Chandrika Prasad

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 7,564,118
- Issue date Jul 21, 2009
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 7,388,277
- Issue date Jun 17, 2008
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making fine pitch connections between devices and struc...
- Patent number 7,049,697
- Issue date May 23, 2006
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transfer join process and multilevel thin film module
- Patent number 6,998,327
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Jeffrey B. Danielson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating integrated electronic chip with an interconne...
- Patent number 6,864,165
- Issue date Mar 8, 2005
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 6,856,025
- Issue date Feb 15, 2005
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated CMOS-MEMS device and process for makin...
- Patent number 6,835,589
- Issue date Dec 28, 2004
- International Business Machines Corporation
- H. Bernhard Pogge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for making fine pitch connections between devices and struc...
- Patent number 6,737,297
- Issue date May 18, 2004
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full wafer test configuration using memory metals
- Patent number 6,724,203
- Issue date Apr 20, 2004
- International Business Machines Corporation
- Lewis S. Goldmann
- G01 - MEASURING TESTING
Information Patent Grant
Process for forming a multi-level thin-film electronic packaging st...
- Patent number 6,678,949
- Issue date Jan 20, 2004
- International Business Machines Corporation
- Chandrika Prasad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus for electroplating microscopic features unifo...
- Patent number 6,669,833
- Issue date Dec 30, 2003
- International Business Machines Corporation
- Suryanarayana Kaja
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of a hybrid integrated circuit device including an opto...
- Patent number 6,640,021
- Issue date Oct 28, 2003
- International Business Machines Corporation
- H. Bernhard Pogge
- G02 - OPTICS
Information Patent Grant
Method of making a lamination and surface planarization for multila...
- Patent number 6,632,314
- Issue date Oct 14, 2003
- International Business Machines Corporation
- RongQing Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip and wafer integration process using vertical connections
- Patent number 6,599,778
- Issue date Jul 29, 2003
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film attachment to laminate using a dendritic interconnection
- Patent number 6,600,224
- Issue date Jul 29, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,448,169
- Issue date Sep 10, 2002
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making fine pitch connections between devices and struc...
- Patent number 6,444,560
- Issue date Sep 3, 2002
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film wiring scheme utilizing inter-chip site surface wiring
- Patent number 6,444,919
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to prevent distortion and expansion of organic...
- Patent number 6,329,609
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Suryanarayana Kaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for top-to-bottom I/O nets repair in a thin fi...
- Patent number 6,323,045
- Issue date Nov 27, 2001
- International Business Machines Corporation
- Christopher Cline
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level thin-film electronic packaging structure and related me...
- Patent number 6,281,452
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for use in manufacturing semiconductor devices
- Patent number 6,149,048
- Issue date Nov 21, 2000
- International Business Machines Corporation
- William Brearley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for providing solder interconnections to semiconductor an...
- Patent number 6,099,935
- Issue date Aug 8, 2000
- International Business Machines Corporation
- William Brearley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-plane pair thin-film structure and process of manufacture
- Patent number 6,090,633
- Issue date Jul 18, 2000
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimal capture pads applied to ceramic vias in ceramic substrates
- Patent number 5,916,451
- Issue date Jun 29, 1999
- International Business Machines Corporation
- Eric Daniel Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,757,079
- Issue date May 26, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing defective electrical connections on multi-laye...
- Patent number 5,747,095
- Issue date May 5, 1998
- International Business Machines Corporation
- Michael McAllister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making area direct transfer multilayer thin film structure
- Patent number 5,534,466
- Issue date Jul 9, 1996
- International Business Machines Corporation
- Eric D. Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimal capture pads applied to ceramic vias in ceramic substrates
- Patent number 5,464,682
- Issue date Nov 7, 1995
- International Business Machines Corporation
- Eric D. Perfecto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having improved metallization
- Patent number 5,436,412
- Issue date Jul 25, 1995
- International Business Machines Corporation
- Umar M. U. Ahmad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS
- Publication number 20080230891
- Publication date Sep 25, 2008
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR...
- Publication number 20070252287
- Publication date Nov 1, 2007
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated electronic chip and interconnect device and process for...
- Publication number 20060278998
- Publication date Dec 14, 2006
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for making fine pitch connections between devices and struc...
- Publication number 20050173800
- Publication date Aug 11, 2005
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip and wafer integration process using vertical connections
- Publication number 20050121711
- Publication date Jun 9, 2005
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR...
- Publication number 20050056943
- Publication date Mar 17, 2005
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING INTEGRATED ELECTRONIC CHIP WITH AN INTERCONNE...
- Publication number 20050056942
- Publication date Mar 17, 2005
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional integrated CMOS-MEMS device and process for makin...
- Publication number 20040097002
- Publication date May 20, 2004
- International Business Machines Corporation
- H. Bernhard Pogge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin film transfer join process and multilevel thin film module
- Publication number 20040097078
- Publication date May 20, 2004
- International Business Machines Corporation
- Jeffrey B. Danielson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip and wafer integration process using vertical connections
- Publication number 20030215984
- Publication date Nov 20, 2003
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND APPARATUS FOR ELECTROPLATING MICROSCOPIC FEATURES UNIFO...
- Publication number 20030168340
- Publication date Sep 11, 2003
- Suryanarayana Kaja
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS
- Publication number 20030111733
- Publication date Jun 19, 2003
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of a hybrid integrated circuit device including an opto...
- Publication number 20030108269
- Publication date Jun 12, 2003
- International Business Machines Corporation
- H. Bernhard Pogge
- G02 - OPTICS
Information Patent Application
Process for making fine pitch connections between devices and struc...
- Publication number 20030015788
- Publication date Jan 23, 2003
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming a multi-level thin-film electronic packaging st...
- Publication number 20010037565
- Publication date Nov 8, 2001
- Chandrika Prasad
- H01 - BASIC ELECTRIC ELEMENTS

Chandrika Prasad

Person

Patents Grantslast 30 patents

Chip and wafer integration process using vertical connections

Chip and wafer integration process using vertical connections

Process for making fine pitch connections between devices and struc...

Thin film transfer join process and multilevel thin film module

Method of fabricating integrated electronic chip with an interconne...

Chip and wafer integration process using vertical connections

Three-dimensional integrated CMOS-MEMS device and process for makin...

Process for making fine pitch connections between devices and struc...

Full wafer test configuration using memory metals

Process for forming a multi-level thin-film electronic packaging st...

Process and apparatus for electroplating microscopic features unifo...

Fabrication of a hybrid integrated circuit device including an opto...

Method of making a lamination and surface planarization for multila...

Chip and wafer integration process using vertical connections

Thin film attachment to laminate using a dendritic interconnection

Apparatus and method for use in manufacturing semiconductor devices

Process for making fine pitch connections between devices and struc...

Thin film wiring scheme utilizing inter-chip site surface wiring

Method and structure to prevent distortion and expansion of organic...

Method and structure for top-to-bottom I/O nets repair in a thin fi...

Multi-level thin-film electronic packaging structure and related me...

Apparatus and method for use in manufacturing semiconductor devices

Apparatus for providing solder interconnections to semiconductor an...

Multiple-plane pair thin-film structure and process of manufacture

Minimal capture pads applied to ceramic vias in ceramic substrates

Method for repairing defective electrical connections on multi-laye...

Method for repairing defective electrical connections on multi-laye...

Method of making area direct transfer multilayer thin film structure

Minimal capture pads applied to ceramic vias in ceramic substrates

Interconnect structure having improved metallization

Patents Applicationslast 30 patents

CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR...

Integrated electronic chip and interconnect device and process for...

Process for making fine pitch connections between devices and struc...

Chip and wafer integration process using vertical connections

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR...

METHOD OF FABRICATING INTEGRATED ELECTRONIC CHIP WITH AN INTERCONNE...

Three-dimensional integrated CMOS-MEMS device and process for makin...

Thin film transfer join process and multilevel thin film module

Chip and wafer integration process using vertical connections

PROCESS AND APPARATUS FOR ELECTROPLATING MICROSCOPIC FEATURES UNIFO...

CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS

Fabrication of a hybrid integrated circuit device including an opto...

Process for making fine pitch connections between devices and struc...

Process for forming a multi-level thin-film electronic packaging st...