Brian Richard Sundlof

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 11,569,181
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,244,917
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,171,102
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,094,657
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 10,892,233
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 10,622,299
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,403,590
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,396,051
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 10,224,273
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 10,224,274
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Determining crackstop strength of integrated circuit assembly at th...
- Patent number 9,947,598
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Krishna R. Tunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi terminal capacitor within input output path of semiconductor...
- Patent number 9,899,313
- Issue date Feb 20, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 9,640,501
- Issue date May 2, 2017
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 9,472,520
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Virendra R. Jadhav
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self orienting micro plates of thermally conducting material as com...
- Patent number 9,263,363
- Issue date Feb 16, 2016
- GLOBALFOUNDRIES Inc.
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 9,111,816
- Issue date Aug 18, 2015
- International Business Machines Corporation
- Virendra R. Jadhav
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 9,018,760
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,910,853
- Issue date Dec 16, 2014
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 8,637,392
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self orienting micro plates of thermally conducting material as com...
- Patent number 8,604,623
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Additives for grain fragmentation in Pb-free Sn-based solder
- Patent number 8,493,746
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dimensionally decoupled ball limiting metalurgy
- Patent number 8,338,286
- Issue date Dec 25, 2012
- International Business Machines Corporation
- Eric David Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 8,293,587
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Virendra R Jadhav
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self orienting micro plates of thermally conducting material as com...
- Patent number 8,268,282
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Optimization of metallurgical properties of a solder joint
- Patent number 8,197,612
- Issue date Jun 12, 2012
- International Business Machines Corporation
- James A Busby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant penetrating packaging interconnect
- Patent number 7,897,878
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Paul Coteus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,784,669
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self orienting micro plates of thermally conducting material as com...
- Patent number 7,708,909
- Issue date May 4, 2010
- International Business Machines Corporation
- Gareth Hougham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and process for reducing undercooling in a lead-free tin-ric...
- Patent number 7,703,661
- Issue date Apr 27, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intermetallic diffusion block device and method of manufacture
- Patent number 7,683,493
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20210118819
- Publication date Apr 22, 2021
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20200135662
- Publication date Apr 30, 2020
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326242
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326243
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20190172784
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190157230
- Publication date May 23, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20180068945
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20180053717
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...
- Publication number 20180012838
- Publication date Jan 11, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20170170135
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20170133338
- Publication date May 11, 2017
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20150054152
- Publication date Feb 26, 2015
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...
- Publication number 20140077367
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self orienting micro plates of thermally conducting material as com...
- Publication number 20140038362
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20130284495
- Publication date Oct 31, 2013
- Charles L. Arvin
- B82 - NANO-TECHNOLOGY
Information Patent Application
SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COM...
- Publication number 20130016479
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20120312447
- Publication date Dec 13, 2012
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COM...
- Publication number 20120211159
- Publication date Aug 23, 2012
- International Business Machines Corporation
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-...
- Publication number 20120202343
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20120181071
- Publication date Jul 19, 2012
- International Business Machines Corporation
- VIRENDRA R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMENSIONALLY DECOUPLED BALL LIMITING METALURGY
- Publication number 20120083114
- Publication date Apr 5, 2012
- International Business Machines Corporation
- ERIC DANIEL PERFECTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...
- Publication number 20110193218
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COM...
- Publication number 20100207056
- Publication date Aug 19, 2010
- International Business Machines Corporation
- Gareth Hougham
- B82 - NANO-TECHNOLOGY
Information Patent Application
ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER
- Publication number 20100200271
- Publication date Aug 12, 2010
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...
- Publication number 20100155456
- Publication date Jun 24, 2010
- International Business Machines Corp.
- GARETH G. HOUGHAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT
- Publication number 20090266447
- Publication date Oct 29, 2009
- International Business Machines Corporation
- JAMES A. BUSBY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE
- Publication number 20090267228
- Publication date Oct 29, 2009
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Negative Coefficient of Thermal Expansion Particles and Method of F...
- Publication number 20090214780
- Publication date Aug 27, 2009
- International Business Machines
- Gareth Geoffrey Hougham
- B32 - LAYERED PRODUCTS
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY
- Publication number 20090140423
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM CO...
- Publication number 20090134016
- Publication date May 28, 2009
- International Business Machines Corporation
- Luc Belanger
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Brian Richard Sundlof

Person

Patents Grantslast 30 patents

Mitigating moisture-driven degradation of features designed to prev...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Mitigating moisture-driven degradation of features designed to prev...

Multi terminal capacitor within input output path of semiconductor...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Multi terminal capacitor within input output path of semiconductor...

Multi terminal capacitor within input output path of semiconductor...

Determining crackstop strength of integrated circuit assembly at th...

Multi terminal capacitor within input output path of semiconductor...

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Self orienting micro plates of thermally conducting material as com...

Multilayer pillar for reduced stress interconnect and method of mak...

Solder interconnect with non-wettable sidewall pillars and methods...

Additives for grain fragmentation in Pb-free Sn-based solder

Solder interconnect with non-wettable sidewall pillars and methods...

Self orienting micro plates of thermally conducting material as com...

Additives for grain fragmentation in Pb-free Sn-based solder

Dimensionally decoupled ball limiting metalurgy

Multilayer pillar for reduced stress interconnect and method of mak...

Self orienting micro plates of thermally conducting material as com...

Optimization of metallurgical properties of a solder joint

Compliant penetrating packaging interconnect

Method and process for reducing undercooling in a lead-free tin-ric...

Self orienting micro plates of thermally conducting material as com...

Method and process for reducing undercooling in a lead-free tin-ric...

Intermetallic diffusion block device and method of manufacture

Patents Applicationslast 30 patents

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

MULTI TERMINAL CAPACITOR WITHIN INPUT OUTPUT PATH OF SEMICONDUCTOR...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...

Self orienting micro plates of thermally conducting material as com...

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COM...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COM...

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

DIMENSIONALLY DECOUPLED BALL LIMITING METALURGY

Solder Interconnect with Non-Wettable Sidewall Pillars and Methods...

SELF ORIENTING MICRO PLATES OF THERMALLY CONDUCTING MATERIAL AS COM...

ADDITIVES FOR GRAIN FRAGMENTATION IN Pb-FREE Sn-BASED SOLDER

METHOD AND PROCESS FOR REDUCING UNDERCOOLING IN A LEAD-FREE TIN-RIC...

OPTIMIZATION OF METALLURGICAL PROPERTIES OF A SOLDER JOINT

INTERMETALLIC DIFFUSION BLOCK DEVICE AND METHOD OF MANUFACTURE

Negative Coefficient of Thermal Expansion Particles and Method of F...

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM CO...