Bob Maraschin

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for material deposition
- Patent number 8,490,573
- Issue date Jul 23, 2013
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating head and method for operating the same
- Patent number 8,419,917
- Issue date Apr 16, 2013
- Lam Research Corporation
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Proximity processing using controlled batch volume with an integrat...
- Patent number 8,221,608
- Issue date Jul 17, 2012
- Lam Research Corporation
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for plating semiconductor wafers
- Patent number 8,048,283
- Issue date Nov 1, 2011
- Lam Research Corporation
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electroless depositing a material on a surface of a wafer
- Patent number 7,875,554
- Issue date Jan 25, 2011
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for plating semiconductor wafers
- Patent number 7,862,693
- Issue date Jan 4, 2011
- Lam Research Corporation
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Proximity processing using controlled batch volume with an integrat...
- Patent number 7,811,423
- Issue date Oct 12, 2010
- Lam Research Corporation
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for plating semiconductor wafers
- Patent number 7,704,367
- Issue date Apr 27, 2010
- Lam Research Corporation
- Yezdi Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for semiconductor wafer electroplanarization
- Patent number 7,648,616
- Issue date Jan 19, 2010
- Lam Research Corporation
- John M. Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for plating semiconductor wafers
- Patent number 7,645,364
- Issue date Jan 12, 2010
- Lam Research Corporation
- Yezdi N. Dordi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for semiconductor wafer planarization
- Patent number 7,582,565
- Issue date Sep 1, 2009
- Lam Research Corporation
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating head and method for operating the same
- Patent number 7,563,348
- Issue date Jul 21, 2009
- Lam Research Corporation
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for semiconductor wafer planarization
- Patent number 7,368,017
- Issue date May 6, 2008
- Lam Research Corporation
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for material deposition in semiconductor fabri...
- Patent number 7,358,186
- Issue date Apr 15, 2008
- Lam Research Corporation
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low contamination high density plasma etch chambers and methods for...
- Patent number 6,583,064
- Issue date Jun 24, 2003
- Lam Research Corporation
- Thomas E. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contamination controlling method and apparatus for a plasma process...
- Patent number 6,464,843
- Issue date Oct 15, 2002
- Lam Research Corporation
- Thomas E. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing equipment having tiled ceramic liner
- Patent number 6,408,786
- Issue date Jun 25, 2002
- Lam Research Corporation
- William S. Kennedy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low contamination high density plasma etch chambers and methods for...
- Patent number 6,394,026
- Issue date May 28, 2002
- Lam Research Corporation
- Thomas E. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for reducing polymer deposition on substrate support
- Patent number 6,306,244
- Issue date Oct 23, 2001
- Lam Research Corporation
- William S. Kennedy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Particle controlling method for a plasma processing chamber
- Patent number 6,251,793
- Issue date Jun 26, 2001
- Lam Research Corporation
- Thomas E. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing equipment having radiant heated ceramic liner
- Patent number 6,227,140
- Issue date May 8, 2001
- Lam Research Corporation
- William S. Kennedy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Load controlled rapid assembly clamp ring
- Patent number 6,200,415
- Issue date Mar 13, 2001
- Lam Research Corporation
- Robert A. Maraschin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for control of deposit build-up on an inner surface of a...
- Patent number 6,155,203
- Issue date Dec 5, 2000
- Lam Research Corporation
- William S. Kennedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low contamination high density plasma etch chambers and methods for...
- Patent number 6,129,808
- Issue date Oct 10, 2000
- Lam Research Corporation
- Thomas E. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for control of deposit build-up on an inner su...
- Patent number 6,035,868
- Issue date Mar 14, 2000
- Lam Research Corporation
- William S. Kennedy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particle controlling method and apparatus for a plasma processing c...
- Patent number 5,993,594
- Issue date Nov 30, 1999
- Lam Research Corporation
- Thomas E. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlling method and apparatus for a plasma processin...
- Patent number 5,863,376
- Issue date Jan 26, 1999
- Lam Research Corporation
- Thomas E. Wicker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic clamp with lip seal for clamping substrates
- Patent number 5,805,408
- Issue date Sep 8, 1998
- Lam Research Corporation
- Robert Maraschin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for delivering liquid reagents to processing vessels
- Patent number 5,098,741
- Issue date Mar 24, 1992
- Lam Research Corporation
- Alan D. Nolet
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Material Deposition
- Publication number 20110081779
- Publication date Apr 7, 2011
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...
- Publication number 20110017605
- Publication date Jan 27, 2011
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and Apparatus for Plating Semiconductor Wafers
- Publication number 20100170803
- Publication date Jul 8, 2010
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus for Plating Semiconductor Wafers
- Publication number 20090321250
- Publication date Dec 31, 2009
- Lam Research Corp.
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating Head and Method for Operating the Same
- Publication number 20090242413
- Publication date Oct 1, 2009
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...
- Publication number 20080296166
- Publication date Dec 4, 2008
- Lam Research Corporation
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for plating semiconductor wafers
- Publication number 20080271992
- Publication date Nov 6, 2008
- Lam Research Corp.
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and Apparatus for Semiconductor Wafer Planarization
- Publication number 20080166885
- Publication date Jul 10, 2008
- LAM RESEARCH CORPORATION
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Material Deposition
- Publication number 20080153291
- Publication date Jun 26, 2008
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroplating head and method for operating the same
- Publication number 20050284748
- Publication date Dec 29, 2005
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for plating semiconductor wafers
- Publication number 20050284767
- Publication date Dec 29, 2005
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for semiconductor wafer planarization
- Publication number 20050126932
- Publication date Jun 16, 2005
- LAM RESEARCH CORPORATION
- Fred C. Redeker
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for material deposition
- Publication number 20050130415
- Publication date Jun 16, 2005
- LAM RESEARCH CORPORATION
- Yezdi Dordi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low contamination high density plasma etch chambers and methods for...
- Publication number 20020102858
- Publication date Aug 1, 2002
- Thomas E. Wicker
- H01 - BASIC ELECTRIC ELEMENTS

Bob Maraschin

Person

Patents Grantslast 30 patents

Method and apparatus for material deposition

Electroplating head and method for operating the same

Proximity processing using controlled batch volume with an integrat...

Method and apparatus for plating semiconductor wafers

Method for electroless depositing a material on a surface of a wafer

Apparatus for plating semiconductor wafers

Proximity processing using controlled batch volume with an integrat...

Method and apparatus for plating semiconductor wafers

Apparatus and method for semiconductor wafer electroplanarization

Apparatus and method for plating semiconductor wafers

Method and apparatus for semiconductor wafer planarization

Electroplating head and method for operating the same

Method and apparatus for semiconductor wafer planarization

Method and apparatus for material deposition in semiconductor fabri...

Low contamination high density plasma etch chambers and methods for...

Contamination controlling method and apparatus for a plasma process...

Semiconductor processing equipment having tiled ceramic liner

Low contamination high density plasma etch chambers and methods for...

Apparatus for reducing polymer deposition on substrate support

Particle controlling method for a plasma processing chamber

Semiconductor processing equipment having radiant heated ceramic liner

Load controlled rapid assembly clamp ring

Apparatus for control of deposit build-up on an inner surface of a...

Low contamination high density plasma etch chambers and methods for...

Method and apparatus for control of deposit build-up on an inner su...

Particle controlling method and apparatus for a plasma processing c...

Temperature controlling method and apparatus for a plasma processin...

Electrostatic clamp with lip seal for clamping substrates

Method and system for delivering liquid reagents to processing vessels

Patents Applicationslast 30 patents

Method and Apparatus for Material Deposition

PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...

Method and Apparatus for Plating Semiconductor Wafers

Apparatus for Plating Semiconductor Wafers

Electroplating Head and Method for Operating the Same

PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...

Apparatus and method for plating semiconductor wafers

Method and Apparatus for Semiconductor Wafer Planarization

Method and Apparatus for Material Deposition

Electroplating head and method for operating the same

Method and apparatus for plating semiconductor wafers

Method and apparatus for semiconductor wafer planarization

Method and apparatus for material deposition

Low contamination high density plasma etch chambers and methods for...