
- Publication number 20220085143
- Publication date Mar 17, 2022
- Intel Corporation
- Beomseok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR COUPLED MAGNETIC VOLTAGE REGULATORS
- Publication number 20220085142
- Publication date Mar 17, 2022
- Intel Corporation
- Beomseok CHOI
- G05 - CONTROLLING REGULATING
Information Patent Application
TANDEM MAGNETICS IN PACKAGE
- Publication number 20220084736
- Publication date Mar 17, 2022
- Intel Corporation
- Beomseok CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED COOLING CHANNEL IN MAGNETICS
- Publication number 20220084740
- Publication date Mar 17, 2022
- Intel Corporation
- Beomseok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-THROUGHPUT ADDITIVELY MANUFACTURED POWER DELIVERY VIAS AND TRACES
- Publication number 20210407903
- Publication date Dec 30, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY STRUCTURES
- Publication number 20210398895
- Publication date Dec 23, 2021
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE INDUCTOR
- Publication number 20210036618
- Publication date Feb 4, 2021
- Intel Corporation
- WILLIAM J. Lambert
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTI-LEVEL DISTRIBUTED CLAMPS
- Publication number 20200251448
- Publication date Aug 6, 2020
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CROSS-DOMAIN POWER TRANSFER VOLTAGE REGULATORS
- Publication number 20200004282
- Publication date Jan 2, 2020
- Intel Corporation
- Beomseok Choi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
INTEGRATED HETEROGENOUS POWER MANAGEMENT CIRCUITRIES
- Publication number 20200006305
- Publication date Jan 2, 2020
- Intel Corporation
- William J. Lambert
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PACKAGE STIFFENING MAGNETIC CORE
- Publication number 20200006250
- Publication date Jan 2, 2020
- Intel Corporation
- Michael J. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED MULT-DIE PARTITIONED VOLTAGE REGULATOR
- Publication number 20200006292
- Publication date Jan 2, 2020
- Intel Corporation
- Beomseok Choi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Beomseok Choi

Person

Patents Grantslast 30 patents

High-throughput additively manufactured power delivery vias and traces

Gallium nitride (GAN) three-dimensional integrated circuit technology

Embedded cooling channel in magnetics

Power delivery structures

Two stage multi-input multi-output regulator

Integrated multi-die partitioned voltage regulator

Apparatus and system with package stiffening magnetic inductor core...

Multi-level distributed clamps

Integrated cross-domain power transfer voltage regulators

Reconfigurable inductor

Patents Applicationslast 30 patents

POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE TH...

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...

DUAL SIDED EMBEDDED PASSIVES VIA PANEL LEVEL THERMAL COMPRESSION BO...

MODULAR PACKAGE ARCHITECTURE FOR VOLTAGE REGULATOR-COMPUTE-MEMORY C...

SPLIT METALLIZATION LAYERS IN MULTICHIP DEVICES

COAXIAL INDUCTOR WITH PLATED HIGH RESISTIVITY AND HIGH PERMEABILITY...

IN SITU INDUCTOR STRUCTURE IN BUILDUP POWER PLANES

CONFORMAL POWER DELIVERY STRUCTURE FOR DIRECT CHIP ATTACH ARCHITEC...

INTEGRATING VOLTAGE REGULATORS AND PASSIVE CIRCUIT ELEMENTS WITH TO...

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

CONFORMAL POWER DELIVERY STRUCTURES

APPARATUS AND METHOD TO INTEGRATE THREE-DIMENSIONAL PASSIVE COMPONE...

WAVEGUIDE INTERCONNECTS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS

CONTIGUOUS SHIELD STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING H...

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY

GALLIUM NITRIDE (GAN) THREE-DIMENSIONAL INTEGRATED CIRCUIT TECHNOLOGY

TWO STAGE MULTI-INPUT MULTI-OUTPUT REGULATOR

MAGNETIC WIRES AND THEIR APPLICATIONS

MODULAR COUPLED MAGNETIC VOLTAGE REGULATORS

TANDEM MAGNETICS IN PACKAGE

EMBEDDED COOLING CHANNEL IN MAGNETICS

HIGH-THROUGHPUT ADDITIVELY MANUFACTURED POWER DELIVERY VIAS AND TRACES

POWER DELIVERY STRUCTURES

RECONFIGURABLE INDUCTOR

MULTI-LEVEL DISTRIBUTED CLAMPS

INTEGRATED CROSS-DOMAIN POWER TRANSFER VOLTAGE REGULATORS

INTEGRATED HETEROGENOUS POWER MANAGEMENT CIRCUITRIES

PACKAGE STIFFENING MAGNETIC CORE

INTEGRATED MULT-DIE PARTITIONED VOLTAGE REGULATOR