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Entry |
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Internet Website Article, Electronic Design—Mar. 22, 1999, vol. 47, No. 6- MOSFETs Break Out Of The Shackles Of Wirebonding. |
File Wrapper for Provisional Patent Application No. 60/101810. |
http://www.siliconix.com, “New Package Technology Yields Nearly Twofold Improvement Over Previous State-of-the-Art,” Vishay Siliconix Press Release, Dec. 9, 1998. |