Bipin DAMA

Person

Bridgewater, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Passively-aligned fiber array to waveguide configuration
- Patent number 11,886,013
- Issue date Jan 30, 2024
- Aayuna Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
User interface module for converting a standard 2D display device i...
- Patent number 11,611,738
- Issue date Mar 21, 2023
- Saras-3D, Inc.
- Bipin D. Dama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
High density opto-electronic interconnection configuration utilizin...
- Patent number 10,725,254
- Issue date Jul 28, 2020
- Aayuna Inc.
- Kalpendu Shastri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reference-less clock and data recovery circuit
- Patent number 9,793,902
- Issue date Oct 17, 2017
- Cisco Technology, Inc.
- Kadaba Lakshmikumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,575,266
- Issue date Feb 21, 2017
- Cisco Technology, Inc.
- Kishor Desai
- G02 - OPTICS
Information Patent Grant
Single mode fiber array connector for opto-electronic transceivers
- Patent number 9,435,965
- Issue date Sep 6, 2016
- Cisco Technology, Inc.
- Chris Kiyoshi Togami
- G02 - OPTICS
Information Patent Grant
Wafer scale packaging platform for transceivers
- Patent number 9,343,450
- Issue date May 17, 2016
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Self-aligning optical connector assembly
- Patent number 9,235,019
- Issue date Jan 12, 2016
- Cisco Technology, Inc.
- Kalpendu Shastri
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Enhanced low inductance interconnections between electronic and opt...
- Patent number 9,209,509
- Issue date Dec 8, 2015
- Cisco Technology, Inc.
- Kalpendu Shastri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded glass lid for wafer level packaging of opto-electronic assem...
- Patent number 9,052,445
- Issue date Jun 9, 2015
- Cisco Technology, Inc.
- Kishor Desai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer configuration with thermally isolated regions for temper...
- Patent number 9,031,107
- Issue date May 12, 2015
- Cisco Technology, Inc.
- Kalpendu Shastri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical modulator utilizing unary encoding and auxiliary modulator...
- Patent number 8,929,689
- Issue date Jan 6, 2015
- Cisco Technology, Inc.
- Peter C. Metz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interposer configuration with thermally isolated regions for temper...
- Patent number 8,905,632
- Issue date Dec 9, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Self-aligning connectorized fiber array assembly
- Patent number 8,876,410
- Issue date Nov 4, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Wafer scale packaging platform for transceivers
- Patent number 8,803,269
- Issue date Aug 12, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Enhanced low inductance interconnections between electronic and opt...
- Patent number 8,724,939
- Issue date May 13, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical interconnection arrangement for high speed, high density co...
- Patent number 8,364,042
- Issue date Jan 29, 2013
- Kalpendu Shastri
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
HDMI TMDS optical signal transmission using PAM technique
- Patent number 8,340,529
- Issue date Dec 25, 2012
- Kalpendu Shastri
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Common electronic dispersion compensation arrangement for use with...
- Patent number 7,570,889
- Issue date Aug 4, 2009
- Lightwire, Inc.
- Kalpendu Shastri
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical modulator utilizing multi-level signaling
- Patent number 7,483,597
- Issue date Jan 27, 2009
- Lightwire, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Grant
Integrated approach for design, simulation and verification of mono...
- Patent number 7,269,809
- Issue date Sep 11, 2007
- SiOptical, Inc.
- Kalpendu Shastri
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Passively-Aligned Fiber Array To Waveguide Configuration
- Publication number 20240210627
- Publication date Jun 27, 2024
- Aayuna Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
On-Line Instructional System And 3D Tools For Student-Centered Lear...
- Publication number 20230260417
- Publication date Aug 17, 2023
- Saras-3D, Inc.
- Bipin D. Dama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Laser Engine Supporting Multiple Laser Sources
- Publication number 20220329041
- Publication date Oct 13, 2022
- Aayuna Inc.
- Kalpendu Shastri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passively-Aligned Fiber Array To Waveguide Configuration
- Publication number 20220244474
- Publication date Aug 4, 2022
- Aayuna Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Medical Instrumentation Utilizing Narrowband Imaging
- Publication number 20220183544
- Publication date Jun 16, 2022
- NSV, Inc.
- Soham Pathak
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
High Density Optical Interconnection Assembly
- Publication number 20210398961
- Publication date Dec 23, 2021
- Aayuna Inc.
- Kalpendu Shastri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
User Interface Module For Converting A Standard 2D Display Device I...
- Publication number 20210377514
- Publication date Dec 2, 2021
- Saras 3D-, Inc.
- Bipin D. Dama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
On-Line Instructional System And 3D Tools For Student-Centered Lear...
- Publication number 20210375150
- Publication date Dec 2, 2021
- Saras 3D-, Inc.
- Bipin D. DAMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Enhanced 2D/3D Mouse For Computer Display Interactions
- Publication number 20200409478
- Publication date Dec 31, 2020
- Saras-3D, Inc.
- Kalpendu Shastri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High Density Opto-Electronic Interconnection Configuration Utilizin...
- Publication number 20190086618
- Publication date Mar 21, 2019
- Aayuna Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
REFERENCE-LESS CLOCK AND DATA RECOVERY CIRCUIT
- Publication number 20170244416
- Publication date Aug 24, 2017
- Cisco Technology, Inc.
- Kadaba LAKSHMIKUMAR
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DIRECT PRINTED CIRCUIT ROUTING TO STACKED OPTO-ELECTRICAL IC PACKAGES
- Publication number 20160109668
- Publication date Apr 21, 2016
- Cisco Technology, Inc.
- Stefan Martin PFNUER
- G02 - OPTICS
Information Patent Application
MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEM...
- Publication number 20150277068
- Publication date Oct 1, 2015
- Cisco Technology, Inc.
- Kishor DESAI
- G02 - OPTICS
Information Patent Application
INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPER...
- Publication number 20150023377
- Publication date Jan 22, 2015
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY
- Publication number 20150016784
- Publication date Jan 15, 2015
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- G02 - OPTICS
Information Patent Application
ENHANCED LOW INDUCTANCE INTERCONNECTIONS BETWEEN ELECTRONIC AND OPT...
- Publication number 20140294334
- Publication date Oct 2, 2014
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- G02 - OPTICS
Information Patent Application
WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS
- Publication number 20140248723
- Publication date Sep 4, 2014
- Cisco Technology, Inc.
- Kalpendu SHASTRI
- G02 - OPTICS
Information Patent Application
Interposer Configuration With Thermally Isolated Regions For Temper...
- Publication number 20140003457
- Publication date Jan 2, 2014
- Cisco Technology, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Single Mode Fiber Array Connector For Opto-Electronic Transceivers
- Publication number 20130202255
- Publication date Aug 8, 2013
- Cisco Technology, Inc.
- Chris Kiyoshi Togami
- G02 - OPTICS
Information Patent Application
Packaging Platform For Opto-Electronic Assemblies Using Silicon-Bas...
- Publication number 20130188970
- Publication date Jul 25, 2013
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Self-Aligning Connectorized Fiber Array Assembly
- Publication number 20130183008
- Publication date Jul 18, 2013
- Kalpendu Shastri
- B82 - NANO-TECHNOLOGY
Information Patent Application
Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assem...
- Publication number 20130101250
- Publication date Apr 25, 2013
- Kishor Desai
- G02 - OPTICS
Information Patent Application
Wafer Scale Packaging Platform For Transceivers
- Publication number 20120280344
- Publication date Nov 8, 2012
- LIGHTWIRE LLC
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Enhanced Low Inductance Interconnections Between Electronic and Opt...
- Publication number 20120237160
- Publication date Sep 20, 2012
- LIGHTWIRE, INC.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Optical Modulator Utilizing Unary Encoding And Auxiliary Modulator...
- Publication number 20120230626
- Publication date Sep 13, 2012
- LIGHTWIRE, INC.
- Peter C. Metz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HDMI TMDS Optical Signal Transmission Using PAM Technique
- Publication number 20100316388
- Publication date Dec 16, 2010
- Kalpendu Shastri
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical Interconnection Arrangement For High Speed, High Density Co...
- Publication number 20100316391
- Publication date Dec 16, 2010
- Kalpendu Shastri
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical modulator utilizing multi-level signaling
- Publication number 20080095486
- Publication date Apr 24, 2008
- SiOptical, Inc.
- Kalpendu Shastri
- G02 - OPTICS
Information Patent Application
Common electronic dispersion compensation arrangement for use with...
- Publication number 20060245761
- Publication date Nov 2, 2006
- SiOptical, Inc.
- Kalpendu Shastri
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SOI-based optical interconnect arrangement
- Publication number 20060126993
- Publication date Jun 15, 2006
- SiOptical, Inc.
- David Piede
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Person

Patents Grantslast 30 patents

Passively-aligned fiber array to waveguide configuration

User interface module for converting a standard 2D display device i...

High density opto-electronic interconnection configuration utilizin...

Reference-less clock and data recovery circuit

Molded glass lid for wafer level packaging of opto-electronic assem...

Single mode fiber array connector for opto-electronic transceivers

Wafer scale packaging platform for transceivers

Self-aligning optical connector assembly

Enhanced low inductance interconnections between electronic and opt...

Molded glass lid for wafer level packaging of opto-electronic assem...

Interposer configuration with thermally isolated regions for temper...

Optical modulator utilizing unary encoding and auxiliary modulator...

Interposer configuration with thermally isolated regions for temper...

Self-aligning connectorized fiber array assembly

Wafer scale packaging platform for transceivers

Enhanced low inductance interconnections between electronic and opt...

Optical interconnection arrangement for high speed, high density co...

HDMI TMDS optical signal transmission using PAM technique

Common electronic dispersion compensation arrangement for use with...

Optical modulator utilizing multi-level signaling

Integrated approach for design, simulation and verification of mono...

Patents Applicationslast 30 patents

Passively-Aligned Fiber Array To Waveguide Configuration

On-Line Instructional System And 3D Tools For Student-Centered Lear...

Laser Engine Supporting Multiple Laser Sources

Passively-Aligned Fiber Array To Waveguide Configuration

Medical Instrumentation Utilizing Narrowband Imaging

High Density Optical Interconnection Assembly

User Interface Module For Converting A Standard 2D Display Device I...

On-Line Instructional System And 3D Tools For Student-Centered Lear...

Enhanced 2D/3D Mouse For Computer Display Interactions

High Density Opto-Electronic Interconnection Configuration Utilizin...

REFERENCE-LESS CLOCK AND DATA RECOVERY CIRCUIT

DIRECT PRINTED CIRCUIT ROUTING TO STACKED OPTO-ELECTRICAL IC PACKAGES

MOLDED GLASS LID FOR WAFER LEVEL PACKAGING OF OPTO-ELECTRONIC ASSEM...

INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPER...

SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY

ENHANCED LOW INDUCTANCE INTERCONNECTIONS BETWEEN ELECTRONIC AND OPT...

WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS

Interposer Configuration With Thermally Isolated Regions For Temper...

Single Mode Fiber Array Connector For Opto-Electronic Transceivers

Packaging Platform For Opto-Electronic Assemblies Using Silicon-Bas...

Self-Aligning Connectorized Fiber Array Assembly

Molded Glass Lid For Wafer Level Packaging Of Opto-Electronic Assem...

Wafer Scale Packaging Platform For Transceivers

Enhanced Low Inductance Interconnections Between Electronic and Opt...

Optical Modulator Utilizing Unary Encoding And Auxiliary Modulator...

HDMI TMDS Optical Signal Transmission Using PAM Technique

Optical Interconnection Arrangement For High Speed, High Density Co...

Optical modulator utilizing multi-level signaling

Common electronic dispersion compensation arrangement for use with...

SOI-based optical interconnect arrangement