Chad Cobbley

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Techniques for packaging multiple device components
- Patent number 9,559,087
- Issue date Jan 31, 2017
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures and electronic devices including hy...
- Patent number 8,872,310
- Issue date Oct 28, 2014
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including one or more stiffening elements
- Patent number 8,716,849
- Issue date May 6, 2014
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 8,629,558
- Issue date Jan 14, 2014
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication of package assemblies for optically interact...
- Patent number 8,624,371
- Issue date Jan 7, 2014
- Round Rock Research, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced detection of memory device removal, and methods, devices a...
- Patent number 8,599,637
- Issue date Dec 3, 2013
- Micron Technology, Inc.
- James Cooke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic devices
- Patent number 8,508,034
- Issue date Aug 13, 2013
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication of package assemblies for optically interact...
- Patent number 8,426,954
- Issue date Apr 23, 2013
- Round Rock Research, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures and electronic devices including sa...
- Patent number 8,344,514
- Issue date Jan 1, 2013
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 8,212,348
- Issue date Jul 3, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced detection of memory device removal, and methods, devices a...
- Patent number 8,189,420
- Issue date May 29, 2012
- Micron Technology, Inc.
- James Cooke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded stiffener for thin substrates
- Patent number 8,148,803
- Issue date Apr 3, 2012
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 8,115,296
- Issue date Feb 14, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication of package assemblies for optically interact...
- Patent number 8,008,762
- Issue date Aug 30, 2011
- Round Rock Research, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect using locally conductive adhesive
- Patent number 7,998,305
- Issue date Aug 16, 2011
- Micron Technology, Inc.
- Chad A. Cobbley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of forming hybrid conductive vias including small dimension...
- Patent number 7,939,449
- Issue date May 10, 2011
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect using locally conductive adhesive
- Patent number 7,829,190
- Issue date Nov 9, 2010
- Micron Technology, Inc.
- Chad A. Cobbley
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Techniques for packaging a multiple device component
- Patent number 7,804,171
- Issue date Sep 28, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 7,781,875
- Issue date Aug 24, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die module including multiple adhesives that cure at differ...
- Patent number 7,755,204
- Issue date Jul 13, 2010
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for attaching solder balls to BGA package utilizing a too...
- Patent number 7,644,853
- Issue date Jan 12, 2010
- Micron Technology, Inc.
- Chad A. Cobbley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for locating conductive sphere utilizing screen and hopper o...
- Patent number 7,635,079
- Issue date Dec 22, 2009
- Micron Technology, Inc.
- Chad A. Cobbley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for packaging image sensitive electronic devices
- Patent number 7,553,688
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for improving stencil/screen print quality
- Patent number 7,476,277
- Issue date Jan 13, 2009
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable ball grid array
- Patent number 7,459,773
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded stiffener for thin substrates
- Patent number 7,423,331
- Issue date Sep 9, 2008
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging image sensitive electronic devices
- Patent number 7,419,854
- Issue date Sep 2, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array packages with thermally conductive containers
- Patent number 7,399,657
- Issue date Jul 15, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging image sensitive electronic devices
- Patent number 7,387,902
- Issue date Jun 17, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of encapsulating packaged microelectronic devices with a bar...
- Patent number 7,332,376
- Issue date Feb 19, 2008
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20140099753
- Publication date Apr 10, 2014
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...
- Publication number 20130234275
- Publication date Sep 12, 2013
- ROUND ROCK RESEARCH, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SA...
- Publication number 20130187289
- Publication date Jul 25, 2013
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20120241956
- Publication date Sep 27, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DETECTION OF MEMORY DEVICE REMOVAL, AND METHODS, DEVICES A...
- Publication number 20120243362
- Publication date Sep 27, 2012
- James Cooke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Molded Stiffener for Thin Substrates
- Publication number 20120187552
- Publication date Jul 26, 2012
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES
- Publication number 20120126386
- Publication date May 24, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...
- Publication number 20110298077
- Publication date Dec 8, 2011
- ROUND ROCK RESEARCH, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SA...
- Publication number 20110180936
- Publication date Jul 28, 2011
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DETECTION OF MEMORY DEVICE REMOVAL, AND METHODS, DEVICES A...
- Publication number 20100312965
- Publication date Dec 9, 2010
- James Cooke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20100283151
- Publication date Nov 11, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20100264532
- Publication date Oct 21, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTIVE VIAS INCLUDING SMALL DIMENSION ACTIVE SURFACE END...
- Publication number 20090294983
- Publication date Dec 3, 2009
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnect Using Locally Conductive Adhesive
- Publication number 20080093019
- Publication date Apr 24, 2008
- Micron Technology, Inc.
- Chad A. Cobbley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Techniques for packaging multiple device components
- Publication number 20070145556
- Publication date Jun 28, 2007
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabrication of package assemblies for optically interact...
- Publication number 20070108579
- Publication date May 17, 2007
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices with interconnecting units and met...
- Publication number 20070063335
- Publication date Mar 22, 2007
- Micron Technology, Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded stiffener for thin substrates
- Publication number 20060290011
- Publication date Dec 28, 2006
- Micro Technology Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensitive electronic device packages
- Publication number 20060267169
- Publication date Nov 30, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged microelectronic devices with pressure release elements and...
- Publication number 20060180907
- Publication date Aug 17, 2006
- Micron Technology, Inc.
- Stephen L. James
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding tool and a method of forming an electronic device package
- Publication number 20060169490
- Publication date Aug 3, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded stiffener for thin substrates
- Publication number 20060068527
- Publication date Mar 30, 2006
- Micron Technology Inc.
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die module and techniques for forming a stacked die module
- Publication number 20060063283
- Publication date Mar 23, 2006
- Chad A. Cobbley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable ball grid array
- Publication number 20060055020
- Publication date Mar 16, 2006
- Todd O. Bolken
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060051891
- Publication date Mar 9, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060051892
- Publication date Mar 9, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060051890
- Publication date Mar 9, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060046351
- Publication date Mar 2, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for attaching solder balls to BGA package utilizing a too...
- Publication number 20060027624
- Publication date Feb 9, 2006
- Chad A. Cobbley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic imagers with optics supports having threadless inte...
- Publication number 20060023107
- Publication date Feb 2, 2006
- Todd O. Bolken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chad Cobbley

Person

Patents Grantslast 30 patents

Techniques for packaging multiple device components

Semiconductor device structures and electronic devices including hy...

Semiconductor device including one or more stiffening elements

Techniques for packaging multiple device components

Methods of fabrication of package assemblies for optically interact...

Advanced detection of memory device removal, and methods, devices a...

Electronic devices

Methods of fabrication of package assemblies for optically interact...

Semiconductor device structures and electronic devices including sa...

Techniques for packaging multiple device components

Advanced detection of memory device removal, and methods, devices a...

Molded stiffener for thin substrates

Electronic device package

Methods of fabrication of package assemblies for optically interact...

Electrical interconnect using locally conductive adhesive

Methods of forming hybrid conductive vias including small dimension...

Electrical interconnect using locally conductive adhesive

Techniques for packaging a multiple device component

Techniques for packaging multiple device components

Stacked die module including multiple adhesives that cure at differ...

Apparatus for attaching solder balls to BGA package utilizing a too...

System for locating conductive sphere utilizing screen and hopper o...

Methods for packaging image sensitive electronic devices

Apparatus for improving stencil/screen print quality

Stackable ball grid array

Molded stiffener for thin substrates

Methods for packaging image sensitive electronic devices

Ball grid array packages with thermally conductive containers

Methods for packaging image sensitive electronic devices

Method of encapsulating packaged microelectronic devices with a bar...

Patents Applicationslast 30 patents

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...

SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SA...

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

ADVANCED DETECTION OF MEMORY DEVICE REMOVAL, AND METHODS, DEVICES A...

Molded Stiffener for Thin Substrates

ELECTRONIC DEVICES

METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...

SEMICONDUCTOR DEVICE STRUCTURES AND ELECTRONIC DEVICES INCLUDING SA...

ADVANCED DETECTION OF MEMORY DEVICE REMOVAL, AND METHODS, DEVICES A...

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

ELECTRONIC DEVICE PACKAGE

HYBRID CONDUCTIVE VIAS INCLUDING SMALL DIMENSION ACTIVE SURFACE END...

Electrical Interconnect Using Locally Conductive Adhesive

Techniques for packaging multiple device components

Methods of fabrication of package assemblies for optically interact...

Packaged microelectronic devices with interconnecting units and met...

Molded stiffener for thin substrates

Image sensitive electronic device packages

Packaged microelectronic devices with pressure release elements and...

Molding tool and a method of forming an electronic device package

Molded stiffener for thin substrates

Stacked die module and techniques for forming a stacked die module

Stackable ball grid array

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Apparatus for attaching solder balls to BGA package utilizing a too...

Microelectronic imagers with optics supports having threadless inte...