Brigham NAVAJA

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid package apparatus and method of fabricating
- Patent number 11,948,877
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a die and die side redistribution layers (RDL)
- Patent number 11,581,262
- Issue date Feb 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive component embedded in an embedded trace substrate (ETS)
- Patent number 11,552,023
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding for packages and modules
- Patent number 11,177,223
- Issue date Nov 16, 2021
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density embedded interconnects in substrate
- Patent number 10,804,195
- Issue date Oct 13, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...
- Publication number 20240321709
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT PAD WITH TEST LINE
- Publication number 20240304503
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELE...
- Publication number 20240063195
- Publication date Feb 22, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2...
- Publication number 20230035627
- Publication date Feb 2, 2023
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT EMBEDDED IN AN EMBEDDED TRACE SUBSTRATE (ETS)
- Publication number 20210407918
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION AND LAMINATE STRUCTURE
- Publication number 20210407919
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PACKAGE APPARATUS AND METHOD OF FABRICATING
- Publication number 20210305141
- Publication date Sep 30, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE
- Publication number 20210296280
- Publication date Sep 23, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A DIE AND DIE SIDE REDISTRIBUTION LAYERS (RDL)
- Publication number 20210104467
- Publication date Apr 8, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED EMBEDDED PASSIVE SUBSTRATE STRUCTURE
- Publication number 20200176417
- Publication date Jun 4, 2020
- QUALCOMM Incorporated
- Brigham NAVAJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT
- Publication number 20200111758
- Publication date Apr 9, 2020
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY EMBEDDED INTERCONNECTS IN SUBSTRATE
- Publication number 20200051907
- Publication date Feb 13, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS

Brigham NAVAJA

Person

Patents Grantslast 30 patents

Hybrid package apparatus and method of fabricating

Package comprising a die and die side redistribution layers (RDL)

Passive component embedded in an embedded trace substrate (ETS)

Electromagnetic interference shielding for packages and modules

High density embedded interconnects in substrate

Patents Applicationslast 30 patents

PACKAGE COMPRISING AN INTEGRATED DEVICE AND A METALLIZATION PORTION...

SPLIT PAD WITH TEST LINE

PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELE...

SPLIT DIE INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING DIE-TO-DIE (D2...

PASSIVE COMPONENT EMBEDDED IN AN EMBEDDED TRACE SUBSTRATE (ETS)

HYBRID METALLIZATION AND LAMINATE STRUCTURE

HYBRID PACKAGE APPARATUS AND METHOD OF FABRICATING

STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE

PACKAGE COMPRISING A DIE AND DIE SIDE REDISTRIBUTION LAYERS (RDL)

STACKED EMBEDDED PASSIVE SUBSTRATE STRUCTURE

SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT

HIGH DENSITY EMBEDDED INTERCONNECTS IN SUBSTRATE