Carl Edmond Sullivan

Person

Versailles, KY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Physical unclonable function (PUF) alters disk structure to encode...
- Patent number 11,416,193
- Issue date Aug 16, 2022
- Lexmark International, Inc.
- Scott Richard Castle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Physical unclonable functions in bank cards or identification cards...
- Patent number 10,566,296
- Issue date Feb 18, 2020
- Lexmark International, Inc.
- Roger Steven Cannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-fluid ejection devices, methods for making micro-fluid ejecti...
- Patent number 8,968,527
- Issue date Mar 3, 2015
- Funai Electric Co., Ltd.
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate, includin...
- Patent number 8,727,500
- Issue date May 20, 2014
- Funai Electric Co., Ltd.
- Frank Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection devices with a polymeric layer having an embed...
- Patent number 8,642,249
- Issue date Feb 4, 2014
- Funai Electric Co., Ltd.
- Frank E Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate, includin...
- Patent number 8,459,779
- Issue date Jun 11, 2013
- Lexmark International, Inc.
- Burton Joyner
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Singulating ejection chips for micro-fluid applications
- Patent number 8,430,482
- Issue date Apr 30, 2013
- Lexmark International, Inc.
- Jiandong Fang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fin-shaped heater stack and method for formation
- Patent number 8,366,245
- Issue date Feb 5, 2013
- Lexmark International, Inc.
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate
- Patent number 8,087,756
- Issue date Jan 3, 2012
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater stack in a micro-fluid ejection device and method for formin...
- Patent number 8,070,265
- Issue date Dec 6, 2011
- Lexmark International, Inc.
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection heads with chips in pockets
- Patent number 8,061,811
- Issue date Nov 22, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection heads with chips in pockets
- Patent number 8,029,100
- Issue date Oct 4, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chips with silicon die bonded on silicon substrate and metho...
- Patent number 7,938,513
- Issue date May 10, 2011
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ink ejection device including a silicon chip having a heater stack...
- Patent number 7,922,297
- Issue date Apr 12, 2011
- Lexmark International, Inc.
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Micro-fluid ejection devices, methods for making micro-fluid ejecti...
- Patent number 7,673,972
- Issue date Mar 9, 2010
- Lexmark International, Inc.
- Yimin Guan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printed conductive connectors
- Patent number 7,354,794
- Issue date Apr 8, 2008
- Lexmark International, Inc.
- Frank E. Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Micro-fluid ejection assemblies
- Patent number 7,273,266
- Issue date Sep 25, 2007
- Lexmark International, Inc.
- John William Krawczyk
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Multi-fluid ejection device
- Patent number 7,267,431
- Issue date Sep 11, 2007
- Lexmark International, Inc.
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printheads having improved heater chip construction
- Patent number 7,097,280
- Issue date Aug 29, 2006
- Lexmark International, Inc.
- Rick L. Hubert
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ink jet printheads and methods therefor
- Patent number 6,902,867
- Issue date Jun 7, 2005
- Lexmark International, Inc.
- Eric Spencer Hall
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ink jet printheads
- Patent number 6,902,256
- Issue date Jun 7, 2005
- Lexmark International, Inc.
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Heater chip for an inkjet printhead
- Patent number 6,890,065
- Issue date May 10, 2005
- Lexmark International, Inc.
- Paul Timothy Spivey
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Ink jet cartridge structure
- Patent number 6,820,959
- Issue date Nov 23, 2004
- Lexmark International, In.c
- Donald Norman Spitz
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Process for making a heater chip module
- Patent number 6,796,019
- Issue date Sep 28, 2004
- Lexmark International, Inc.
- Steven Robert Komplin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an imageable support matrix for printhead n...
- Patent number 6,684,504
- Issue date Feb 3, 2004
- Lexmark International, Inc.
- Carl Edmond Sullivan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of increasing tab bond strength using reactive ion etching
- Patent number 6,668,445
- Issue date Dec 30, 2003
- Lexmark International, Inc.
- James Michael Mrvos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ink jet printheads and methods therefor
- Patent number 6,629,756
- Issue date Oct 7, 2003
- Lexmark International, Inc.
- Qing-Ming Wang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Reverse reactive ion patterning of metal oxide films
- Patent number 6,613,687
- Issue date Sep 2, 2003
- Lexmark International, Inc.
- Brian Christopher Hart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip for an ink jet printhead and method for making same
- Patent number 6,550,893
- Issue date Apr 22, 2003
- Lexmark International, Inc.
- James Michael Mrvos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a heater chip module
- Patent number 6,449,831
- Issue date Sep 17, 2002
- Lexmark International, Inc.
- Steven Robert Komplin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Tag System to Mitigate Maliciously Tainted and Counterfeit Products
- Publication number 20220176727
- Publication date Jun 9, 2022
- Lexmark International, Inc.
- JAMES HOWARD ELLIS
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PHYSICAL UNCLONABLE FUNCTION REGION ENCODING
- Publication number 20210334052
- Publication date Oct 28, 2021
- Lexmark International, Inc.
- SCOTT RICHARD CASTLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Physical Unclonable Functions in Integrated Circuit Chip Packaging...
- Publication number 20210242141
- Publication date Aug 5, 2021
- Lexmark International, Inc.
- Stephen P. Bush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physical Unclonable Functions in Bank Cards or Identification Cards...
- Publication number 20190157219
- Publication date May 23, 2019
- Lexmark International, Inc.
- Roger Steven Cannon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Physical Unclonable Functions in Integrated Circuit Chip Packaging...
- Publication number 20190139909
- Publication date May 9, 2019
- Lexmark International, Inc.
- Stephen P. Bush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE, INCLUDIN...
- Publication number 20130250004
- Publication date Sep 26, 2013
- Funai Electric Co., Ltd.
- Burton JOYNER
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Heater Chips with Silicon Die Bonded on Silicon Substrate, Includin...
- Publication number 20120133710
- Publication date May 31, 2012
- Burton Joyner, II
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SINGULATING EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS
- Publication number 20120075383
- Publication date Mar 29, 2012
- JIANDONG FANG
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE
- Publication number 20110205305
- Publication date Aug 25, 2011
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Devices, Methods for Making Micro-Fluid Ejecti...
- Publication number 20110094102
- Publication date Apr 28, 2011
- Lexmark International, Inc.
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBED...
- Publication number 20100285411
- Publication date Nov 11, 2010
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Heads with Chips in Pockets
- Publication number 20100199497
- Publication date Aug 12, 2010
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Fin-Shaped Heater Stack And Method For Formation
- Publication number 20100165054
- Publication date Jul 1, 2010
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Heater Stack In A Micro-Fluid Ejection Device And Method For Formin...
- Publication number 20100165056
- Publication date Jul 1, 2010
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHO...
- Publication number 20090256891
- Publication date Oct 15, 2009
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INK EJECTION DEVICE INCLUDING A SILICON CHIP HAVING A HEATER STACK...
- Publication number 20090153622
- Publication date Jun 18, 2009
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejecti...
- Publication number 20080165227
- Publication date Jul 10, 2008
- Lexmark International, Inc.
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
High Resistance Heater Material for A Micro-Fluid Ejection Head
- Publication number 20080115359
- Publication date May 22, 2008
- Yimin Guan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Heads with Chips in Pockets
- Publication number 20080079776
- Publication date Apr 3, 2008
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embed...
- Publication number 20070296767
- Publication date Dec 27, 2007
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Printed conductive connectors
- Publication number 20060187267
- Publication date Aug 24, 2006
- Lexmark International, Inc.
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Laser tacking and singulating method and system
- Publication number 20060132544
- Publication date Jun 22, 2006
- Richard E. Corley
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Multi-fluid ejection device
- Publication number 20060001704
- Publication date Jan 5, 2006
- Frank Edward Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Micro-fluid ejection assemblies
- Publication number 20050231557
- Publication date Oct 20, 2005
- John William Krawczyk
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Printheads having improved heater chip construction
- Publication number 20050179728
- Publication date Aug 18, 2005
- Rick L. Hubert
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Ink jet printheads
- Publication number 20050012791
- Publication date Jan 20, 2005
- Frank E. Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Imageable support matrix for pinthead nozzle plates and method of m...
- Publication number 20040135841
- Publication date Jul 15, 2004
- Lexmark International, Inc.
- Carl Edmond Sullivan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Ink jet printheads and methods therefor
- Publication number 20040067446
- Publication date Apr 8, 2004
- Eric Spencer Hall
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Process for making a heater chip module
- Publication number 20020152607
- Publication date Oct 24, 2002
- Steven Robert Komplin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Imageable support matrix for pinthead nozzle plates and method of m...
- Publication number 20020145646
- Publication date Oct 10, 2002
- Carl Edmond Sullivan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Carl Edmond Sullivan

Person

Patents Grantslast 30 patents

Physical unclonable function (PUF) alters disk structure to encode...

Physical unclonable functions in bank cards or identification cards...

Micro-fluid ejection devices, methods for making micro-fluid ejecti...

Heater chips with silicon die bonded on silicon substrate, includin...

Micro-fluid ejection devices with a polymeric layer having an embed...

Heater chips with silicon die bonded on silicon substrate, includin...

Singulating ejection chips for micro-fluid applications

Fin-shaped heater stack and method for formation

Heater chips with silicon die bonded on silicon substrate

Heater stack in a micro-fluid ejection device and method for formin...

Micro-fluid ejection heads with chips in pockets

Micro-fluid ejection heads with chips in pockets

Heater chips with silicon die bonded on silicon substrate and metho...

Ink ejection device including a silicon chip having a heater stack...

Micro-fluid ejection devices, methods for making micro-fluid ejecti...

Printed conductive connectors

Micro-fluid ejection assemblies

Multi-fluid ejection device

Printheads having improved heater chip construction

Ink jet printheads and methods therefor

Ink jet printheads

Heater chip for an inkjet printhead

Ink jet cartridge structure

Process for making a heater chip module

Method of manufacturing an imageable support matrix for printhead n...

Method of increasing tab bond strength using reactive ion etching

Ink jet printheads and methods therefor

Reverse reactive ion patterning of metal oxide films

Semiconductor chip for an ink jet printhead and method for making same

Process for making a heater chip module

Patents Applicationslast 30 patents

Tag System to Mitigate Maliciously Tainted and Counterfeit Products

PHYSICAL UNCLONABLE FUNCTION REGION ENCODING

Physical Unclonable Functions in Integrated Circuit Chip Packaging...

Physical Unclonable Functions in Bank Cards or Identification Cards...

Physical Unclonable Functions in Integrated Circuit Chip Packaging...

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE, INCLUDIN...

Heater Chips with Silicon Die Bonded on Silicon Substrate, Includin...

SINGULATING EJECTION CHIPS FOR MICRO-FLUID APPLICATIONS

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE

Micro-Fluid Ejection Devices, Methods for Making Micro-Fluid Ejecti...

MICRO-FLUID EJECTION DEVICES WITH A POLYMERIC LAYER HAVING AN EMBED...

Micro-Fluid Ejection Heads with Chips in Pockets

Fin-Shaped Heater Stack And Method For Formation

Heater Stack In A Micro-Fluid Ejection Device And Method For Formin...

HEATER CHIPS WITH SILICON DIE BONDED ON SILICON SUBSTRATE AND METHO...

INK EJECTION DEVICE INCLUDING A SILICON CHIP HAVING A HEATER STACK...

Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejecti...

High Resistance Heater Material for A Micro-Fluid Ejection Head

Micro-Fluid Ejection Heads with Chips in Pockets

Micro-Fluid Ejection Devices with a Polymeric Layer Having an Embed...

Printed conductive connectors

Laser tacking and singulating method and system

Multi-fluid ejection device

Micro-fluid ejection assemblies

Printheads having improved heater chip construction

Ink jet printheads

Imageable support matrix for pinthead nozzle plates and method of m...

Ink jet printheads and methods therefor

Process for making a heater chip module

Imageable support matrix for pinthead nozzle plates and method of m...