First, in the step 101, a first substrate 10 is provided. The first substrate 10 includes at least one defected packaging substrate 12 and several first packaging units 11. The first packaging units 11 are exemplified by ball grid array (BGA) substrates. In the present embodiment, the first substrate 10 includes several defected packaging units 12. The defected packaging units 12 and the first packaging units 11 are arranged on the first substrate 10 in an array. Compared to the conventional strip substrate, the array arrangement increases the number of chips packaged at the same time, so that the packaging efficiency and capacity are increased.
Next, in the step 102, the defected packaging units 12 are removed from the first substrate 10, so that at least one opening 14 is formed in the first substrate 10. In the present embodiment, after the defected packaging units 12 are removed, several openings 14 are formed in the first substrate 10.
Then, in the step 103, a second substrate 20 including at least one second packaging unit 22 is provided. In the present embodiment, the second substrate 20 includes several second packaging units 22. The second packaging units 22 are exemplified by ball grid array (BGA) substrates.
Later, in the step 104, the second packaging units 22 are separated from the second substrate 20. Preferably, the number of the second packaging units 22 separated from the second substrate 20 is the same as that of the openings 14 (as shown in
Furthermore, in the step 105, an adhesive film 15 is provided on a lower surface (the reverse side of the paper) of the first substrate 10. In the present embodiment, the adhesive film 15 is disposed on a portion of the lower surface adjacent to the openings 14. The area of the adhesive film 15 is greater than that of the openings 14. A portion of the adhesive film 15 is exposed by the openings 14. The amount of the adhesive film 15 is reduced through this arrangement of the adhesive film 15, so that the cost is decreased.
Subsequently, in the step 106, the second packaging units 22 are disposed in the openings 14. In the step 106, the second packaging units 22 are adhered to the adhesive film 15, so that the second packaging units 22 are disposed in the openings 14. The area of the openings 14 is greater than that of the second packaging units 22. The edge of each second packaging unit 22 is placed partially against an inner wall of each opening 14.
More specifically, each second packaging unit 22 includes a first side 22a and a second side 22b (as shown in
Please referring to
In the above method of manufacturing the packaging substrate of the invention, the adhesive film 15 is adhered to a portion of the lower surface adjacent to the openings 14 (as shown in
In the packaging substrate and the method of manufacturing the same according to the preferred embodiment of the invention, the defected packaging unit of the first substrate is removed, and the opening is formed correspondingly in the first substrate. Then, the good second packaging unit of the second substrate is disposed in the opening, so that all the packaging units on the first substrate are good. The area of the opening is greater than that of the second packaging unit. The second packaging unit is placed partially against the opening. The advantages are as follow.
The first packaging units and the second packaging units are arranged in an array on the packaging substrate, so that the number of the chips packaged in the same time is increased. Also, the manufacturing efficiency and capacity are increased as well.
Only the first side of each second packaging unit is placed against the inner wall of each opening, so that each second packaging unit is positioned in each opening. In the packaging process, each second packaging unit does not move relatively to the first substrate. As a result, the chips are packaged accurately.
The second side of each second packaging unit does not contact the inner wall of each opening. Therefore, the stress applied to the first substrate is relieved when each second packaging unit is disposed in each opening. As a result, the first substrate is prevented from deforming, and the packaging process is proceeded smoothly
Furthermore, because the good first packaging units of the first substrate and the good packaging units of the second substrate can be all used in the packaging process, each good packaging unit is utilized effectively. Therefore, the cost is reduced because good packaging units are not wasted.
While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Number | Date | Country | Kind |
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95130717 | Aug 2006 | TW | national |