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Chad B. MOORE
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Albany, NY, US
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last 30 patents
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Patent Application
METAL CORE SUBSTRATE BASED PACKAGE INTERCONNECT SYSTEMS
Publication number
20240290705
Publication date
Aug 29, 2024
LUX SEMICONDUCTORS, INC.
Chad B. MOORE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AN...
Publication number
20240290708
Publication date
Aug 29, 2024
LUX SEMICONDUCTORS, INC.
Chad B. MOORE
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY