Chao-Fu Weng

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,107,791
- Issue date Aug 31, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of forming package body
- Patent number 10,943,800
- Issue date Mar 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure, semiconductor substrate structure,...
- Patent number 9,955,590
- Issue date Apr 24, 2018
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-thinning apparatus for removing excess metal from surface m...
- Patent number 8,431,007
- Issue date Apr 30, 2013
- Advanced Semiconductor Engineering Inc.
- Shin-Luh Tarng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 8,288,854
- Issue date Oct 16, 2012
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding method for wire-bonding apparatus
- Patent number 7,581,666
- Issue date Sep 1, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-stage die-bonding method for simultaneous die-bonding of multip...
- Patent number 7,547,575
- Issue date Jun 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and manufacturing method thereof
- Patent number 7,445,944
- Issue date Nov 4, 2008
- ASE (Shanghai) Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process
- Patent number 7,261,828
- Issue date Aug 28, 2007
- Advanced Semiconductor Engineering, Inc.
- En-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure having redistribution layer with recess
- Patent number 7,253,519
- Issue date Aug 7, 2007
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process to increase bump height
- Patent number 7,144,801
- Issue date Dec 5, 2006
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package structure
- Patent number 7,064,428
- Issue date Jun 20, 2006
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making UBM pads and bumps on wafer
- Patent number 7,015,130
- Issue date Mar 21, 2006
- Advanced Semiconductor Engineering, Inc.
- Chi-Long Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump manufacturing method
- Patent number 6,989,326
- Issue date Jan 24, 2006
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication process
- Patent number 6,967,153
- Issue date Nov 22, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for preventing burnt fuse pad from further electrical con...
- Patent number 6,927,964
- Issue date Aug 9, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bumping process
- Patent number 6,921,716
- Issue date Jul 26, 2005
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of modifying tin to lead ratio in tin-lead bump
- Patent number 6,877,653
- Issue date Apr 12, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bump
- Patent number 6,875,683
- Issue date Apr 5, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution process
- Patent number 6,867,122
- Issue date Mar 15, 2005
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball fabricating process
- Patent number 6,861,346
- Issue date Mar 1, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating wafer bumps
- Patent number 6,846,719
- Issue date Jan 25, 2005
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump manufacturing method
- Patent number 6,827,252
- Issue date Dec 7, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip structure with bumps and a process for fabricating the same
- Patent number 6,812,124
- Issue date Nov 2, 2004
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing burnt fuse pad from further electrical connec...
- Patent number 6,756,256
- Issue date Jun 29, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication process
- Patent number 6,743,707
- Issue date Jun 1, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball attaching process
- Patent number 6,732,912
- Issue date May 11, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball fabrication process
- Patent number 6,723,630
- Issue date Apr 20, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication method
- Patent number 6,720,244
- Issue date Apr 13, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump fabrication method
- Patent number 6,720,243
- Issue date Apr 13, 2004
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200294964
- Publication date Sep 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF FORMING PACKAGE BODY
- Publication number 20180301361
- Publication date Oct 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE, SEMICONDUCTOR SUBSTRATE STRUCTURE,...
- Publication number 20170117240
- Publication date Apr 27, 2017
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Making the Same
- Publication number 20110285006
- Publication date Nov 24, 2011
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-THINNING APPARATUS FOR REMOVING EXCESS METAL FROM SURFACE M...
- Publication number 20100224504
- Publication date Sep 9, 2010
- Shin-Luh Trang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME
- Publication number 20100200974
- Publication date Aug 12, 2010
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrate and manufacturing method thereof
- Publication number 20080124836
- Publication date May 29, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method for wire-bonding apparatus
- Publication number 20080102539
- Publication date May 1, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDER AND DIE BONDING METHOD THEREOF
- Publication number 20080085571
- Publication date Apr 10, 2008
- Advanced Semiconductor Engeneering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrate and method of manufacturing the same
- Publication number 20080044931
- Publication date Feb 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonding apparatus and wire-bonding method thereof
- Publication number 20080035706
- Publication date Feb 14, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING STRUCTURE
- Publication number 20070252275
- Publication date Nov 1, 2007
- Advanced Semiconductor Engineering, Inc.
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation method and structure of conductive bumps
- Publication number 20060017171
- Publication date Jan 26, 2006
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE STRUCTURE
- Publication number 20050161812
- Publication date Jul 28, 2005
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE SAME
- Publication number 20050023678
- Publication date Feb 3, 2005
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[PROCESS FOR FABRICATING BUMPS]
- Publication number 20050016859
- Publication date Jan 27, 2005
- Min-Lung Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bumping process to increase bump height
- Publication number 20040266164
- Publication date Dec 30, 2004
- Advanced Semiconductor Engineering, Inc.
- Chao-Fu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[FLIP-CHIP PACKAGE SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF]
- Publication number 20040256737
- Publication date Dec 23, 2004
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[CHIP STRUCTURE]
- Publication number 20040245630
- Publication date Dec 9, 2004
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bumping process
- Publication number 20040188378
- Publication date Sep 30, 2004
- Advanced Semiconductor Engineering, Inc.
- En-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[A WAFER BUMPING PROCESS]
- Publication number 20040185649
- Publication date Sep 23, 2004
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[UNDER BUMP METALLURGY LAYER]
- Publication number 20040183195
- Publication date Sep 23, 2004
- Min-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[STRUCTURE FOR PREVENTING BURNT FUSE PAD FROM FURTHER ELECTRICAL CO...
- Publication number 20040114294
- Publication date Jun 17, 2004
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[SOLDER BALL FABRICATING PROCESS]
- Publication number 20040112944
- Publication date Jun 17, 2004
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making UBM pads and bumps on wafer
- Publication number 20040110364
- Publication date Jun 10, 2004
- Chi-Long Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP-METALLURGY LAYER
- Publication number 20030189261
- Publication date Oct 9, 2003
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND WIRE BONDING PROCESS SUITED FOR THE SAME
- Publication number 20030189249
- Publication date Oct 9, 2003
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20030189260
- Publication date Oct 9, 2003
- HO-MING TONG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER BALL ATTACHING PROCESS
- Publication number 20030164395
- Publication date Sep 4, 2003
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP FABRICATION PROCESS
- Publication number 20030166330
- Publication date Sep 4, 2003
- Ho-Ming Tong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Chao-Fu Weng

Person

Patents Grantslast 30 patents

Semiconductor package structure and method for manufacturing the same

Semiconductor package device and method of forming package body

Redistribution layer structure, semiconductor substrate structure,...

Electro-thinning apparatus for removing excess metal from surface m...

Semiconductor package and method for making the same

Wire-bonding method for wire-bonding apparatus

Two-stage die-bonding method for simultaneous die-bonding of multip...

Packaging substrate and manufacturing method thereof

Bumping process

Chip packaging structure having redistribution layer with recess

Bumping process to increase bump height

Wafer-level package structure

Method for making UBM pads and bumps on wafer

Bump manufacturing method

Bump fabrication process

Structure for preventing burnt fuse pad from further electrical con...

Wafer bumping process

Method of modifying tin to lead ratio in tin-lead bump

Method of forming bump

Redistribution process

Solder ball fabricating process

Process for fabricating wafer bumps

Bump manufacturing method

Chip structure with bumps and a process for fabricating the same

Method for preventing burnt fuse pad from further electrical connec...

Bump fabrication process

Solder ball attaching process

Solder ball fabrication process

Bump fabrication method

Bump fabrication method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF FORMING PACKAGE BODY

REDISTRIBUTION LAYER STRUCTURE, SEMICONDUCTOR SUBSTRATE STRUCTURE,...

Semiconductor Package and Method for Making the Same

ELECTRO-THINNING APPARATUS FOR REMOVING EXCESS METAL FROM SURFACE M...

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

Packaging substrate and manufacturing method thereof

Wire-bonding method for wire-bonding apparatus

DIE BONDER AND DIE BONDING METHOD THEREOF

Packaging substrate and method of manufacturing the same

Wire-bonding apparatus and wire-bonding method thereof

CHIP PACKAGING STRUCTURE

Formation method and structure of conductive bumps

WAFER-LEVEL PACKAGE STRUCTURE

CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE SAME

[PROCESS FOR FABRICATING BUMPS]

Bumping process to increase bump height

[FLIP-CHIP PACKAGE SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF]

[CHIP STRUCTURE]

Bumping process

[A WAFER BUMPING PROCESS]

[UNDER BUMP METALLURGY LAYER]

[STRUCTURE FOR PREVENTING BURNT FUSE PAD FROM FURTHER ELECTRICAL CO...

[SOLDER BALL FABRICATING PROCESS]

Method for making UBM pads and bumps on wafer

UNDER-BUMP-METALLURGY LAYER

CHIP STRUCTURE AND WIRE BONDING PROCESS SUITED FOR THE SAME

FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF

SOLDER BALL ATTACHING PROCESS

BUMP FABRICATION PROCESS