Charles Ma

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Internally disposed cooling device for electronic apparatus
- Patent number 7,190,576
- Issue date Mar 13, 2007
- Waffer Technology Corp.
- Jack Wang
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Water-cooling heat dissipation system
- Patent number 7,069,737
- Issue date Jul 4, 2006
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating device having improved fastening structure
- Patent number 7,019,979
- Issue date Mar 28, 2006
- Waffer Technology Corp.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening structure of heat sink
- Patent number 6,968,889
- Issue date Nov 29, 2005
- Waffer Technology Corp.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening device for heat slug
- Patent number 6,882,534
- Issue date Apr 19, 2005
- Waffer Tech. Co.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning and buckling structure for use in a radiator
- Patent number 6,672,379
- Issue date Jan 6, 2004
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Positioning structure for heat dissipating fins
- Patent number 6,607,028
- Issue date Aug 19, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink assembly
- Patent number 6,595,275
- Issue date Jul 22, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating fin
- Patent number 6,571,862
- Issue date Jun 3, 2003
- Waffer Technology Corp.
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipating device for a CPU
- Patent number 6,542,370
- Issue date Apr 1, 2003
- Waffer Technology Corporation
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Heat pipe heat sink with holeless fin module
- Publication number 20060011329
- Publication date Jan 19, 2006
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermoelectric heat dissipation device and method for fabricating t...
- Publication number 20060005944
- Publication date Jan 12, 2006
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Internally disposed cooling device for electronic apparatus
- Publication number 20050281016
- Publication date Dec 22, 2005
- Jack Wang
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Air conditioning heat dissipation system
- Publication number 20050254213
- Publication date Nov 17, 2005
- Jack Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Water-cooling heat dissipation system
- Publication number 20050230086
- Publication date Oct 20, 2005
- Jack Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATING DEVICE HAVING IMPROVED FASTENING STRUCTURE
- Publication number 20050111190
- Publication date May 26, 2005
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fastening structure of heat sink
- Publication number 20050111196
- Publication date May 26, 2005
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fastening structure of heat sink
- Publication number 20050109488
- Publication date May 26, 2005
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fastening device for heat slug
- Publication number 20040130875
- Publication date Jul 8, 2004
- WAFFER TECHNOLOGY CORP.
- Jack Wang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Internally disposed cooling device for electronic apparatus

Water-cooling heat dissipation system

Heat dissipating device having improved fastening structure

Fastening structure of heat sink

Fastening device for heat slug

Positioning and buckling structure for use in a radiator

Positioning structure for heat dissipating fins

Heat sink assembly

Heat dissipating fin

Heat dissipating device for a CPU

Patents Applicationslast 30 patents

Heat pipe heat sink with holeless fin module

Thermoelectric heat dissipation device and method for fabricating t...

Internally disposed cooling device for electronic apparatus

Air conditioning heat dissipation system

Water-cooling heat dissipation system

HEAT DISSIPATING DEVICE HAVING IMPROVED FASTENING STRUCTURE

Fastening structure of heat sink

Fastening structure of heat sink

Fastening device for heat slug