TREA

Boon Keng Lok

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  • Singapore, SG
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Patents Grantslast 30 patents

  • Information Patent Grant

    Interconnect structure and a method of fabricating the same
    • Patent number 8,462,516
    • Issue date Jun 11, 2013
    • Agency for Science Technology and Research
    • Chee Khuen Stephen Wong
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Method of forming a circuit board
    • Patent number 7,748,115
    • Issue date Jul 6, 2010
    • The Agency for Science, Technology and Research
    • Sunappan Vasudivan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Embedded capacitor structure
    • Patent number 7,548,432
    • Issue date Jun 16, 2009
    • Agency for Science, Technology and Research
    • Chee Wai Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit board
    • Patent number 7,359,213
    • Issue date Apr 15, 2008
    • The Agency for Science, Technology and Research
    • Sunappan Vasudivan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED LIGHT EMITTING DEVICES AND METHOD FOR FABRICATION THEROF
    • Publication number 20130168706
    • Publication date Jul 4, 2013
    • Agency for Science, Technology and Research
    • Budiman Salam
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE STRUCTURE AND METHOD FOR WIDEBAND POWER DECOUPLING
    • Publication number 20090148962
    • Publication date Jun 11, 2009
    • Agency for Science, Technology and Research
    • Chee Wai Albert Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20080000676
    • Publication date Jan 3, 2008
    • Agency for Science, Technology and Research
    • SUNAPPAN VASUDIVAN
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Substrate structure and method for wideband power decoupling
    • Publication number 20070054420
    • Publication date Mar 8, 2007
    • Agency For Science, Technology and Research
    • Chee Wai Albert Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Embedded capacitor structure
    • Publication number 20060215380
    • Publication date Sep 28, 2006
    • Agency For Science, Technology and Research
    • Chee Wai Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Circuit board
    • Publication number 20060007662
    • Publication date Jan 12, 2006
    • Sunappan Vasudivan
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...