Boon Ping Koh

Person

Seberang Jaya, MY

People

Patents Grantslast 30 patents

Information Patent Grant
RFI free picture frame metal stiffener
- Patent number 11,658,127
- Issue date May 23, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
- Patent number 11,652,057
- Issue date May 16, 2023
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slot antenna on a printed circuit board (PCB)
- Patent number 11,552,403
- Issue date Jan 10, 2023
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating-bridge interconnects and methods of assembling same
- Patent number 11,393,760
- Issue date Jul 19, 2022
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rod-based substrate with ringed interconnect layers
- Patent number 11,239,126
- Issue date Feb 1, 2022
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slot antenna on a printed circuit board (PCB)
- Patent number 11,211,714
- Issue date Dec 28, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit EMI enclosure
- Patent number 11,178,768
- Issue date Nov 16, 2021
- Intel Corporation
- Khang Choong Yong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems in packages including wide-band phased-array antennas and m...
- Patent number 10,978,434
- Issue date Apr 13, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded folded circuit board
- Patent number 10,939,540
- Issue date Mar 2, 2021
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Floating-bridge interconnects and methods of assembling same
- Patent number 10,796,999
- Issue date Oct 6, 2020
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems in packages including wide-band phased-array antennas and m...
- Patent number 10,580,761
- Issue date Mar 3, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for adaptive common mode noise decomposition a...
- Patent number 10,396,834
- Issue date Aug 27, 2019
- Intel Corporation
- Khang Choong Yong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible integrated circuit that includes an antenna
- Patent number 10,334,736
- Issue date Jun 25, 2019
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stranded transmission line and uses thereof
- Patent number 10,256,519
- Issue date Apr 9, 2019
- Wil Choon Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package electromagnetic shield
- Patent number 9,836,095
- Issue date Dec 5, 2017
- Intel Corporation
- Min Suet Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible integrated circuit that includes an antenna
- Patent number 9,839,134
- Issue date Dec 5, 2017
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for adaptive common mode noise decomposition a...
- Patent number 9,455,752
- Issue date Sep 27, 2016
- Intel Corporation
- Khang Choong Yong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
RIBBON SHIELD DEVICE AND METHOD
- Publication number 20230317680
- Publication date Oct 5, 2023
- Intel Corporation
- Prabhat Ranjan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD ARRANGEMENT
- Publication number 20230123645
- Publication date Apr 20, 2023
- Intel Corporation
- Tin Poay CHUAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL SIGNAL SKEW COMPENSATION TECHNIQUE FOR RFI MITIGATION...
- Publication number 20230074049
- Publication date Mar 9, 2023
- Intel Corporation
- Yingern HO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LOW-COST SURFACE MOUNT EMI GASKETS
- Publication number 20230016486
- Publication date Jan 19, 2023
- Intel Corporation
- Dong-Ho Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO COOL ELECTRONIC DEVICES
- Publication number 20220322567
- Publication date Oct 6, 2022
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIATION SHIELD WITH RADIATION SHIELD GAP
- Publication number 20220110229
- Publication date Apr 7, 2022
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)
- Publication number 20220052458
- Publication date Feb 17, 2022
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION SHIELD WITH ZIPPER
- Publication number 20220015272
- Publication date Jan 13, 2022
- Intel Corporation
- Yew San Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION SHIELD AND GROOVE IN SUPPORT STRUCTURE
- Publication number 20210410341
- Publication date Dec 30, 2021
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS
- Publication number 20210074598
- Publication date Mar 11, 2021
- Intel Corporation
- Florence Su Sin Phun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
- Publication number 20200411438
- Publication date Dec 31, 2020
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFI FREE PICTURE FRAME METAL STIFFENER
- Publication number 20200411448
- Publication date Dec 31, 2020
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED DIE INTERCONNECTION WITH ON-SILICON CAVITY BRIDGE
- Publication number 20200357744
- Publication date Nov 12, 2020
- Intel Corporation
- Khang Choong YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...
- Publication number 20200168592
- Publication date May 28, 2020
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)
- Publication number 20190348766
- Publication date Nov 14, 2019
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME
- Publication number 20190304914
- Publication date Oct 3, 2019
- Intel Corporation
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED FOLDED CIRCUIT BOARD
- Publication number 20190261504
- Publication date Aug 22, 2019
- Intel Corporation
- Tin Poay Chuah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ON-PACKAGE INTEGRATED STIFFENER ANTENNA
- Publication number 20190221529
- Publication date Jul 18, 2019
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...
- Publication number 20190181126
- Publication date Jun 13, 2019
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEI...
- Publication number 20190103357
- Publication date Apr 4, 2019
- Intel Corporation
- Min Suet Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUES FOR AN EXTENDABLE PERIPHERAL PORT
- Publication number 20180189217
- Publication date Jul 5, 2018
- Intel Corporation
- PUJITHA DAVULURI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRANDED TRANSMISSION LINE AND USES THEREOF
- Publication number 20180192509
- Publication date Jul 5, 2018
- Wil Choon Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FOR WEARABLE DEVICE
- Publication number 20180088627
- Publication date Mar 29, 2018
- Bok Eng Cheah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE INTEGRATED CIRCUIT THAT INCLUDES AN ANTENNA
- Publication number 20180049326
- Publication date Feb 15, 2018
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT EMI ENCLOSURE
- Publication number 20170290154
- Publication date Oct 5, 2017
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTEGRATED CIRCUIT THAT INCLUDES AN ANTENNA
- Publication number 20170181289
- Publication date Jun 22, 2017
- Boon Ping Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ADAPTIVE COMMON MODE NOISE DECOMPOSITION A...
- Publication number 20170077969
- Publication date Mar 16, 2017
- Intel Corporation
- Kang Choong YONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING
- Publication number 20160380386
- Publication date Dec 29, 2016
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING
- Publication number 20160211619
- Publication date Jul 21, 2016
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ADAPTIVE COMMON MODE NOISE DECOMPOSITION A...
- Publication number 20160080007
- Publication date Mar 17, 2016
- Intel Corporation
- KHANG CHOONG YONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Boon Ping Koh

Person

Patents Grantslast 30 patents

RFI free picture frame metal stiffener

Disaggregated die interconnection with on-silicon cavity bridge

Slot antenna on a printed circuit board (PCB)

Floating-bridge interconnects and methods of assembling same

Rod-based substrate with ringed interconnect layers

Slot antenna on a printed circuit board (PCB)

Flexible printed circuit EMI enclosure

Systems in packages including wide-band phased-array antennas and m...

Shielded folded circuit board

Floating-bridge interconnects and methods of assembling same

Systems in packages including wide-band phased-array antennas and m...

Apparatus and method for adaptive common mode noise decomposition a...

Flexible integrated circuit that includes an antenna

Stranded transmission line and uses thereof

Microelectronic device package electromagnetic shield

Flexible integrated circuit that includes an antenna

Apparatus and method for adaptive common mode noise decomposition a...

Patents Applicationslast 30 patents

RIBBON SHIELD DEVICE AND METHOD

FLEXIBLE PRINTED CIRCUIT BOARD ARRANGEMENT

DIFFERENTIAL SIGNAL SKEW COMPENSATION TECHNIQUE FOR RFI MITIGATION...

LOW-COST SURFACE MOUNT EMI GASKETS

METHODS AND APPARATUS TO COOL ELECTRONIC DEVICES

RADIATION SHIELD WITH RADIATION SHIELD GAP

SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)

RADIATION SHIELD WITH ZIPPER

RADIATION SHIELD AND GROOVE IN SUPPORT STRUCTURE

ROD-BASED SUBSTRATE WITH RINGED INTERCONNECT LAYERS

FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME

RFI FREE PICTURE FRAME METAL STIFFENER

DISAGGREGATED DIE INTERCONNECTION WITH ON-SILICON CAVITY BRIDGE

SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...

SLOT ANTENNA ON A PRINTED CIRCUIT BOARD (PCB)

FLOATING-BRIDGE INTERCONNECTS AND METHODS OF ASSEMBLING SAME

SHIELDED FOLDED CIRCUIT BOARD

ON-PACKAGE INTEGRATED STIFFENER ANTENNA

SYSTEMS IN PACKAGES INCLUDING WIDE-BAND PHASED-ARRAY ANTENNAS AND M...

METHODS OF FORMING PACKAGE ON PACKAGE ASSEMBLIES WITH REDUCED Z HEI...

TECHNIQUES FOR AN EXTENDABLE PERIPHERAL PORT

STRANDED TRANSMISSION LINE AND USES THEREOF

INTERCONNECTS FOR WEARABLE DEVICE

FLEXIBLE INTEGRATED CIRCUIT THAT INCLUDES AN ANTENNA

FLEXIBLE PRINTED CIRCUIT EMI ENCLOSURE

FLEXIBLE INTEGRATED CIRCUIT THAT INCLUDES AN ANTENNA

APPARATUS AND METHOD FOR ADAPTIVE COMMON MODE NOISE DECOMPOSITION A...

ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING

ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING

APPARATUS AND METHOD FOR ADAPTIVE COMMON MODE NOISE DECOMPOSITION A...