Membership
Tour
Register
Log in
Blake A. Gillett
Follow
Person
Gilbert, AZ, US
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method of making a leadframe for semiconductor devices
Patent number
7,001,799
Issue date
Feb 21, 2006
Amkor Technology, Inc.
Keith M. Edwards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe package for semiconductor devices
Patent number
6,844,615
Issue date
Jan 18, 2005
Amkor Technology, Inc.
Keith M. Edwards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe package for semiconductor devices
Patent number
6,794,740
Issue date
Sep 21, 2004
Amkor Technology, Inc.
Keith M. Edwards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Making two lead surface mounting high power microleadframe semicond...
Patent number
6,756,658
Issue date
Jun 29, 2004
Amkor Technology, Inc.
Blake A. Gillett
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a semiconductor package having exposed metal strap
Patent number
6,723,582
Issue date
Apr 20, 2004
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including metal strap electrically coupled bet...
Patent number
6,707,138
Issue date
Mar 16, 2004
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Exposed copper strap in a semiconductor package
Patent number
6,566,164
Issue date
May 20, 2003
Amkor Technology, Inc.
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging high power integrated circuit devices
Patent number
6,521,982
Issue date
Feb 18, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Attaching semiconductor dies to substrates with conductive straps
Patent number
6,459,147
Issue date
Oct 1, 2002
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of making a semiconductor package having exposed metal strap
Publication number
20030113954
Publication date
Jun 19, 2003
Thomas P. Glenn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging high power integrated circuit devices
Publication number
20030075785
Publication date
Apr 24, 2003
Amkor Technology, Inc.
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Attaching semiconductor dies to substrates with conductive straps
Publication number
20020125562
Publication date
Sep 12, 2002
Sean T. Crowley
H01 - BASIC ELECTRIC ELEMENTS