Bruce M. McWilliams

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor employing a plurality of photodetector arrays and/or r...
- Patent number 7,566,853
- Issue date Jul 28, 2009
- Tessera, Inc.
- David B. Tuckerman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure and method of making sealed capped chips
- Patent number 7,298,030
- Issue date Nov 20, 2007
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic packages having an array of resilient leads
- Patent number 6,891,255
- Issue date May 10, 2005
- Tessera, Inc.
- John W. Smith
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic packages having an array of resilient leads and met...
- Patent number 6,589,819
- Issue date Jul 8, 2003
- Tessera, Inc.
- John W. Smith
- G01 - MEASURING TESTING
Information Patent Grant
Method of assembling integrated circuits to a silicon board
- Patent number 5,214,844
- Issue date Jun 1, 1993
- nCHIP, Inc.
- Bruce M. McWilliams
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Control of stray light in camera systems employing an optics stack...
- Publication number 20080118241
- Publication date May 22, 2008
- Robert TeKolste
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Solder elements with columnar structures and methods of making the...
- Publication number 20080036100
- Publication date Feb 14, 2008
- Tessera, Inc.
- Bruce M. McWilliams
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure and method of making sealed capped chips
- Publication number 20080032457
- Publication date Feb 7, 2008
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making capped chip having discrete article...
- Publication number 20070138644
- Publication date Jun 21, 2007
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making capped chips having vertical interco...
- Publication number 20070096311
- Publication date May 3, 2007
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Image sensor employing a plurality of photodetector arrays and/or r...
- Publication number 20070034777
- Publication date Feb 15, 2007
- Tessera, Inc.
- David B. Tuckerman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION
- Publication number 20060081983
- Publication date Apr 20, 2006
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making capped chips having vertical interco...
- Publication number 20050095835
- Publication date May 5, 2005
- Tessera, Inc.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making sealed capped chips
- Publication number 20050082653
- Publication date Apr 21, 2005
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Structure and method of making capped chips using sacrificial layer
- Publication number 20050085016
- Publication date Apr 21, 2005
- Tessera, Inc.
- Bruce M. McWilliams
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectronic packages having an array of resilient leads
- Publication number 20030173107
- Publication date Sep 18, 2003
- Tessera, Inc.
- John W. Smith
- G01 - MEASURING TESTING
Information Patent Application
Microelectronic packages having an array of resilient leads and met...
- Publication number 20020145182
- Publication date Oct 10, 2002
- John W. Smith
- G01 - MEASURING TESTING

Bruce M. McWilliams

Person

Patents Grantslast 30 patents

Image sensor employing a plurality of photodetector arrays and/or r...

Structure and method of making sealed capped chips

Microelectronic packages having an array of resilient leads

Microelectronic packages having an array of resilient leads and met...

Method of assembling integrated circuits to a silicon board

Patents Applicationslast 30 patents

Control of stray light in camera systems employing an optics stack...

Solder elements with columnar structures and methods of making the...

Structure and method of making sealed capped chips

Structure and method of making capped chip having discrete article...

Structure and method of making capped chips having vertical interco...

Image sensor employing a plurality of photodetector arrays and/or r...

WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION

Structure and method of making capped chips having vertical interco...

Structure and method of making sealed capped chips

Structure and method of making capped chips using sacrificial layer

Microelectronic packages having an array of resilient leads

Microelectronic packages having an array of resilient leads and met...