Bor-Jou WEI

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Jiaoxi Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method and structure for dissipating heat away from a resistor havi...
- Patent number 8,848,374
- Issue date Sep 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Metal Capping Layer for Interconnect Applications
- Publication number 20140264872
- Publication date Sep 18, 2014
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DISSIPATING HEAT AWAY FROM A RESISTOR HAVI...
- Publication number 20120002375
- Publication date Jan 5, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS