Chan Ha Hwang

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Anyang-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Package in package semiconductor device with film over wire
- Patent number 8,487,420
- Issue date Jul 16, 2013
- Amkor Technology, Inc.
- Chan Ha Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of bond pad for semiconductor die and method therefor
- Patent number 8,198,738
- Issue date Jun 12, 2012
- Amkor Technology, Inc.
- Chan Ha Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced profile stackable semiconductor package
- Patent number 8,026,589
- Issue date Sep 27, 2011
- Amkor Technology, Inc.
- Bong Chan Kim
- H01 - BASIC ELECTRIC ELEMENTS