Brian M. Henderson

Person

Escondido, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrostatic discharge diodes and methods of forming electrostatic...
- Patent number 9,379,201
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic film enhanced inductor
- Patent number 9,190,201
- Issue date Nov 17, 2015
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic protection for stacked multi-chip integrated circuits
- Patent number 9,184,130
- Issue date Nov 10, 2015
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked memory elements and method of s...
- Patent number 9,153,461
- Issue date Oct 6, 2015
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge diode
- Patent number 9,093,462
- Issue date Jul 28, 2015
- QUALCOMM Incorporated
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having stacked memory elements and method of s...
- Patent number 9,041,220
- Issue date May 26, 2015
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-side interconnected CMOS for stacked integrated circuits
- Patent number 8,912,043
- Issue date Dec 16, 2014
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect sensor for detecting delamination
- Patent number 8,618,539
- Issue date Dec 31, 2013
- QUALCOMM Incorporated
- Brian Matthew Henderson
- G01 - MEASURING TESTING
Information Patent Grant
Reduced susceptibility to electrostatic discharge during 3D semicon...
- Patent number 8,604,626
- Issue date Dec 10, 2013
- QUALCOMM Incorporated
- Brian M. Henderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...
- Patent number 8,557,680
- Issue date Oct 15, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit for measuring magnitude of electrostatic discharge (ESD) ev...
- Patent number 8,536,893
- Issue date Sep 17, 2013
- QUALCOMM Incorporated
- Eugene R. Worley
- G01 - MEASURING TESTING
Information Patent Grant
Dual-side interconnected CMOS for stacked integrated circuits
- Patent number 8,525,342
- Issue date Sep 3, 2013
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional inductor, transformer and radio frequency amplifier
- Patent number 8,508,301
- Issue date Aug 13, 2013
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming radio frequency integrated circuits
- Patent number 8,362,599
- Issue date Jan 29, 2013
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing susceptibility to electrostatic discharge damage during di...
- Patent number 8,354,300
- Issue date Jan 15, 2013
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for placement of active and passive devices within a chip
- Patent number 8,350,358
- Issue date Jan 8, 2013
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for placement of active and passive devices within a chip
- Patent number 8,324,066
- Issue date Dec 4, 2012
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intra-die routing using back side redistribution layer and associat...
- Patent number 8,319,325
- Issue date Nov 27, 2012
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...
- Patent number 8,242,543
- Issue date Aug 14, 2012
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced susceptibility to electrostatic discharge during 3D semicon...
- Patent number 8,198,736
- Issue date Jun 12, 2012
- QUALCOMM Incorporated
- Brian M. Henderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Three dimensional inductor and transformer
- Patent number 8,143,952
- Issue date Mar 27, 2012
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for placement of active and passive devices within a chip
- Patent number 8,067,816
- Issue date Nov 29, 2011
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit for measuring mask misalignment
- Patent number 4,647,850
- Issue date Mar 3, 1987
- Burroughs Corporation
- Brian M. Henderson
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC DISCHARGE DIODE
- Publication number 20150333053
- Publication date Nov 19, 2015
- QUALCOMM Incorporated
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF S...
- Publication number 20150102509
- Publication date Apr 16, 2015
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20150048497
- Publication date Feb 19, 2015
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE DIODE
- Publication number 20140327105
- Publication date Nov 6, 2014
- QUALCOMM Incorporated
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST INTERPOSER COMPRISING AN OXIDATION LAYER
- Publication number 20140306349
- Publication date Oct 16, 2014
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA WITH A FUSE STRUCTURE
- Publication number 20140266286
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Vidhya Ramachandran
- G01 - MEASURING TESTING
Information Patent Application
DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT...
- Publication number 20140225246
- Publication date Aug 14, 2014
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF S...
- Publication number 20140225280
- Publication date Aug 14, 2014
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT STACKED INTEGRAT...
- Publication number 20140225248
- Publication date Aug 14, 2014
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC PROTECTION FOR STACKED MULTI-CHIP INTEGRATED CIRCUITS
- Publication number 20140098448
- Publication date Apr 10, 2014
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE INTERCONNECTED CMOS FOR STACKED INTEGRATED CIRCUITS
- Publication number 20130302943
- Publication date Nov 14, 2013
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED SUSCEPTIBILITY TO ELECTROSTATIC DISCHARGE DURING 3D SEMICON...
- Publication number 20130127046
- Publication date May 23, 2013
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER-TO-WAFER BONDING FOR DISSIMILAR SEMICONDUCTOR D...
- Publication number 20120276716
- Publication date Nov 1, 2012
- QULCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Inductor, Transformer and Radio Frequency Amplifier
- Publication number 20120056680
- Publication date Mar 8, 2012
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Placement of Active and Passive Devices within a Chip
- Publication number 20120040509
- Publication date Feb 16, 2012
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Placement of Active and Passive Devices within a Chip
- Publication number 20120001297
- Publication date Jan 5, 2012
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-Side Interconnected CMOS For Stacked Integrated Circuits
- Publication number 20110248403
- Publication date Oct 13, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing Susceptibility to Electrostatic Discharge Damage during Di...
- Publication number 20110204504
- Publication date Aug 25, 2011
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Sensor for Detecting Delamination
- Publication number 20110101347
- Publication date May 5, 2011
- QUALCOMM Incorporated
- Brian Matthew Henderson
- G01 - MEASURING TESTING
Information Patent Application
Three Dimensional Inductor and Transformer
- Publication number 20110084765
- Publication date Apr 14, 2011
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING RADIO FREQUENCY INTEGRATED CIRCUITS
- Publication number 20110068433
- Publication date Mar 24, 2011
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Wafer-To-Wafer Bonding For Dissimilar Semiconductor D...
- Publication number 20110049694
- Publication date Mar 3, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intra-Die Routing Using Back Side Redistribution Layer and Associat...
- Publication number 20100314737
- Publication date Dec 16, 2010
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reduced Susceptibility To Electrostatic Discharge During 3D Semicon...
- Publication number 20100258949
- Publication date Oct 14, 2010
- QUALCOMM Incorporated
- Brian M. Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Film Enhanced Inductor
- Publication number 20100225435
- Publication date Sep 9, 2010
- QUALCOMM Incorporated
- Xia Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit for Measuring Magnitude of Electrostatic Discharge (ESD) Ev...
- Publication number 20100225347
- Publication date Sep 9, 2010
- QUALCOMM Incorporated
- Eugene R. Worley
- G01 - MEASURING TESTING
Information Patent Application
Techniques for Placement of Active and Passive Devices Within a Chip
- Publication number 20100193905
- Publication date Aug 5, 2010
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Brian M. Henderson

Person

Patents Grantslast 30 patents

Electrostatic discharge diodes and methods of forming electrostatic...

Magnetic film enhanced inductor

Electrostatic protection for stacked multi-chip integrated circuits

Semiconductor device having stacked memory elements and method of s...

Electrostatic discharge diode

Semiconductor device having stacked memory elements and method of s...

Dual-side interconnected CMOS for stacked integrated circuits

Interconnect sensor for detecting delamination

Reduced susceptibility to electrostatic discharge during 3D semicon...

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...

Circuit for measuring magnitude of electrostatic discharge (ESD) ev...

Dual-side interconnected CMOS for stacked integrated circuits

Three dimensional inductor, transformer and radio frequency amplifier

Forming radio frequency integrated circuits

Reducing susceptibility to electrostatic discharge damage during di...

Techniques for placement of active and passive devices within a chip

Techniques for placement of active and passive devices within a chip

Intra-die routing using back side redistribution layer and associat...

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor d...

Reduced susceptibility to electrostatic discharge during 3D semicon...

Three dimensional inductor and transformer

Techniques for placement of active and passive devices within a chip

Integrated circuit for measuring mask misalignment

Patents Applicationslast 30 patents

ELECTROSTATIC DISCHARGE DIODE

SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF S...

INTERPOSER WITH ELECTROSTATIC DISCHARGE PROTECTION

ELECTROSTATIC DISCHARGE DIODE

LOW COST INTERPOSER COMPRISING AN OXIDATION LAYER

THROUGH-SUBSTRATE VIA WITH A FUSE STRUCTURE

DUAL SUBSTRATE, POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT...

SEMICONDUCTOR DEVICE HAVING STACKED MEMORY ELEMENTS AND METHOD OF S...

POWER DISTRIBUTION AND THERMAL SOLUTION FOR DIRECT STACKED INTEGRAT...

ELECTROSTATIC PROTECTION FOR STACKED MULTI-CHIP INTEGRATED CIRCUITS

DUAL-SIDE INTERCONNECTED CMOS FOR STACKED INTEGRATED CIRCUITS

REDUCED SUSCEPTIBILITY TO ELECTROSTATIC DISCHARGE DURING 3D SEMICON...

SEMICONDUCTOR WAFER-TO-WAFER BONDING FOR DISSIMILAR SEMICONDUCTOR D...

Three Dimensional Inductor, Transformer and Radio Frequency Amplifier

Techniques for Placement of Active and Passive Devices within a Chip

Techniques for Placement of Active and Passive Devices within a Chip

Dual-Side Interconnected CMOS For Stacked Integrated Circuits

Reducing Susceptibility to Electrostatic Discharge Damage during Di...

Interconnect Sensor for Detecting Delamination

Three Dimensional Inductor and Transformer

FORMING RADIO FREQUENCY INTEGRATED CIRCUITS

Semiconductor Wafer-To-Wafer Bonding For Dissimilar Semiconductor D...

Intra-Die Routing Using Back Side Redistribution Layer and Associat...

Reduced Susceptibility To Electrostatic Discharge During 3D Semicon...

Magnetic Film Enhanced Inductor

Circuit for Measuring Magnitude of Electrostatic Discharge (ESD) Ev...

Techniques for Placement of Active and Passive Devices Within a Chip