Biswajit SUR

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 12,207,569
- Issue date Jan 21, 2025
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,770,982
- Issue date Sep 26, 2023
- Rigetti & Co, LLC
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microwave integrated quantum circuits with cap wafers and their met...
- Patent number 11,121,301
- Issue date Sep 14, 2021
- Rigetti & Co, Inc.
- Jayss Daniel Marshall
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Adaptive thermal control of electronic devices
- Patent number 9,218,041
- Issue date Dec 22, 2015
- Intel Corporation
- Biswajit Sur
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally downward scalable system
- Patent number 9,176,550
- Issue date Nov 3, 2015
- Intel Corporation
- Biswajit Sur
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
IC package pressure release apparatus and method
- Patent number 7,242,088
- Issue date Jul 10, 2007
- Intel Corporation
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Windowed package for electronic circuitry
- Patent number 7,220,624
- Issue date May 22, 2007
- Intel Corporation
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin polarization mode converters based on liquid crystal mat...
- Patent number 7,174,060
- Issue date Feb 6, 2007
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Grant
Diamond heat spreading and cooling technique for integrated circuits
- Patent number 7,132,313
- Issue date Nov 7, 2006
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly comprising solderable thermal interface and met...
- Patent number 7,091,063
- Issue date Aug 15, 2006
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband arrayed waveguide grating
- Patent number 7,065,273
- Issue date Jun 20, 2006
- Intel Corporation
- Achintya K. Bhowmik
- G02 - OPTICS
Information Patent Grant
High performance thermal interface curing process for organic flip...
- Patent number 6,982,192
- Issue date Jan 3, 2006
- Intel Corporation
- Nagesh Vodrahalli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin polarization mode converters based on liquid crystal mat...
- Patent number 6,928,200
- Issue date Aug 9, 2005
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Grant
Compact optical package with modular optical connector
- Patent number 6,860,642
- Issue date Mar 1, 2005
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Grant
Electronic assembly comprising solderable thermal interface
- Patent number 6,724,078
- Issue date Apr 20, 2004
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond heat spreading and cooling technique for integrated circuits
- Patent number 6,667,548
- Issue date Dec 23, 2003
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADAPTIVE THERMAL CONTROL OF ELECTRONIC DEVICES
- Publication number 20140189404
- Publication date Jul 3, 2014
- Biswajit SUR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMALLY DOWNWARD SCALABLE SYSTEM
- Publication number 20120166842
- Publication date Jun 28, 2012
- Biswajit Sur
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Ultra-thin polarization mode converters based on liquid crystal mat...
- Publication number 20060018585
- Publication date Jan 26, 2006
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Windowed package for electronic circuitry
- Publication number 20050253254
- Publication date Nov 17, 2005
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wideband arrayed waveguide grating
- Publication number 20050047722
- Publication date Mar 3, 2005
- Achintya K. Bhowmik
- G02 - OPTICS
Information Patent Application
Electronic assembly comprising solderable thermal interface and met...
- Publication number 20040155329
- Publication date Aug 12, 2004
- Intel Corporation
- Biswajit Sur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond heat spreading and cooling technique for integrated circuits
- Publication number 20040104014
- Publication date Jun 3, 2004
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin polarization mode converters based on liquid crystal mat...
- Publication number 20040067001
- Publication date Apr 8, 2004
- Intel Corporation
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Compact optical package with modular optical connector
- Publication number 20030174969
- Publication date Sep 18, 2003
- Nagesh K. Vodrahalli
- G02 - OPTICS
Information Patent Application
Diamond heat spreading and cooling technique for integrated circuits
- Publication number 20020145194
- Publication date Oct 10, 2002
- Intel Corporation
- Michael O'Connor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC package pressure release apparatus and method
- Publication number 20020084532
- Publication date Jul 4, 2002
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS

Biswajit SUR

Person

Patents Grantslast 30 patents

Microwave integrated quantum circuits with cap wafers and their met...

Microwave integrated quantum circuits with cap wafers and their met...

Microwave integrated quantum circuits with cap wafers and their met...

Adaptive thermal control of electronic devices

Thermally downward scalable system

IC package pressure release apparatus and method

Windowed package for electronic circuitry

Ultra-thin polarization mode converters based on liquid crystal mat...

Diamond heat spreading and cooling technique for integrated circuits

Electronic assembly comprising solderable thermal interface and met...

Wideband arrayed waveguide grating

High performance thermal interface curing process for organic flip...

Ultra-thin polarization mode converters based on liquid crystal mat...

Compact optical package with modular optical connector

Electronic assembly comprising solderable thermal interface

Diamond heat spreading and cooling technique for integrated circuits

Patents Applicationslast 30 patents

ADAPTIVE THERMAL CONTROL OF ELECTRONIC DEVICES

THERMALLY DOWNWARD SCALABLE SYSTEM

Ultra-thin polarization mode converters based on liquid crystal mat...

Windowed package for electronic circuitry

Wideband arrayed waveguide grating

Electronic assembly comprising solderable thermal interface and met...

Diamond heat spreading and cooling technique for integrated circuits

Ultra-thin polarization mode converters based on liquid crystal mat...

Compact optical package with modular optical connector

Diamond heat spreading and cooling technique for integrated circuits

IC package pressure release apparatus and method