Bharat Bhushan

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Modular construction of hybrid-bonded semiconductor die assemblies...
- Patent number 12,278,202
- Issue date Apr 15, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 12,266,630
- Issue date Apr 1, 2025
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 11,876,068
- Issue date Jan 16, 2024
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with hybrid fanouts and associated methods...
- Patent number 11,769,756
- Issue date Sep 26, 2023
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad connection layout
- Patent number 11,502,053
- Issue date Nov 15, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with hybrid fanouts and associated methods...
- Patent number 11,450,645
- Issue date Sep 20, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...
- Publication number 20250226308
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20250210581
- Publication date Jun 26, 2025
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE
- Publication number 20250140753
- Publication date May 1, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20250096202
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...
- Publication number 20250096171
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC
- Publication number 20250079366
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION
- Publication number 20240421030
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PAD ON A THROUGH-SILICON VIA
- Publication number 20240379596
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA
- Publication number 20240339433
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS
- Publication number 20240332229
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240297149
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240282731
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20240145425
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20240088100
- Publication date Mar 14, 2024
- Lodestar Licensing Group LLC
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
- Publication number 20240014170
- Publication date Jan 11, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...
- Publication number 20230395545
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20230048311
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20230026960
- Publication date Jan 26, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20220328456
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
- Publication number 20220165708
- Publication date May 26, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD CONNECTION LAYOUT
- Publication number 20220165701
- Publication date May 26, 2022
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

Bharat Bhushan

Person

Patents Grantslast 30 patents

Modular construction of hybrid-bonded semiconductor die assemblies...

Bond pad connection layout

Bond pads for semiconductor die assemblies and associated methods a...

Bond pad connection layout

Semiconductor assemblies with hybrid fanouts and associated methods...

Bond pad connection layout

Semiconductor assemblies with hybrid fanouts and associated methods...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

BOND PAD CONNECTION LAYOUT

STACKED SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR DIES OF VARIABLE SIZE

STACKED SEMICONDUCTOR DEVICE

METHODS FOR BONDING WAFERS OF KNOWN GOOD DIES, AND ASSEMBLIES RESUL...

SEMICONDUCTOR DEVICE WITH LAYERED DIELECTRIC

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL MITIGATION

CONDUCTIVE PAD ON A THROUGH-SILICON VIA

SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA

SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS

STACKED SEMICONDUCTOR DEVICE

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

BOND PAD CONNECTION LAYOUT

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS

MODULAR CONSTRUCTION OF HYBRID-BONDED SEMICONDUCTOR DIE ASSEMBLIES...

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

BOND PAD CONNECTION LAYOUT

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...

BOND PAD CONNECTION LAYOUT