Byung Joon Han

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 11,488,932
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,145,603
- Issue date Oct 12, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,024,585
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 10,658,330
- Issue date May 19, 2020
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
- Patent number 10,388,612
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor die with a...
- Patent number 10,217,873
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 9,997,468
- Issue date Jun 12, 2018
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of singulating thin semiconductor w...
- Patent number 9,934,998
- Issue date Apr 3, 2018
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
- Patent number 9,754,897
- Issue date Sep 5, 2017
- STATS ChipPAC, Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 9,721,862
- Issue date Aug 1, 2017
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 9,704,824
- Issue date Jul 11, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor die with a...
- Patent number 9,564,413
- Issue date Feb 7, 2017
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of singulating thin semiconductor w...
- Patent number 9,559,004
- Issue date Jan 31, 2017
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor die with a...
- Patent number 9,553,162
- Issue date Jan 24, 2017
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with molded cavity
- Patent number 8,999,754
- Issue date Apr 7, 2015
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit mounting system with paddle interlock and method...
- Patent number 8,779,565
- Issue date Jul 15, 2014
- Stats Chippac Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with exposed interconnects
- Patent number 8,704,349
- Issue date Apr 22, 2014
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnects and...
- Patent number 8,674,516
- Issue date Mar 18, 2014
- Stats Chippac Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-on-package stacking system and method of...
- Patent number 8,643,163
- Issue date Feb 4, 2014
- Stats Chippac Ltd.
- Il Kwon Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package to package stacking system
- Patent number 8,395,251
- Issue date Mar 12, 2013
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stacking option and method...
- Patent number 8,378,476
- Issue date Feb 19, 2013
- Stats Chippac Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a component in an encapsul...
- Patent number 8,309,397
- Issue date Nov 13, 2012
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure and method that eliminates special wire bond...
- Patent number 8,269,356
- Issue date Sep 18, 2012
- Stats Chippac Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with molded cavity
- Patent number 8,198,735
- Issue date Jun 12, 2012
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge stack integrated circuit package-on-package system
- Patent number 8,163,600
- Issue date Apr 24, 2012
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer integrated with permanent carrier and method therefor
- Patent number 8,125,073
- Issue date Feb 28, 2012
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with flexible substrate and reces...
- Patent number 8,050,047
- Issue date Nov 1, 2011
- Stats Chippac Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with flexible substrate and mound...
- Patent number 8,031,475
- Issue date Oct 4, 2011
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20230015504
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20200335478
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20200227383
- Publication date Jul 16, 2020
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294236
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294235
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
- Publication number 20170330840
- Publication date Nov 16, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20170294406
- Publication date Oct 12, 2017
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20170271305
- Publication date Sep 21, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Die with A...
- Publication number 20170110599
- Publication date Apr 20, 2017
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Singulating Thin Semiconductor W...
- Publication number 20170092529
- Publication date Mar 30, 2017
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20160300799
- Publication date Oct 13, 2016
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...
- Publication number 20150348936
- Publication date Dec 3, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20140183718
- Publication date Jul 3, 2014
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20140183761
- Publication date Jul 3, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Die with A...
- Publication number 20130221452
- Publication date Aug 29, 2013
- STATS ChipPAC, Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Die with A...
- Publication number 20130069252
- Publication date Mar 21, 2013
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...
- Publication number 20120326331
- Publication date Dec 27, 2012
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Singulating Thin Semiconductor W...
- Publication number 20120286429
- Publication date Nov 15, 2012
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH MOLDED CAVITY
- Publication number 20120217659
- Publication date Aug 30, 2012
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MOUNTING SYSTEM WITH PADDLE INTERLOCK AND METHOD...
- Publication number 20120146192
- Publication date Jun 14, 2012
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...
- Publication number 20120007217
- Publication date Jan 12, 2012
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING OPTION AND METHOD...
- Publication number 20110233747
- Publication date Sep 29, 2011
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Integrated With Permanent Carrier and Method Therefor
- Publication number 20110101509
- Publication date May 5, 2011
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...
- Publication number 20110089566
- Publication date Apr 21, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...
- Publication number 20110018084
- Publication date Jan 27, 2011
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Integrated with Permanent Carrier and Method Therefor
- Publication number 20090243083
- Publication date Oct 1, 2009
- STATS ChipPAC, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER AND FABRICATION METHOD
- Publication number 20090161330
- Publication date Jun 25, 2009
- Dean Paul Kossives
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM AND METHOD OF...
- Publication number 20090146315
- Publication date Jun 11, 2009
- Il Kwon Shim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER
- Publication number 20090020893
- Publication date Jan 22, 2009
- Taeg Ki Lim
- H01 - BASIC ELECTRIC ELEMENTS

Byung Joon Han

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of using a standardized carrier to...

Integrated circuit packaging system with shielding and method of ma...

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of using a standardized carrier to...

Semiconductor device and method of forming electromagnetic (EM) shi...

Semiconductor device and method of forming semiconductor die with a...

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device and method of singulating thin semiconductor w...

Semiconductor device and method of forming electromagnetic (EM) shi...

Semiconductor device and method of using a standardized carrier to...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of forming semiconductor die with a...

Semiconductor device and method of singulating thin semiconductor w...

Semiconductor device and method of forming semiconductor die with a...

Integrated circuit package with molded cavity

Integrated circuit mounting system with paddle interlock and method...

Integrated circuit package system with exposed interconnects

Integrated circuit packaging system with vertical interconnects and...

Integrated circuit package-on-package stacking system and method of...

Integrated circuit package to package stacking system

Integrated circuit packaging system with stacking option and method...

Integrated circuit packaging system with a component in an encapsul...

Wire bonding structure and method that eliminates special wire bond...

Integrated circuit package with molded cavity

Bridge stack integrated circuit package-on-package system

Wafer integrated with permanent carrier and method therefor

Integrated circuit package system with flexible substrate and reces...

Integrated circuit package system with flexible substrate and mound...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Using a Standardized Carrier to...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Using a Standardized Carrier to...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...

Semiconductor Device and Method of Using a Standardized Carrier to...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Forming Semiconductor Die with A...

Semiconductor Device and Method of Singulating Thin Semiconductor W...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

Semiconductor Device and Method of Forming Electromagnetic (EM) Shi...

Semiconductor Device and Method of Using a Standardized Carrier to...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Forming Semiconductor Die with A...

Semiconductor Device and Method of Forming Semiconductor Die with A...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...

Semiconductor Device and Method of Singulating Thin Semiconductor W...

INTEGRATED CIRCUIT PACKAGE WITH MOLDED CAVITY

INTEGRATED CIRCUIT MOUNTING SYSTEM WITH PADDLE INTERLOCK AND METHOD...

ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING OPTION AND METHOD...

Wafer Integrated With Permanent Carrier and Method Therefor

WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...

ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF...

Wafer Integrated with Permanent Carrier and Method Therefor

CHIP CARRIER AND FABRICATION METHOD

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM AND METHOD OF...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER