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Brian E. Curcio
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San Diego, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Electrostatic ink compositions, methods and print substrates
Patent number
9,798,259
Issue date
Oct 24, 2017
Hewlett-Packard Development Company, L.P.
Alexey S. Kabalnov
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Inkjet pen/printhead with shipping fluid
Patent number
8,596,746
Issue date
Dec 3, 2013
Hewlett-Packard Development Company, L.P.
Brian E. Curcio
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Method for improving gloss of a print
Patent number
8,474,934
Issue date
Jul 2, 2013
Hewlett-Packard Development Company, L.P.
Brian E. Curcio
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Method of printing images
Patent number
8,356,878
Issue date
Jan 22, 2013
Hewlett-Packard Development Company, L.P.
Kai-Kong Iu
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Methods, apparatus and articles of manufacture to control gloss qua...
Patent number
8,267,498
Issue date
Sep 18, 2012
Hewlett-Packard Development Company, L.P.
Dustin W. Blair
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Purging fluid from fluid-ejection nozzles by performing spit-wipe o...
Patent number
7,914,110
Issue date
Mar 29, 2011
Hewlett-Packard Development Company, L.P.
Brian E. Curcio
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Method and structure for producing Z-axis interconnection assembly...
Patent number
7,402,254
Issue date
Jul 22, 2008
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing Z-axis interconnection assembly of printed wir...
Patent number
7,303,639
Issue date
Dec 4, 2007
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solid via layer to layer interconnect
Patent number
7,076,869
Issue date
Jul 18, 2006
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for producing Z-axis interconnection assembly...
Patent number
6,969,436
Issue date
Nov 29, 2005
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for small pitch z-axis electrical interconnect...
Patent number
6,955,849
Issue date
Oct 18, 2005
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for small pitch z-axis electrical interconnect...
Patent number
6,790,305
Issue date
Sep 14, 2004
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process of removing holefill residue from a metallic surface of an...
Patent number
6,776,852
Issue date
Aug 17, 2004
International Business Machines Corporation
Christina M. Boyko
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for producing Z-axis interconnection assembly...
Patent number
6,645,607
Issue date
Nov 11, 2003
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for producing Z-axis interconnection assembly...
Patent number
6,638,607
Issue date
Oct 28, 2003
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of forming metallic z-interconnects for laminate chip packag...
Patent number
6,634,543
Issue date
Oct 21, 2003
International Business Machines Corporation
Brian E. Curcio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for filling high aspect ratio via holes in electronic substr...
Patent number
6,581,280
Issue date
Jun 24, 2003
International Business Machines Corporation
Brian Eugene Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Structure for high speed printed wiring boards with multiple differ...
Patent number
6,570,102
Issue date
May 27, 2003
International Business Machines Corporation
Thomas Richard Miller
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solid via layer to layer interconnect
Patent number
6,504,111
Issue date
Jan 7, 2003
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and structure for producing Z-axis interconnection assembly...
Patent number
6,465,084
Issue date
Oct 15, 2002
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for filling high aspect ratio via holes in electronic substr...
Patent number
6,452,117
Issue date
Sep 17, 2002
International Business Machines Corporation
Brian Eugene Curcio
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTROSTATIC INK COMPOSITIONS, METHODS AND PRINT SUBSTRATES
Publication number
20150323879
Publication date
Nov 12, 2015
Hewlett-Packard Development Company, L.P.
Alexey S. Kabalnov
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
METHOD OF PRINTING IMAGES
Publication number
20120293574
Publication date
Nov 22, 2012
Kai-Kong Iu
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
INKJET PEN/PRINTHEAD WITH SHIPPING FLUID
Publication number
20110310181
Publication date
Dec 22, 2011
Hewlett-Packard Development Company, L.P.
Brian E. Curcio
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Purging fluid from fluid-ejection nozzles by performing spit-wipe o...
Publication number
20090073219
Publication date
Mar 19, 2009
Brian E. Curcio
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
Method for producing Z-axis interconnection assembly of printed wir...
Publication number
20050280136
Publication date
Dec 22, 2005
International Business Machines Corporation
Brian E. Curcio
B32 - LAYERED PRODUCTS
Information
Patent Application
Method and structure for small pitch z-axis electrical interconnect...
Publication number
20050008833
Publication date
Jan 13, 2005
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and structure for producing Z-axis interconnection assembly...
Publication number
20040084137
Publication date
May 6, 2004
International Business Machines Corporation
Brian E. Curcio
B32 - LAYERED PRODUCTS
Information
Patent Application
Method and structure for small pitch z-axis electrical interconnect...
Publication number
20040067347
Publication date
Apr 8, 2004
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and structure for producing Z-axis interconnection assembly...
Publication number
20040052945
Publication date
Mar 18, 2004
International Business Machines Corporation
Brian E. Curcio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Process of removing holefill residue from a metallic surface of an...
Publication number
20030131870
Publication date
Jul 17, 2003
Christina M. Boyko
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of forming metallic z-interconnects for laminate chip packag...
Publication number
20030127495
Publication date
Jul 10, 2003
International Business Machines Corporation
Brian E. Curcio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of joining laminates for z-axis interconnection
Publication number
20030041966
Publication date
Mar 6, 2003
International Business Machines Corporation
Jon A. Casey
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Solid via layer to layer interconnect
Publication number
20030035272
Publication date
Feb 20, 2003
Brian E. Curcio
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Method and structure for producing Z-axis interconnection assembly...
Publication number
20020192444
Publication date
Dec 19, 2002
International Business Machines Corporation
Brian E. Curcio
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
SOLID VIA LAYER TO LAYER INTERCONNECT
Publication number
20020179334
Publication date
Dec 5, 2002
Brian E. Curcio
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Method for filling high aspect ratio via holes in electronic substr...
Publication number
20020179335
Publication date
Dec 5, 2002
International Business Machines Corporation
Brian Eugene Curcio
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE FOR PRODUCING Z-AXIS INTERCONNECTION ASSEMBLY...
Publication number
20020150741
Publication date
Oct 17, 2002
International Business Machines Corporation
Brian E. Curcio
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Structure for high speed printed wiring boards with multiple differ...
Publication number
20020007966
Publication date
Jan 24, 2002
International Business Machines Corporation
Thomas Richard Miller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for filling high aspect ratio via holes in electronic substr...
Publication number
20010027842
Publication date
Oct 11, 2001
International Business Machines Corporation
Brian E. Curcio
H01 - BASIC ELECTRIC ELEMENTS