Carsten Peters

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having silicon/germanium active regions with...
- Patent number 11,031,406
- Issue date Jun 8, 2021
- GLOBALFOUNDRIES U.S. INC.
- Elliot John Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including Si/Ge active regions with different...
- Patent number 10,522,555
- Issue date Dec 31, 2019
- GLOBALFOUNDRIES Inc.
- Elliot John Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-end-of-line device structure and method of forming such a fro...
- Patent number 10,483,154
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Elliot John Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact scheme for landing on different contact area levels
- Patent number 10,157,774
- Issue date Dec 18, 2018
- GLOBALFOUNDRIES Inc.
- Carsten K. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 9,305,878
- Issue date Apr 5, 2016
- GLOBALFOUNDRIES, INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits including densifying in...
- Patent number 9,257,329
- Issue date Feb 9, 2016
- GLOBALFOUNDRIES, INC.
- Oliver Mieth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for fabricating integrated circuits...
- Patent number 8,932,911
- Issue date Jan 13, 2015
- GLOBALFOUNDRIES, INC.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including barrier polish stop layers and method...
- Patent number 8,772,154
- Issue date Jul 8, 2014
- GLOBALFOUNDRIES, INC.
- Egon Ronny Pfützner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact elements of semiconductor devices comprising a continuous t...
- Patent number 8,580,684
- Issue date Nov 12, 2013
- GLOBALFOUNDRIES Inc.
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano imprint technique with increased flexibility with respect to a...
- Patent number 8,293,641
- Issue date Oct 23, 2012
- Advanced Micro Devices, Inc.
- Robert Seidel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of selectively forming a conductive barrier layer by ALD
- Patent number 8,173,538
- Issue date May 8, 2012
- Advanced Micro Devices, Inc.
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing leakage currents caused by misalignment of a co...
- Patent number 7,998,823
- Issue date Aug 16, 2011
- Advanced Micro Devices, Inc.
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano imprint technique with increased flexibility with respect to a...
- Patent number 7,928,004
- Issue date Apr 19, 2011
- Advanced Micro Devices, Inc.
- Robert Seidel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing contamination of semiconductor substrates during beol proc...
- Patent number 7,915,170
- Issue date Mar 29, 2011
- Advanced Micro Devices, Inc.
- Su Ruo Qing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming an interlayer dielectric material of increase...
- Patent number 7,910,496
- Issue date Mar 22, 2011
- Advanced Micro Devices, Inc.
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased reliability for a contact structure to connect an active...
- Patent number 7,906,815
- Issue date Mar 15, 2011
- Advanced Micro Devices, Inc.
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a contact structure based on copper...
- Patent number 7,902,581
- Issue date Mar 8, 2011
- GLOBALFOUNDRIES Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising an electrically conductive featu...
- Patent number 7,879,709
- Issue date Feb 1, 2011
- GLOBALFOUNDRIES Inc.
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for compensating for a difference in deposition behavior...
- Patent number 7,875,514
- Issue date Jan 25, 2011
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for compensating for a difference in deposition behavior...
- Patent number 7,785,956
- Issue date Aug 31, 2010
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including field effect transistors laterally e...
- Patent number 7,767,593
- Issue date Aug 3, 2010
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for monitoring leakage currents in a metallization l...
- Patent number 7,764,078
- Issue date Jul 27, 2010
- GLOBALFOUNDRIES Inc.
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a contact structure with increased...
- Patent number 7,678,690
- Issue date Mar 16, 2010
- Advanced Micro Devices, Inc.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for non-destructive metal delamination monitoring in semi...
- Patent number 7,638,424
- Issue date Dec 29, 2009
- GLOBALFOUNDRIES, INC.
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for creating different mechanical strain by forming a con...
- Patent number 7,608,501
- Issue date Oct 27, 2009
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization layer of a semiconductor device having differently th...
- Patent number 7,592,258
- Issue date Sep 22, 2009
- Advanced Micro Devices, Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for creating different mechanical strain by a contact etc...
- Patent number 7,482,219
- Issue date Jan 27, 2009
- Advanced Micro Devices, Inc.
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of increasing the etch selectivity in a contact structure of...
- Patent number 7,416,973
- Issue date Aug 26, 2008
- Advanced Micro Devices, Inc.
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING SI/GE ACTIVE REGIONS WITH DIFFERENT...
- Publication number 20190312041
- Publication date Oct 10, 2019
- GLOBALFOUNDRIES INC.
- Elliot John Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING SILICON/GERMANIUM A...
- Publication number 20190312042
- Publication date Oct 10, 2019
- GLOBALFOUNDRIES INC.
- Elliot John Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS
- Publication number 20150235896
- Publication date Aug 20, 2015
- GLOBALFOUNDRIES, Inc.
- Oliver Mieth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20150097291
- Publication date Apr 9, 2015
- GLOBALFOUNDRIES, Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD INCLUDING A REMOVAL OF A HARDMASK FROM A SEMICONDUCTOR STRUC...
- Publication number 20140349479
- Publication date Nov 27, 2014
- Oliver Mieth
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...
- Publication number 20140239503
- Publication date Aug 28, 2014
- GLOBALFOUNDRIES, Inc.
- Torsten Huisinga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING BARRIER POLISH STOP LAYERS AND METHOD...
- Publication number 20120319285
- Publication date Dec 20, 2012
- GLOBALFOUNDRIES INC.
- Egon Ronny PFÜTZNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES COMPRISING A CONTINUOUS T...
- Publication number 20110210447
- Publication date Sep 1, 2011
- Robert Seidel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO IMPRINT TECHNIQUE WITH INCREASED FLEXIBILITY WITH RESPECT TO A...
- Publication number 20110117723
- Publication date May 19, 2011
- Advanced Micro Devices, Inc.
- Robert Seidel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TECHNIQUE FOR COMPENSATING FOR A DIFFERENCE IN DEPOSITION BEHAVIOR...
- Publication number 20100285668
- Publication date Nov 11, 2010
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL INTEGRATION SCHEME FOR LOW RESISTANCE METAL LAYERS
- Publication number 20090108462
- Publication date Apr 30, 2009
- Carsten PETERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED RELIABILITY FOR A CONTACT STRUCTURE TO CONNECT AN ACTIVE...
- Publication number 20090085030
- Publication date Apr 2, 2009
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR COMPENSATING FOR A DIFFERENCE IN DEPOSITION BEHAVIOR...
- Publication number 20090087999
- Publication date Apr 2, 2009
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE FEATU...
- Publication number 20090085145
- Publication date Apr 2, 2009
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTORS LATERALLY E...
- Publication number 20090061645
- Publication date Mar 5, 2009
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR FORMING AN INTERLAYER DIELECTRIC MATERIAL OF INCREASE...
- Publication number 20090001526
- Publication date Jan 1, 2009
- Frank FEUSTEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE FEATU...
- Publication number 20080265419
- Publication date Oct 30, 2008
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REDUCING COLLATERAL TRANSPORT-INDUCED DAMAGE...
- Publication number 20080131257
- Publication date Jun 5, 2008
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY FORMING A CONDUCTIVE BARRIER LAYER BY ALD
- Publication number 20080132057
- Publication date Jun 5, 2008
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO IMPRINT TECHNIQUE WITH INCREASED FLEXIBILITY WITH RESPECT TO A...
- Publication number 20080003818
- Publication date Jan 3, 2008
- Robert Seidel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING CONTAMINATION OF SEMICONDUCTOR SUBSTRATES DURING BEOL PROC...
- Publication number 20080003830
- Publication date Jan 3, 2008
- Su Ruo Qing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR MONITORING LEAKAGE CURRENTS IN A METALLIZATION L...
- Publication number 20070296439
- Publication date Dec 27, 2007
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LAYER OF A SEMICONDUCTOR DEVICE HAVING DIFFERENTLY TH...
- Publication number 20070278693
- Publication date Dec 6, 2007
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR NON-DESTRUCTIVE METAL DELAMINATION MONITORING IN SEMI...
- Publication number 20070178691
- Publication date Aug 2, 2007
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INCREASING THE ETCH SELECTIVITY IN A CONTACT STRUCTURE OF...
- Publication number 20070178685
- Publication date Aug 2, 2007
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING LEAKAGE CURRENTS CAUSED BY MISALIGNMENT OF A CO...
- Publication number 20070161225
- Publication date Jul 12, 2007
- Carsten Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CONTACT STRUCTURE WITH INCREASED...
- Publication number 20070152343
- Publication date Jul 5, 2007
- Ralf Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A CONTACT STRUCTURE BASED ON COPPER...
- Publication number 20070099414
- Publication date May 3, 2007
- Kai Frohberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY FORMING A CON...
- Publication number 20070077708
- Publication date Apr 5, 2007
- KAI FROHBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY A CONTACT ETC...
- Publication number 20070077741
- Publication date Apr 5, 2007
- KAI FROHBERG
- H01 - BASIC ELECTRIC ELEMENTS

Carsten Peters

Person

Patents Grantslast 30 patents

Semiconductor devices having silicon/germanium active regions with...

Semiconductor devices including Si/Ge active regions with different...

Front-end-of-line device structure and method of forming such a fro...

Contact scheme for landing on different contact area levels

Integrated circuits and methods for fabricating integrated circuits...

Methods for fabricating integrated circuits including densifying in...

Integrated circuits and methods for fabricating integrated circuits...

Integrated circuits including barrier polish stop layers and method...

Contact elements of semiconductor devices comprising a continuous t...

Nano imprint technique with increased flexibility with respect to a...

Method of selectively forming a conductive barrier layer by ALD

Method for reducing leakage currents caused by misalignment of a co...

Nano imprint technique with increased flexibility with respect to a...

Reducing contamination of semiconductor substrates during beol proc...

Technique for forming an interlayer dielectric material of increase...

Increased reliability for a contact structure to connect an active...

Semiconductor device comprising a contact structure based on copper...

Semiconductor structure comprising an electrically conductive featu...

Technique for compensating for a difference in deposition behavior...

Technique for compensating for a difference in deposition behavior...

Semiconductor device including field effect transistors laterally e...

Test structure for monitoring leakage currents in a metallization l...

Semiconductor device comprising a contact structure with increased...

Technique for non-destructive metal delamination monitoring in semi...

Technique for creating different mechanical strain by forming a con...

Metallization layer of a semiconductor device having differently th...

Technique for creating different mechanical strain by a contact etc...

Method of increasing the etch selectivity in a contact structure of...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES INCLUDING SI/GE ACTIVE REGIONS WITH DIFFERENT...

METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING SILICON/GERMANIUM A...

METHODS FOR FABRICATING INTEGRATED CIRCUITS

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

METHOD INCLUDING A REMOVAL OF A HARDMASK FROM A SEMICONDUCTOR STRUC...

INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS...

INTEGRATED CIRCUITS INCLUDING BARRIER POLISH STOP LAYERS AND METHOD...

CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES COMPRISING A CONTINUOUS T...

NANO IMPRINT TECHNIQUE WITH INCREASED FLEXIBILITY WITH RESPECT TO A...

TECHNIQUE FOR COMPENSATING FOR A DIFFERENCE IN DEPOSITION BEHAVIOR...

DUAL INTEGRATION SCHEME FOR LOW RESISTANCE METAL LAYERS

INCREASED RELIABILITY FOR A CONTACT STRUCTURE TO CONNECT AN ACTIVE...

TECHNIQUE FOR COMPENSATING FOR A DIFFERENCE IN DEPOSITION BEHAVIOR...

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE FEATU...

SEMICONDUCTOR DEVICE INCLUDING FIELD EFFECT TRANSISTORS LATERALLY E...

TECHNIQUE FOR FORMING AN INTERLAYER DIELECTRIC MATERIAL OF INCREASE...

SEMICONDUCTOR STRUCTURE COMPRISING AN ELECTRICALLY CONDUCTIVE FEATU...

SYSTEM AND METHOD FOR REDUCING COLLATERAL TRANSPORT-INDUCED DAMAGE...

METHOD OF SELECTIVELY FORMING A CONDUCTIVE BARRIER LAYER BY ALD

NANO IMPRINT TECHNIQUE WITH INCREASED FLEXIBILITY WITH RESPECT TO A...

REDUCING CONTAMINATION OF SEMICONDUCTOR SUBSTRATES DURING BEOL PROC...

TEST STRUCTURE FOR MONITORING LEAKAGE CURRENTS IN A METALLIZATION L...

METALLIZATION LAYER OF A SEMICONDUCTOR DEVICE HAVING DIFFERENTLY TH...

TECHNIQUE FOR NON-DESTRUCTIVE METAL DELAMINATION MONITORING IN SEMI...

METHOD OF INCREASING THE ETCH SELECTIVITY IN A CONTACT STRUCTURE OF...

METHOD FOR REDUCING LEAKAGE CURRENTS CAUSED BY MISALIGNMENT OF A CO...

SEMICONDUCTOR DEVICE COMPRISING A CONTACT STRUCTURE WITH INCREASED...

SEMICONDUCTOR DEVICE COMPRISING A CONTACT STRUCTURE BASED ON COPPER...

TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY FORMING A CON...

TECHNIQUE FOR CREATING DIFFERENT MECHANICAL STRAIN BY A CONTACT ETC...