Chang-Hwang HUA

Person

Tao Yuan Shien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,949,008
- Issue date Apr 2, 2024
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-sinking pHEMTs having extremely uniform pinch-off/threshold vo...
- Patent number 11,177,379
- Issue date Nov 16, 2021
- WIN SEMICONDUCTORS CORP.
- Chia-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic metal structure for GaN device
- Patent number 10,720,390
- Issue date Jul 21, 2020
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for reducing compound semiconductor wafer distortion
- Patent number 10,410,979
- Issue date Sep 10, 2019
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductors having an improved high temperature resista...
- Patent number 10,374,129
- Issue date Aug 6, 2019
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for reducing compound semiconductor wafer distortion
- Patent number 10,158,212
- Issue date Dec 18, 2018
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure of semiconductor chips having via holes and metal...
- Patent number 9,704,829
- Issue date Jul 11, 2017
- Win Semiconductor Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number 9,673,186
- Issue date Jun 6, 2017
- WIN Semiconductors Corp.
- Shinichiro Takatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of backside copper metallization for semiconductor device...
- Patent number 9,548,276
- Issue date Jan 17, 2017
- WIN SEMICONDUCTORS CORP.
- Jason Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for dicing of semiconductor wafers using laser c...
- Patent number 9,287,175
- Issue date Mar 15, 2016
- Win Semiconductors Corp.
- Chang-Huang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a semiconductor chip with substrate via holes and meta...
- Patent number 9,190,374
- Issue date Nov 17, 2015
- Win Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High breakdown voltage metal-insulator-metal capacitor
- Patent number 9,178,007
- Issue date Nov 3, 2015
- WIN Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating apparatus and method
- Patent number 8,911,551
- Issue date Dec 16, 2014
- WIN Semiconductor Corp.
- Jason Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabrication method for producing semiconductor chips with enhanced...
- Patent number 8,835,283
- Issue date Sep 16, 2014
- Win Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing backside copper layer for semiconductor chips
- Patent number 8,497,206
- Issue date Jul 30, 2013
- WIN Semiconductor Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a thinned semiconductor wafer on a carrier subs...
- Patent number 8,033,011
- Issue date Oct 11, 2011
- Win Semiconductors Corp.
- Jason Chou
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of using an electroless plating for depositing a metal seed...
- Patent number 8,003,532
- Issue date Aug 23, 2011
- Win Semiconductors Corp.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20230317633
- Publication date Oct 5, 2023
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE AND GATE STRUCTURE
- Publication number 20230126870
- Publication date Apr 27, 2023
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220208999
- Publication date Jun 30, 2022
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-SINKING PHEMTS HAVING EXTREMELY UNIFORM PINCH-OFF/THRESHOLD VO...
- Publication number 20200403091
- Publication date Dec 24, 2020
- WIN Semiconductors Corp.
- Chia-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT AND CIRCUIT LAYOUT METHOD THEREOF
- Publication number 20200373225
- Publication date Nov 26, 2020
- WIN Semiconductors Corp.
- Chih-Hsien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OHMIC METAL STRUCTURE FOR GaN DEVICE
- Publication number 20190131244
- Publication date May 2, 2019
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Temperature Resistant Backside Metallization for Compound Semi...
- Publication number 20190096755
- Publication date Mar 28, 2019
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366418
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366913
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366417
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Moisture Resistant Structure of Compound Semiconductor Int...
- Publication number 20170330843
- Publication date Nov 16, 2017
- WIN Semiconductors Corp.
- Chang Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Metal Structure for Compound Semiconductor Devices
- Publication number 20170222011
- Publication date Aug 3, 2017
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Schottky Barrier Semiconductor Device Having a Nanoscale Film Inter...
- Publication number 20170194451
- Publication date Jul 6, 2017
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Integrated Chip
- Publication number 20170084592
- Publication date Mar 23, 2017
- WIN SEMICONDUCTORS CORP.
- Shinichiro TAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURE OF SEMICONDUCTOR CHIPS HAVING VIA HOLES AND METAL...
- Publication number 20160035707
- Publication date Feb 4, 2016
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...
- Publication number 20160020178
- Publication date Jan 21, 2016
- WIN SEMICONDUCTORS CORP.
- Jason CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BREAKDOWN VOLTAGE METAL-INSULATOR-METAL CAPACITOR
- Publication number 20150318342
- Publication date Nov 5, 2015
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20150206870
- Publication date Jul 23, 2015
- WIN SEMICONDUCTORS CORP.
- Shinichiro TAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF A SEMICONDUCTOR CHIP WITH SUBSTRATE VIA HOLES AND META...
- Publication number 20140252602
- Publication date Sep 11, 2014
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20140209926
- Publication date Jul 31, 2014
- WIN SEMICONDUCTORS CORP.
- Shinichiro TAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER C...
- Publication number 20140120699
- Publication date May 1, 2014
- WIN SEMICONDUCTORS CORP.
- Chang-Huang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD FOR PRODUCING SEMICONDUCTOR CHIPS WITH ENHANCED...
- Publication number 20130337634
- Publication date Dec 19, 2013
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...
- Publication number 20130277845
- Publication date Oct 24, 2013
- WIN SEMICONDUCTORS CORP.
- Jason CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF SEMICONDUCTOR CHIPS WITH ENHANCED DIE STRENGTH AND A F...
- Publication number 20130099250
- Publication date Apr 25, 2013
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS PLATING APPARATUS AND METHOD
- Publication number 20130034959
- Publication date Feb 7, 2013
- Jason CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER C...
- Publication number 20120115308
- Publication date May 10, 2012
- Chang-Huang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING BACKSIDE COPPER LAYER FOR SEMICONDUCTOR CHIPS
- Publication number 20110201192
- Publication date Aug 18, 2011
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of using an electroless plating for depositing a metal seed...
- Publication number 20110059610
- Publication date Mar 10, 2011
- WIN SEMICONDUCTORS CORP.
- Chang-Hwang Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for mounting a thinned semiconductor wafer on a carrier subs...
- Publication number 20100035405
- Publication date Feb 11, 2010
- WIN SEMICONDUCTORS CORP.
- Jason Chou
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Chang-Hwang HUA

Person

Patents Grantslast 30 patents

Semiconductor structure and method for forming the same

Gate-sinking pHEMTs having extremely uniform pinch-off/threshold vo...

Ohmic metal structure for GaN device

Structure for reducing compound semiconductor wafer distortion

Compound semiconductors having an improved high temperature resista...

Structure for reducing compound semiconductor wafer distortion

Stacked structure of semiconductor chips having via holes and metal...

Semiconductor integrated circuit

Structure of backside copper metallization for semiconductor device...

Fabrication method for dicing of semiconductor wafers using laser c...

Structure of a semiconductor chip with substrate via holes and meta...

High breakdown voltage metal-insulator-metal capacitor

Electroless plating apparatus and method

Fabrication method for producing semiconductor chips with enhanced...

Method of processing backside copper layer for semiconductor chips

Method for mounting a thinned semiconductor wafer on a carrier subs...

Method of using an electroless plating for depositing a metal seed...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP

TRANSISTOR DEVICE AND GATE STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

GATE-SINKING PHEMTS HAVING EXTREMELY UNIFORM PINCH-OFF/THRESHOLD VO...

SEMICONDUCTOR INTEGRATED CIRCUIT AND CIRCUIT LAYOUT METHOD THEREOF

OHMIC METAL STRUCTURE FOR GaN DEVICE

High Temperature Resistant Backside Metallization for Compound Semi...

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

Advanced Moisture Resistant Structure of Compound Semiconductor Int...

Gate Metal Structure for Compound Semiconductor Devices

Schottky Barrier Semiconductor Device Having a Nanoscale Film Inter...

Method for Fabricating a Semiconductor Integrated Chip

STACKED STRUCTURE OF SEMICONDUCTOR CHIPS HAVING VIA HOLES AND METAL...

STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...

HIGH BREAKDOWN VOLTAGE METAL-INSULATOR-METAL CAPACITOR

SEMICONDUCTOR INTEGRATED CIRCUIT

STRUCTURE OF A SEMICONDUCTOR CHIP WITH SUBSTRATE VIA HOLES AND META...

SEMICONDUCTOR INTEGRATED CIRCUIT

FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER C...

FABRICATION METHOD FOR PRODUCING SEMICONDUCTOR CHIPS WITH ENHANCED...

STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICE...

STRUCTURE OF SEMICONDUCTOR CHIPS WITH ENHANCED DIE STRENGTH AND A F...

ELECTROLESS PLATING APPARATUS AND METHOD

FABRICATION METHOD FOR DICING OF SEMICONDUCTOR WAFERS USING LASER C...

METHOD OF PROCESSING BACKSIDE COPPER LAYER FOR SEMICONDUCTOR CHIPS

Method of using an electroless plating for depositing a metal seed...

Method for mounting a thinned semiconductor wafer on a carrier subs...