Betty Jyue Tseng

Person

Berkeley Heights, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making wafer having top and bottom emitting vertical-cavi...
- Patent number 6,485,996
- Issue date Nov 26, 2002
- Lucent Technologies Inc.
- Leo Maria Chirovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite semiconductor devices and method for manufacture thereof
- Patent number 6,444,491
- Issue date Sep 3, 2002
- Agere Systems Optoelectronics Guardian Corp.
- Lucian Arthur D'Asaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer having top and bottom emitting vertical-cavity lasers
- Patent number 6,222,206
- Issue date Apr 24, 2001
- Lucent Technologies Inc.
- Leo Maria Chirovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical cavity surface-emitting laser with optical guide and curre...
- Patent number 6,169,756
- Issue date Jan 2, 2001
- Lucent Technologies Inc.
- Leo Maria Chirovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacture of composite semiconductor devices
- Patent number 6,048,751
- Issue date Apr 11, 2000
- Lucent Technologies Inc.
- Lucian Arthur D'Asaro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bonding of dense arrays of microminiature contact pads
- Patent number 5,918,794
- Issue date Jul 6, 1999
- Lucent Technologies Inc.
- Lucian Arthur D'Asaro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solder-bonding contact pad arrays
- Patent number 5,667,132
- Issue date Sep 16, 1997
- Lucent Technologies Inc.
- Leo Maria Freishyn Chirovsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer having top and bottom emitting vertical-cavity lasers
- Publication number 20020094589
- Publication date Jul 18, 2002
- Leo Maria Chirovsky
- H01 - BASIC ELECTRIC ELEMENTS

Betty Jyue Tseng

Person

Patents Grantslast 30 patents

Method of making wafer having top and bottom emitting vertical-cavi...

Composite semiconductor devices and method for manufacture thereof

Wafer having top and bottom emitting vertical-cavity lasers

Vertical cavity surface-emitting laser with optical guide and curre...

Process for manufacture of composite semiconductor devices

Solder bonding of dense arrays of microminiature contact pads

Method for solder-bonding contact pad arrays

Patents Applicationslast 30 patents

Wafer having top and bottom emitting vertical-cavity lasers