Carlos J. Sambucetti

Person

Vallejo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Technology for fabrication of packaging interface substrate wafers...
- Patent number 7,880,305
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Yu-Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of aligned capped metal lines and interconnections in mul...
- Patent number 7,825,516
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced electromigration and stressed induced migration of copper w...
- Patent number 7,468,320
- Issue date Dec 23, 2008
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball limiting metallurgy, interconnection structure including the s...
- Patent number 7,273,803
- Issue date Sep 25, 2007
- International Business Machines Corporation
- Yu-Ting Cheng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self-aligned corrosion stop for copper C4 and wirebond
- Patent number 7,081,680
- Issue date Jul 25, 2006
- International Business Machines Corporation
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Means of seeding and metallizing polyimide
- Patent number 7,033,648
- Issue date Apr 25, 2006
- International Business Machines Corporations
- Fuad E. Doany
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density area array solder microjoining interconnect structure...
- Patent number 6,819,000
- Issue date Nov 16, 2004
- International Business Machines Corporation
- John Harold Magerlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-aligned corrosion stop for copper C4 and wirebond
- Patent number 6,779,711
- Issue date Aug 24, 2004
- International Business Machines Corporation
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary device attach structure for test and burn in of microjoin...
- Patent number 6,747,472
- Issue date Jun 8, 2004
- International Business Machines Corporation
- John Harold Magerlein
- G01 - MEASURING TESTING
Information Patent Grant
High density raised stud microjoining system and methods of fabrica...
- Patent number 6,732,908
- Issue date May 11, 2004
- International Business Machines Corporation
- Bruce Kenneth Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density area array solder microjoining interconnect structure...
- Patent number 6,661,098
- Issue date Dec 9, 2003
- International Business Machines Corporation
- John Harold Magerlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for testing chips on flat solder bumps
- Patent number 6,656,750
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming Co-W-P-Au films
- Patent number 6,646,345
- Issue date Nov 11, 2003
- International Business Machines Corporation
- Carlos Juan Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chip to wiring interface with single metal alloy layer applied to s...
- Patent number 6,573,606
- Issue date Jun 3, 2003
- International Business Machines Corporation
- Carlos Juan Sambucetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct chip attach by solder bumps and an underfill layer
- Patent number 6,566,612
- Issue date May 20, 2003
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to increase reliability CuBEOL structures
- Patent number 6,503,834
- Issue date Jan 7, 2003
- International Business Machines Corp.
- Xiaomeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing self-aligned corrosion stop for copper C4...
- Patent number 6,457,234
- Issue date Oct 1, 2002
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,436,803
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming barrier layers for damascene interconnects
- Patent number 6,358,832
- Issue date Mar 19, 2002
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced electromigration and stressed induced migration of Cu wires...
- Patent number 6,342,733
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct chip attach by solder bumps and an underfill layer
- Patent number 6,341,418
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making interconnect for low temperature chip attachment
- Patent number 6,340,630
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced integrated circuits
- Patent number 6,339,024
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Kevin S. Petrarca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a conductive pad for electrical connection and...
- Patent number 6,335,104
- Issue date Jan 1, 2002
- International Business Machines Corporation
- Carlos J. Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etched glass solder bump transfer for flip chip integrated circuit...
- Patent number 6,332,569
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Steven A. Cordes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming Co-W-P-Au films
- Patent number 6,323,128
- Issue date Nov 27, 2001
- International Business Machines Corporation
- Carlos Juan Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,281,105
- Issue date Aug 28, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing computer systems with fine line circuitized substrates
- Patent number 6,268,016
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,221,503
- Issue date Apr 24, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free conductive composites for electrical interconnections
- Patent number 6,197,222
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Ravi F. Saraf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Technology for fabrication of packaging interface substrate wafers...
- Publication number 20090302454
- Publication date Dec 10, 2009
- Yu- Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...
- Publication number 20090142924
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Limiting Metallurgy, Interconnection Structure Including the S...
- Publication number 20080008900
- Publication date Jan 10, 2008
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Reduced electromigration and stressed induced migration of copper w...
- Publication number 20050266673
- Publication date Dec 1, 2005
- International Business Machines Corporation
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball limiting metallurgy, interconnection structure including the s...
- Publication number 20050118437
- Publication date Jun 2, 2005
- International Business Machines Corporation
- Yu-Ting Cheng
- B32 - LAYERED PRODUCTS
Information Patent Application
Self-aligned corrosion stop for copper C4 and wirebond
- Publication number 20040234679
- Publication date Nov 25, 2004
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Formation of aligned capped metal lines and interconnections in mul...
- Publication number 20040113277
- Publication date Jun 17, 2004
- Stefanie Ruth Chiras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technology for fabrication of packaging interface substrate wafers...
- Publication number 20040089948
- Publication date May 13, 2004
- Yu-Ting Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High density area array solder microjoining interconnect structure...
- Publication number 20040084782
- Publication date May 6, 2004
- International Business Machines Corporation
- John Harold Magerlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for testing chips on flat solder bumps
- Publication number 20040087046
- Publication date May 6, 2004
- International Business Machines Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High density area array solder microjoining interconnect structure...
- Publication number 20030137058
- Publication date Jul 24, 2003
- International Business Machines Corporation
- John Harold Magerlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High density raised stud microjoining system and methods of fabrica...
- Publication number 20030136814
- Publication date Jul 24, 2003
- International Business Machines Corporation
- Bruce Kenneth Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temporary device attach structure for test and burn in of microjoin...
- Publication number 20030136813
- Publication date Jul 24, 2003
- International Business Machines Corporation
- John Harold Magerlein
- G01 - MEASURING TESTING
Information Patent Application
Method for forming encapsulated metal interconnect structures in se...
- Publication number 20030116439
- Publication date Jun 26, 2003
- International Business Machines Corporation
- Soon-Chen Seo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Self-aligned corrosion stop for copper C4 and wirebond
- Publication number 20030072928
- Publication date Apr 17, 2003
- Daniel C. Edelstein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip to wiring interface with single metal alloy layer applied to s...
- Publication number 20030001275
- Publication date Jan 2, 2003
- Carlos Juan Sambucetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming Co-W-P-Au films
- Publication number 20020123220
- Publication date Sep 5, 2002
- International Business Machines Corporation
- Carlos Juan Sambucetti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduced electromigration and stressed induced migration of Cu wires...
- Publication number 20020098681
- Publication date Jul 25, 2002
- Chao-Kun Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless metal liner formation methods
- Publication number 20020081842
- Publication date Jun 27, 2002
- Carlos J. Sambucetti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for direct chip attach by solder bumps and an underfill layer
- Publication number 20020062556
- Publication date May 30, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing computer systems with fine line circuitized substrates
- Publication number 20010033889
- Publication date Oct 25, 2001
- Anilkumar Chinuprasad Bhatt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Carlos J. Sambucetti

Person

Patents Grantslast 30 patents

Technology for fabrication of packaging interface substrate wafers...

Formation of aligned capped metal lines and interconnections in mul...

Reduced electromigration and stressed induced migration of copper w...

Ball limiting metallurgy, interconnection structure including the s...

Self-aligned corrosion stop for copper C4 and wirebond

Means of seeding and metallizing polyimide

High density area array solder microjoining interconnect structure...

Self-aligned corrosion stop for copper C4 and wirebond

Temporary device attach structure for test and burn in of microjoin...

High density raised stud microjoining system and methods of fabrica...

High density area array solder microjoining interconnect structure...

Method for testing chips on flat solder bumps

Method for forming Co-W-P-Au films

Chip to wiring interface with single metal alloy layer applied to s...

Method for direct chip attach by solder bumps and an underfill layer

Process to increase reliability CuBEOL structures

Process for manufacturing self-aligned corrosion stop for copper C4...

Manufacturing computer systems with fine line circuitized substrates

Method of forming barrier layers for damascene interconnects

Reduced electromigration and stressed induced migration of Cu wires...

Method for direct chip attach by solder bumps and an underfill layer

Method for making interconnect for low temperature chip attachment

Reinforced integrated circuits

Method for preparing a conductive pad for electrical connection and...

Etched glass solder bump transfer for flip chip integrated circuit...

Method for forming Co-W-P-Au films

Electrode modification using an unzippable polymer paste

Manufacturing computer systems with fine line circuitized substrates

Electrode modification using an unzippable polymer paste

Lead free conductive composites for electrical interconnections

Patents Applicationslast 30 patents

Technology for fabrication of packaging interface substrate wafers...

REDUCED ELECTROMIGRATION AND STRESSED INDUCED MIGRATION OF CU WIRES...

Ball Limiting Metallurgy, Interconnection Structure Including the S...

Reduced electromigration and stressed induced migration of copper w...

Ball limiting metallurgy, interconnection structure including the s...

Self-aligned corrosion stop for copper C4 and wirebond

Formation of aligned capped metal lines and interconnections in mul...

Technology for fabrication of packaging interface substrate wafers...

High density area array solder microjoining interconnect structure...

Method for testing chips on flat solder bumps

High density area array solder microjoining interconnect structure...

High density raised stud microjoining system and methods of fabrica...

Temporary device attach structure for test and burn in of microjoin...

Method for forming encapsulated metal interconnect structures in se...

Self-aligned corrosion stop for copper C4 and wirebond

Chip to wiring interface with single metal alloy layer applied to s...

Method for forming Co-W-P-Au films

Reduced electromigration and stressed induced migration of Cu wires...

Electroless metal liner formation methods

Method for direct chip attach by solder bumps and an underfill layer

Manufacturing computer systems with fine line circuitized substrates