Bob Shih-Wei Kuo

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Top port MEMS package and method
- Patent number 10,327,076
- Issue date Jun 18, 2019
- Amkor Technology, Inc.
- Ahmer Raza Syed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 9,776,855
- Issue date Oct 3, 2017
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with MEMS die, magnet, and window substrate fabricatio...
- Patent number 9,758,372
- Issue date Sep 12, 2017
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidics sensor package fabrication method and structure
- Patent number 9,670,445
- Issue date Jun 6, 2017
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Top port MEMS microphone package and method
- Patent number 9,420,378
- Issue date Aug 16, 2016
- Amkor Technology, Inc.
- Ahmer Raza Syed
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 9,359,191
- Issue date Jun 7, 2016
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal mesh lid MEMS package and method
- Patent number 9,162,871
- Issue date Oct 20, 2015
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked and staggered die MEMS package and method
- Patent number 9,013,011
- Issue date Apr 21, 2015
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible top/bottom MEMS package
- Patent number 8,981,537
- Issue date Mar 17, 2015
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Frame interconnect for concentrated photovoltaic module
- Patent number 8,866,004
- Issue date Oct 21, 2014
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Molded light guide for concentrated photovoltaic receiver module
- Patent number 8,809,677
- Issue date Aug 19, 2014
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Leadframe structure for concentrated photovoltaic receiver package
- Patent number 8,680,656
- Issue date Mar 25, 2014
- Amkor Technology, Inc.
- Bob Shih Wei Kuo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Blind via capture pad structure fabrication method
- Patent number 8,671,565
- Issue date Mar 18, 2014
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive paste and mold for electrical connection of photovoltaic...
- Patent number 8,552,517
- Issue date Oct 8, 2013
- Amkor Technology, Inc.
- Giuseppe Selli
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Metal mesh lid MEMS package and method
- Patent number 8,536,663
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting diode (LED) package and method
- Patent number 8,535,961
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymer lid for a sensor package and method therefor
- Patent number 8,354,747
- Issue date Jan 15, 2013
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Reversible Top/Bottom MEMS Package
- Publication number 20160355395
- Publication date Dec 8, 2016
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REVERSIBLE TOP/BOTTOM MEMS PACKAGE
- Publication number 20150191346
- Publication date Jul 9, 2015
- Amkor Technology, Inc.
- David Bolognia
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Bob Shih-Wei Kuo

Person

Patents Grantslast 30 patents

Top port MEMS package and method

Reversible top/bottom MEMS package

MEMS package with MEMS die, magnet, and window substrate fabricatio...

Microfluidics sensor package fabrication method and structure

Top port MEMS microphone package and method

Reversible top/bottom MEMS package

Metal mesh lid MEMS package and method

Stacked and staggered die MEMS package and method

Reversible top/bottom MEMS package

Frame interconnect for concentrated photovoltaic module

Molded light guide for concentrated photovoltaic receiver module

Leadframe structure for concentrated photovoltaic receiver package

Blind via capture pad structure fabrication method

Conductive paste and mold for electrical connection of photovoltaic...

Metal mesh lid MEMS package and method

Light emitting diode (LED) package and method

Conductive polymer lid for a sensor package and method therefor

Patents Applicationslast 30 patents

Reversible Top/Bottom MEMS Package

REVERSIBLE TOP/BOTTOM MEMS PACKAGE