Bomy A. Chen

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 12,205,910
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interposers bonded to each other
- Patent number 12,040,282
- Issue date Jul 16, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package module including a bonding system
- Patent number 11,935,824
- Issue date Mar 19, 2024
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor cells and related systems and methods
- Patent number 11,764,796
- Issue date Sep 19, 2023
- Microchip Technology Incorporated
- Robert Lutwak
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit (IC) package with integrated inductor having cor...
- Patent number 11,723,222
- Issue date Aug 8, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 11,682,641
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 11,682,642
- Issue date Jun 20, 2023
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed-orientation multi-die integrated circuit package with at leas...
- Patent number 11,043,471
- Issue date Jun 22, 2021
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device including a force mitigation system...
- Patent number 10,896,888
- Issue date Jan 19, 2021
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory cell adapted for low voltage and/or non-volatile perfo...
- Patent number 10,861,550
- Issue date Dec 8, 2020
- Microchip Technology Incorporated
- Sonu Daryanani
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-volatile flash memory cell
- Patent number 10,700,171
- Issue date Jun 30, 2020
- Microchip Technology Incorporated
- Sonu Daryanani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with oxide cap and spacer layer for protecting a floati...
- Patent number 10,546,947
- Issue date Jan 28, 2020
- Microchip Technology Incorporated
- Mel Hymas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial alignment ring and self-soldering vias for wafer bonding
- Patent number 10,381,330
- Issue date Aug 13, 2019
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall-type memory cell
- Patent number 10,056,545
- Issue date Aug 21, 2018
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage double-diffused MOS (DMOS) device and method of manufa...
- Patent number 9,786,779
- Issue date Oct 10, 2017
- Microchip Technology Incorporated
- Bomy Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
High voltage double-diffused MOS (DMOS) device and method of manufa...
- Patent number 9,601,615
- Issue date Mar 21, 2017
- Microchip Technology Incorporated
- Bomy Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
EEPROM memory cell with low voltage read path and high voltage eras...
- Patent number 9,455,037
- Issue date Sep 27, 2016
- Microchip Technology Incorporated
- Kent Hewitt
- G11 - INFORMATION STORAGE
Information Patent Grant
Sidewall type memory cell
- Patent number 9,444,040
- Issue date Sep 13, 2016
- Microchip Technology Incorporated
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage double-diffused MOS (DMOS) device and method of manufa...
- Patent number 9,306,055
- Issue date Apr 5, 2016
- Microchip Technology Incorporated
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 8,846,538
- Issue date Sep 30, 2014
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 8,258,065
- Issue date Sep 4, 2012
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of contactless non-volatile memory cells
- Patent number 7,800,159
- Issue date Sep 21, 2010
- Silicon Storage Technology, Inc.
- Yuniarto Widjaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of trimming semiconductor elements with electrical resistanc...
- Patent number 7,790,518
- Issue date Sep 7, 2010
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making phase change memory device employing thermally ins...
- Patent number 7,763,492
- Issue date Jul 27, 2010
- Silicon Storage Technology, Inc.
- Bomy Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Storage element for controlling a logic circuit, and a logic device...
- Patent number 7,701,248
- Issue date Apr 20, 2010
- Silicon Storage Technology, Inc.
- Kai Man Yue
- G11 - INFORMATION STORAGE
Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 7,605,092
- Issue date Oct 20, 2009
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NOR flash memory
- Patent number 7,598,561
- Issue date Oct 6, 2009
- Silicon Storage Technolgy, Inc.
- Bomy Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-planar non-volatile memory cell with an erase gate, an array th...
- Patent number 7,547,603
- Issue date Jun 16, 2009
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bidirectional nonvolatile memory cell having charge trapping layer...
- Patent number 7,470,949
- Issue date Dec 30, 2008
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for shielding a wafer from charged particles d...
- Patent number 7,438,822
- Issue date Oct 21, 2008
- International Business Machines Corporation
- Hongwen Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER WITH LINES HAVING PORTIONS SEPARATED BY BARRIER LAYERS
- Publication number 20240321760
- Publication date Sep 26, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Steve Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A PATTERNED FD-SOI WAFER
- Publication number 20240170325
- Publication date May 23, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Steve Nagel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CELLS AND RELATED SYSTEMS AND METHODS
- Publication number 20230421163
- Publication date Dec 28, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Robert Lutwak
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CELLS AND RELATED SYSTEMS AND METHODS
- Publication number 20230143437
- Publication date May 11, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Robert Lutwak
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSERS BONDED TO EACH OTHER
- Publication number 20230109629
- Publication date Apr 6, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM
- Publication number 20230099856
- Publication date Mar 30, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH HEAT TRANSFER CHIMNEY INCLUDING THE...
- Publication number 20230055102
- Publication date Feb 23, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE
- Publication number 20220052001
- Publication date Feb 17, 2022
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTERCONNECT FOR INTEGRATED CIRCUIT PACKAGE INTERPOSER
- Publication number 20210335627
- Publication date Oct 28, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH INTEGRATED INDUCTOR HAVING COR...
- Publication number 20210036059
- Publication date Feb 4, 2021
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Device Including A Force Mitigation System...
- Publication number 20200411462
- Publication date Dec 31, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY CELL ADAPTED FOR LOW VOLTAGE AND/OR NON-VOLATILE PERFO...
- Publication number 20200388334
- Publication date Dec 10, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Sonu Daryanani
- G11 - INFORMATION STORAGE
Information Patent Application
MIXED-ORIENTATION MULTI-DIE INTEGRATED CIRCUIT PACKAGE WITH AT LEAS...
- Publication number 20200357767
- Publication date Nov 12, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE INCLUDING A FORCE MITIGATION SYSTEM...
- Publication number 20190287936
- Publication date Sep 19, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Damascene Process for Forming Vias and Interconnects in an Int...
- Publication number 20190096751
- Publication date Mar 28, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Cell With Oxide Cap And Spacer Layer For Protecting A Floati...
- Publication number 20190097027
- Publication date Mar 28, 2019
- MICROCHIP TECHNOLOGY INCORPORATED
- Mel Hymas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall-Type Memory Cell
- Publication number 20180294407
- Publication date Oct 11, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding
- Publication number 20180286836
- Publication date Oct 4, 2018
- Silicon Storage Technology, Inc.
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-Volatile Flash Memory Cell
- Publication number 20180233371
- Publication date Aug 16, 2018
- MICROCHIP TECHNOLOGY INCORPORATED
- Sonu Daryanani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall-Type Memory Cell
- Publication number 20160380192
- Publication date Dec 29, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DOUBLE-DIFFUSED MOS (DMOS) DEVICE AND METHOD OF MANUFA...
- Publication number 20160099348
- Publication date Apr 7, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Bomy Chen
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH VOLTAGE DOUBLE-DIFFUSED MOS (DMOS) DEVICE AND METHOD OF MANUFA...
- Publication number 20160093632
- Publication date Mar 31, 2016
- MICROCHIP TECHNOLOGY INCORPORATED
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Double-Diffused MOS (DMOS) Device and Method of Manufa...
- Publication number 20150200198
- Publication date Jul 16, 2015
- MICROCHIP TECHNOLOGY INCORPORATED
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-volatile Memory Cell With Self Aligned Floating And Erase Gates...
- Publication number 20150179749
- Publication date Jun 25, 2015
- Silicon Storage Technology, Inc.
- Bomy Chen
- G11 - INFORMATION STORAGE
Information Patent Application
Resistive Memory Cell with Reduced Bottom Electrode
- Publication number 20140264247
- Publication date Sep 18, 2014
- Sonu Daryanani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EEPROM MEMORY CELL WITH LOW VOLTAGE READ PATH AND HIGH VOLTAGE ERAS...
- Publication number 20140269102
- Publication date Sep 18, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Kent Hewitt
- G11 - INFORMATION STORAGE
Information Patent Application
Sidewall-Type Memory Cell
- Publication number 20140264248
- Publication date Sep 18, 2014
- Justin Hiroki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self Limiting Method For Programming A Non-volatile Memory Cell To...
- Publication number 20100259979
- Publication date Oct 14, 2010
- James Yingbo Jia
- G11 - INFORMATION STORAGE
Information Patent Application
PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...
- Publication number 20100173468
- Publication date Jul 8, 2010
- Bomy CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Bomy A. Chen

Person

Patents Grantslast 30 patents

Integrated circuit bond pad with multi-material toothed structure

Electronic device including interposers bonded to each other

Integrated circuit package module including a bonding system

Vapor cells and related systems and methods

Integrated circuit (IC) package with integrated inductor having cor...

Integrated circuit bond pad with multi-material toothed structure

Integrated circuit (IC) device including a force mitigation system...

Mixed-orientation multi-die integrated circuit package with at leas...

Integrated circuit (IC) device including a force mitigation system...

Flash memory cell adapted for low voltage and/or non-volatile perfo...

Non-volatile flash memory cell

Memory cell with oxide cap and spacer layer for protecting a floati...

Sacrificial alignment ring and self-soldering vias for wafer bonding

Sidewall-type memory cell

High voltage double-diffused MOS (DMOS) device and method of manufa...

High voltage double-diffused MOS (DMOS) device and method of manufa...

EEPROM memory cell with low voltage read path and high voltage eras...

Sidewall type memory cell

High voltage double-diffused MOS (DMOS) device and method of manufa...

Passive elements, articles, packages, semiconductor composites, and...

Passive elements, articles, packages, semiconductor composites, and...

Array of contactless non-volatile memory cells

Method of trimming semiconductor elements with electrical resistanc...

Method of making phase change memory device employing thermally ins...

Storage element for controlling a logic circuit, and a logic device...

Passive elements, articles, packages, semiconductor composites, and...

NOR flash memory

Non-planar non-volatile memory cell with an erase gate, an array th...

Bidirectional nonvolatile memory cell having charge trapping layer...

Apparatus and method for shielding a wafer from charged particles d...

Patents Applicationslast 30 patents

INTERPOSER WITH LINES HAVING PORTIONS SEPARATED BY BARRIER LAYERS

METHOD FOR FABRICATING A PATTERNED FD-SOI WAFER

VAPOR CELLS AND RELATED SYSTEMS AND METHODS

INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...

VAPOR CELLS AND RELATED SYSTEMS AND METHODS

ELECTRONIC DEVICE INCLUDING INTERPOSERS BONDED TO EACH OTHER

INTEGRATED CIRCUIT PACKAGE MODULE INCLUDING A BONDING SYSTEM

INTEGRATED CIRCUIT PACKAGE WITH HEAT TRANSFER CHIMNEY INCLUDING THE...

INTEGRATED CIRCUIT BOND PAD WITH MULTI-MATERIAL TOOTHED STRUCTURE

BACKSIDE INTERCONNECT FOR INTEGRATED CIRCUIT PACKAGE INTERPOSER

INTEGRATED CIRCUIT (IC) PACKAGE WITH INTEGRATED INDUCTOR HAVING COR...

Integrated Circuit (IC) Device Including A Force Mitigation System...

FLASH MEMORY CELL ADAPTED FOR LOW VOLTAGE AND/OR NON-VOLATILE PERFO...

MIXED-ORIENTATION MULTI-DIE INTEGRATED CIRCUIT PACKAGE WITH AT LEAS...

INTEGRATED CIRCUIT (IC) DEVICE INCLUDING A FORCE MITIGATION SYSTEM...

Dual Damascene Process for Forming Vias and Interconnects in an Int...

Memory Cell With Oxide Cap And Spacer Layer For Protecting A Floati...

Sidewall-Type Memory Cell

Sacrificial Alignment Ring And Self-Soldering Vias For Wafer Bonding

Non-Volatile Flash Memory Cell

Sidewall-Type Memory Cell

HIGH VOLTAGE DOUBLE-DIFFUSED MOS (DMOS) DEVICE AND METHOD OF MANUFA...

HIGH VOLTAGE DOUBLE-DIFFUSED MOS (DMOS) DEVICE AND METHOD OF MANUFA...

High Voltage Double-Diffused MOS (DMOS) Device and Method of Manufa...

Non-volatile Memory Cell With Self Aligned Floating And Erase Gates...

Resistive Memory Cell with Reduced Bottom Electrode

EEPROM MEMORY CELL WITH LOW VOLTAGE READ PATH AND HIGH VOLTAGE ERAS...

Sidewall-Type Memory Cell

Self Limiting Method For Programming A Non-volatile Memory Cell To...

PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...