Bily Wang

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged chip detection and classification device
- Patent number 9,029,725
- Issue date May 12, 2015
- Youngtek Electronics Corporation
- Bily Wang
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Light-guiding cover structure
- Patent number 8,873,920
- Issue date Oct 28, 2014
- Youngtek Electronics Corporation
- Bily Wang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip package structure for achieving flip-chip type e...
- Patent number 8,748,209
- Issue date Jun 10, 2014
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package chip classification system
- Patent number 8,710,387
- Issue date Apr 29, 2014
- Youngtek Electronics Corporation
- Bily Wang
- G01 - MEASURING TESTING
Information Patent Grant
Packaged chip detection and classification device
- Patent number 8,686,310
- Issue date Apr 1, 2014
- Youngtek Electronics Corporation
- Bily Wang
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
LED chip package structure using sedimentation and method for makin...
- Patent number 8,623,680
- Issue date Jan 7, 2014
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simple detachable illumination structure and lamp tube
- Patent number 8,556,463
- Issue date Oct 15, 2013
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Method for manufacturing a conductive substrate structure with cond...
- Patent number 8,555,492
- Issue date Oct 15, 2013
- Harvatek Corporation
- Bily Wang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Multi-track detection system for detecting the appearance of electr...
- Patent number 8,525,524
- Issue date Sep 3, 2013
- Youngtek Electronics Corporation
- Bily Wang
- G01 - MEASURING TESTING
Information Patent Grant
Light-emitting element detection and classification device
- Patent number 8,519,458
- Issue date Aug 27, 2013
- Youngtek Electronics Corporation
- Bily Wang
- G01 - MEASURING TESTING
Information Patent Grant
GPS device with a display function and method for using the same
- Patent number 8,421,884
- Issue date Apr 16, 2013
- Youngtek Electronics Corporation
- Bily Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lamp head assembly and lighting lamp tube
- Patent number 8,398,275
- Issue date Mar 19, 2013
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Conductive substrate structure with conductive channels formed by u...
- Patent number 8,263,876
- Issue date Sep 11, 2012
- Harvatek Corporation
- Bily Wang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
LED chip package structure in order to prevent the light-emitting e...
- Patent number 8,198,800
- Issue date Jun 12, 2012
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip package structure with high-efficiency light emission by r...
- Patent number 8,183,065
- Issue date May 22, 2012
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Strip LED
- Patent number D660259
- Issue date May 22, 2012
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
LED package base
- Patent number D659655
- Issue date May 15, 2012
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
LED package base
- Patent number D659654
- Issue date May 15, 2012
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
LED chip package structure with multifunctional integrated chips an...
- Patent number 8,162,510
- Issue date Apr 24, 2012
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Illumination device with a fire-fighting function
- Patent number 8,162,514
- Issue date Apr 24, 2012
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Package for a light emitting diode and method for fabricating the same
- Patent number 8,137,999
- Issue date Mar 20, 2012
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip package structure with different LED spacings and a method...
- Patent number 8,138,508
- Issue date Mar 20, 2012
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Detection system for detecting appearances of many electronic eleme...
- Patent number 8,107,720
- Issue date Jan 31, 2012
- Youngtek Electronics Corporation
- Bily Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reflection-type light-emitting module with high heat-dissipating an...
- Patent number 8,079,737
- Issue date Dec 20, 2011
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Wafer level vertical diode package structure and method for making...
- Patent number 8,053,885
- Issue date Nov 8, 2011
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color-mixture display unit and image display apparatus using the same
- Patent number 8,053,961
- Issue date Nov 8, 2011
- Harvatek Corporation
- Bily Wang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor chip package structure for achieving flip-chip type e...
- Patent number 8,053,904
- Issue date Nov 8, 2011
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing system and testing method for inspecting electonic devices
- Patent number 8,031,930
- Issue date Oct 4, 2011
- Youngtek Electronics Corporation
- Bily Wang
- G01 - MEASURING TESTING
Information Patent Grant
LED base
- Patent number D645421
- Issue date Sep 20, 2011
- Harvatek Corporation
- Bily Wang
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
LED chip package structure with high-efficiency light emission by r...
- Patent number 8,017,969
- Issue date Sep 13, 2011
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED CHIP DETECTION AND CLASSIFICATION DEVICE
- Publication number 20140048457
- Publication date Feb 20, 2014
- YOUNGTEK ELECTRONICS CORPORATION
- Bily WANG
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
LIGHT-GUIDING COVER STRUCTURE
- Publication number 20130163922
- Publication date Jun 27, 2013
- YOUNGTEK ELECTRONICS CORPORATION
- BILY WANG
- G02 - OPTICS
Information Patent Application
LIGHT-EMITTING ELEMENT DETECTION AND CLASSIFICATION DEVICE
- Publication number 20130015372
- Publication date Jan 17, 2013
- YOUNGTEK ELECTRONICS CORPORATION
- BILY WANG
- G01 - MEASURING TESTING
Information Patent Application
LED PACKAGE CHIP CLASSIFICATION SYSTEM
- Publication number 20120285869
- Publication date Nov 15, 2012
- YOUNGTEK ELECTRONICS CORPORATION
- BILY WANG
- G01 - MEASURING TESTING
Information Patent Application
MULTI-TRACK DETECTION SYSTEM FOR DETECTING THE APPEARANCE OF ELECTR...
- Publication number 20120249156
- Publication date Oct 4, 2012
- YOUNGTEK ELECTRONICS CORPORATION
- BILY WANG
- G01 - MEASURING TESTING
Information Patent Application
PACKAGED CHIP DETECTION AND CLASSIFICATION DEVICE
- Publication number 20120205297
- Publication date Aug 16, 2012
- Bily WANG
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Application
LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METH...
- Publication number 20120119231
- Publication date May 17, 2012
- HARVATEK CORPORATION
- BILY WANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAG...
- Publication number 20120122254
- Publication date May 17, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE
- Publication number 20120106171
- Publication date May 3, 2012
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...
- Publication number 20120096710
- Publication date Apr 26, 2012
- HARVATEK CORPORATION
- BILY WANG
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...
- Publication number 20120094407
- Publication date Apr 19, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMP HEAD ASSEMBLY AND LIGHTING LAMP TUBE
- Publication number 20120069583
- Publication date Mar 22, 2012
- HARVATEK CORPORATION
- BILY WANG
- F21 - LIGHTING
Information Patent Application
LED CHIP PACKAGE STRUCTURE WITH A HIGH-EFFICIENCY HEAT-DISSIPATING...
- Publication number 20120049212
- Publication date Mar 1, 2012
- HARVATEK CORPORATION
- BILY WANG
- G02 - OPTICS
Information Patent Application
LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20120037937
- Publication date Feb 16, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLE DETACHABLE ILLUMINATION STRUCTURE AND LAMP TUBE
- Publication number 20120014087
- Publication date Jan 19, 2012
- HARVATEK CORPORATION
- BILY WANG
- F21 - LIGHTING
Information Patent Application
METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTURE
- Publication number 20120009700
- Publication date Jan 12, 2012
- HARVATEK CORPORATION
- BILY WANG
- G02 - OPTICS
Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFIC...
- Publication number 20120009699
- Publication date Jan 12, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP PACKAGE STRUCTURE
- Publication number 20120001203
- Publication date Jan 5, 2012
- HARVATEK CORPORATION
- BILY WANG
- G02 - OPTICS
Information Patent Application
LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKIN...
- Publication number 20120003765
- Publication date Jan 5, 2012
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL DIODE PACKAGE STRUCTURE
- Publication number 20110304020
- Publication date Dec 15, 2011
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110300649
- Publication date Dec 8, 2011
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FLIP-CHIP TYPE E...
- Publication number 20110229991
- Publication date Sep 22, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110215357
- Publication date Sep 8, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP PACKAGE STRUCTURE IN ORDER TO PREVENT THE LIGHT-EMITTING E...
- Publication number 20110189803
- Publication date Aug 4, 2011
- HARVATEK CORPORATION
- BILY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-GUIDING STRUCTURE WITH PHOSPHOR MATERIAL LAYERS
- Publication number 20110170317
- Publication date Jul 14, 2011
- BILY WANG
- G02 - OPTICS
Information Patent Application
CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...
- Publication number 20110155436
- Publication date Jun 30, 2011
- HARVATEK CORPORATION
- BILY WANG
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Light emission module with high-efficiency light emission and high-...
- Publication number 20110156060
- Publication date Jun 30, 2011
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emission module with high-efficiency light emission and high-...
- Publication number 20110157868
- Publication date Jun 30, 2011
- HARVATEK CORPORATION
- Bily Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emission module with high-efficiency light emission and high-...
- Publication number 20110156083
- Publication date Jun 30, 2011
- HARVATEK CORPORATION
- Bily Wang
- F21 - LIGHTING
Information Patent Application
Light emission module with high-efficiency light emission and high-...
- Publication number 20110156061
- Publication date Jun 30, 2011
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Packaged chip detection and classification device

Light-guiding cover structure

Semiconductor chip package structure for achieving flip-chip type e...

LED package chip classification system

Packaged chip detection and classification device

LED chip package structure using sedimentation and method for makin...

Simple detachable illumination structure and lamp tube

Method for manufacturing a conductive substrate structure with cond...

Multi-track detection system for detecting the appearance of electr...

Light-emitting element detection and classification device

GPS device with a display function and method for using the same

Lamp head assembly and lighting lamp tube

Conductive substrate structure with conductive channels formed by u...

LED chip package structure in order to prevent the light-emitting e...

LED chip package structure with high-efficiency light emission by r...

Strip LED

LED package base

LED package base

LED chip package structure with multifunctional integrated chips an...

Illumination device with a fire-fighting function

Package for a light emitting diode and method for fabricating the same

LED chip package structure with different LED spacings and a method...

Detection system for detecting appearances of many electronic eleme...

Reflection-type light-emitting module with high heat-dissipating an...

Wafer level vertical diode package structure and method for making...

Color-mixture display unit and image display apparatus using the same

Semiconductor chip package structure for achieving flip-chip type e...

Testing system and testing method for inspecting electonic devices

LED base

LED chip package structure with high-efficiency light emission by r...

Patents Applicationslast 30 patents

PACKAGED CHIP DETECTION AND CLASSIFICATION DEVICE

LIGHT-GUIDING COVER STRUCTURE

LIGHT-EMITTING ELEMENT DETECTION AND CLASSIFICATION DEVICE

LED PACKAGE CHIP CLASSIFICATION SYSTEM

MULTI-TRACK DETECTION SYSTEM FOR DETECTING THE APPEARANCE OF ELECTR...

PACKAGED CHIP DETECTION AND CLASSIFICATION DEVICE

LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METH...

WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAG...

LED PACKAGE STRUCTURE

CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...

LAMP HEAD ASSEMBLY AND LIGHTING LAMP TUBE

LED CHIP PACKAGE STRUCTURE WITH A HIGH-EFFICIENCY HEAT-DISSIPATING...

LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

SIMPLE DETACHABLE ILLUMINATION STRUCTURE AND LAMP TUBE

METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTURE

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFIC...

LED CHIP PACKAGE STRUCTURE

LED CHIP PACKAGE STRUCTURE USING SEDIMENTATION AND METHOD FOR MAKIN...

WAFER LEVEL DIODE PACKAGE STRUCTURE

PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FLIP-CHIP TYPE E...

LED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LED CHIP PACKAGE STRUCTURE IN ORDER TO PREVENT THE LIGHT-EMITTING E...

LIGHT-GUIDING STRUCTURE WITH PHOSPHOR MATERIAL LAYERS

CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY U...

Light emission module with high-efficiency light emission and high-...

Light emission module with high-efficiency light emission and high-...

Light emission module with high-efficiency light emission and high-...

Light emission module with high-efficiency light emission and high-...