Bharat Shivkumar

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Redondo Beach, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor multichip module package with improved thermal perfor...
- Patent number 8,629,566
- Issue date Jan 14, 2014
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 6,984,890
- Issue date Jan 10, 2006
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor multichip module package with improved thermal perfor...
- Patent number 6,949,822
- Issue date Sep 27, 2005
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 6,776,399
- Issue date Aug 17, 2004
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 6,765,292
- Issue date Jul 20, 2004
- International Rectifier Corporation
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package
- Patent number 6,410,989
- Issue date Jun 25, 2002
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor multichip module package with improved thermal perfor...
- Publication number 20060022333
- Publication date Feb 2, 2006
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-scale package
- Publication number 20040238971
- Publication date Dec 2, 2004
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact structure for semiconductor device
- Publication number 20030107130
- Publication date Jun 12, 2003
- International Rectifier Corporation
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-scale package
- Publication number 20020135079
- Publication date Sep 26, 2002
- International Rectifier Corporation
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor multichip module package with improved thermal perfor...
- Publication number 20010050441
- Publication date Dec 13, 2001
- International Rectifier Corp.
- Bharat Shivkumar
- H01 - BASIC ELECTRIC ELEMENTS