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Bor-Jou WEI
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Jiaoxi Township, TW
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Patents Grants
last 30 patents
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Patent Grant
Method and structure for dissipating heat away from a resistor havi...
Patent number
8,848,374
Issue date
Sep 30, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Jian-Hong Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Metal Capping Layer for Interconnect Applications
Publication number
20140264872
Publication date
Sep 18, 2014
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD AND STRUCTURE FOR DISSIPATING HEAT AWAY FROM A RESISTOR HAVI...
Publication number
20120002375
Publication date
Jan 5, 2012
Taiwan Semiconductor Manufacturing Company, Ltd.
Jian-Hong LIN
H01 - BASIC ELECTRIC ELEMENTS