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Taichung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Bond pad connection layout
Patent number
11,876,068
Issue date
Jan 16, 2024
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assemblies with hybrid fanouts and associated methods...
Patent number
11,769,756
Issue date
Sep 26, 2023
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad connection layout
Patent number
11,502,053
Issue date
Nov 15, 2022
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assemblies with hybrid fanouts and associated methods...
Patent number
11,450,645
Issue date
Sep 20, 2022
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
Publication number
20240088100
Publication date
Mar 14, 2024
Lodestar Licensing Group LLC
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
Publication number
20240014170
Publication date
Jan 11, 2024
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
Publication number
20230395545
Publication date
Dec 7, 2023
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
Publication number
20230048311
Publication date
Feb 16, 2023
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD CONNECTION LAYOUT
Publication number
20230026960
Publication date
Jan 26, 2023
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
Publication number
20220328456
Publication date
Oct 13, 2022
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
Publication number
20220165708
Publication date
May 26, 2022
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD CONNECTION LAYOUT
Publication number
20220165701
Publication date
May 26, 2022
Micron Technology, Inc.
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS