Patent Application
20060011329
The present invention relates in general to a heat pipe heat sink, and more particularly, to a heat pipe heat sink with a holeless fin module. Because of the holeless arrangement the present invention is much more convenient for manufacturing a heat pipe heat sink. The heat generated by an electrical component can quickly be transferred into the heat pipe and uniformly distributed to each of the heat dissipating fins.
Currently, the most common heat dissipation device is a cooling fan which is fixed onto the housing of some piece of electrical equipment. This cooling fan facilitates air circulation by replacing the inner heated air with the cooler outer air. If a system only uses cooling fans to dissipate heat, it may have poor performance though. It may have poor performance because the air brought in from the outside may not always be much cooler than the air in the system's interior; in the summer the exterior temperature could reach 35 degree C. or more. Therefore, installing more cooling fans is in vain. Moreover, within a system's housing there is not much extra space that could be used for the installation of extra fans.
Another heat dissipating device utilized to remove the heat generated by electrical components is the heat sink, which includes a heat sink base and a fin module mounted on the base. The fin module is mounted on an electrical component via the heat sink base in order to absorb the heat which is generated by the electrical component. The heat absorbed by the fin module is then dissipated into the air. These fins are fabricated from a highly conductive material and formed into distinct sheet elements which are further assembled into a module by some means of assembly.
There are many different combinations of the heat dissipating fin module. One of the combinations is the heat pipe and heat dissipating fin combination, as illustrated in
However, the conventional means of combining the heat dissipating fin module with the heat pipe is through “plugging the heat pipes directly into the holes bored through the heat dissipating fin module by utilizing their difference in diameter.” In other words, the inner diameters of the holes of the heat dissipating fin module are slightly smaller than the exterior diameter of the heat pipe. Such a method is likely to damage or distort the heat dissipation fin module though. It is because of this damage or distortion, which occurs during assembly, that the tight fit between the heat pipe and the fin module is not optimal. To remedy this problem, hot solder is injected to fill the gap between the heat pipe and the fin module. However, remedying the gaps caused by the forcible insertion through the injection of hot solder does not greatly enhance performance. Further, the application of the injection remedy is difficult. Gravity causes the solder to be distributed unequally; the solder collects at the bottom of the gap leaving the top of the gap unfilled. Because there is no solder at the top of the gap, there is no connection at that location between the heat pipe and the fin module to help facilitate heat conductivity.
Another structural configuration of the heat pipe and the heat dissipating fin module is disclosed in a Taiwan design patent, No. 506689, a heat dissipating device. This invention includes several heat dissipating plates with one or more holes bored through them. The plates are made of a highly conductive material. There is a circular wall formed around each of the holes. The circular wall has one or more open slots. The heat conducting column, which is made of a highly conductive material, has a rod shape. The heat conducting column is forcibly inserted into the holes of the heat dissipating plates. This configuration has an improved tight fit. However, because the heat conducting column is forcibly inserted into the bored holes, the distortion problem of the heat dissipating plates still exists. The soldering problem also still exists when the distortion problem of the heat dissipating plates is remedied; the hot solder still flows down and concentrates at the lower semi-circle of the circular wall.
Yet another variation of the structure of the heat pipe and the heat dissipating fin module is disclosed in a Taiwan design patent, No. 491517, a formed structure of heat dissipating fin. The invention includes a heat pipe and several heat dissipating fins with holes bored through them. There are conjoining sections which extend from one side of the bored holes, and narrow slots cut from the upper portions of the holes and the conjoining sections. The heat pipe is forcibly inserted into the bored holes and the conjoining sections of the heat dissipating fins. A third metal material, such as silver, tin, or copper filament, is inserted into the narrow slot, and further soldered onto the slot. The heat dissipating fins are, thereby, combined with the heat pipe. However, this structure requires the insertion and soldering of the third metal material. The third metal material cannot thoroughly flow into the gap which is between the bored hole and the heat pipe. Because of this, many gaps still remain between the bored holes and the heat pipe.
The present invention is to remedy the poor thermal connection problem of the conventional art, which is caused by the forcibly insertion of the heat pipe, and the difficulty of adhesive applying.
The heat pipe heat sink provided by the present invention has a holeless heat dissipating fin module which is not only much more convenient for manufacturing a heat pipe heat sink, but also capable of quickly transferring the heat generated by an electrical component into the heat pipe and uniformly distributing the heat to each of the heat dissipating fins.
The heat pipe heat sink includes a heat dissipating fin module, a heat conducting member, one or more heat pipes installed on the heat conducting member, and a heat conducting plate which is thermally connected to the heat conducting member and the electrical component. The heat pipe is semi-inserted into the concave trench of the heat conducting member with a portion of its surface exposed from the concave trench. The end surface of the heat conducting member with the heat pipe installed thereon is convenient for application of an adhesive. This convenient application is achieved because the end surface and the pipe wall of the heat pipe are exposed outside of the heat dissipating fin module before any combination takes place.
The top of the heat conducting plate is attached to the bottom surface of the heat conducting member, while the bottom of the heat conducting plate is thermally connected to the top surface of an electrical component. Via the heat conducting plate, a uniform heat connection end surface is formed below the heat conducting member. The heat transferred into the heat conducting plate has dual routes for simultaneous transfer; heat can be transferred to the heat dissipating fin module via either the heat conducting member or the heat pipe. The heat transferred is equally distributed among the heat dissipating fins of the heat dissipating fin module for quick dissipation into the surrounding air. The present invention more efficiently dissipates heat than the conventional art. The present invention, therefore, enhances the state of the art.
These and other objectives of the present invention will become obvious to those of ordinary skill in the art after reading the following detailed description of preferred embodiments.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
These as well as other features of the present invention will become more apparent upon reference to the drawings therein:
Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Referring to
The heat dissipating fin module 1, as illustrated in
The heat conducting member 2 is a block shaped structure composed of a highly conductive material. There is no special limit regarding the shape of the heat conducting member 2. The only requirement of the heat conducting member 2 is that its shape fits with the connecting portion 12 of the heat dissipating fin module 1, and thermally connects the heat connecting member 2 to the heat conducting plate 4. The trapezoid structure disclosed in
The heat pipe 3 is inserted into a pair of concave trenches 21 of the heat conducting member 2. The pipe body 30 of the heat pipe 3 is embedded inside the concave trench 21, while the planar pipe wall 31 of the heat pipe 3 is exposed outside and coplanar with the end surface 20 of the heat conducting member 2.
The heat conducting plate 4 is constructed from a highly conductive plate material. The heat conducting plate 4 includes an upper surface 41 and a lower surface 42. The upper surface 41 of the heat conducting plate 4 is attached to the bottom surface of the heat conducting member 2, and is thermally connected to the planar pipe walls 31 of the heat pipe 2. The preferred thermal connection is a high fitness surface contact connection, as illustrated in
The planar end surface of heat conducting member 2 installed with the heat pipe 3 is correspondingly assembled and thermally connected to the connecting portion 12 of the heat dissipating fin module 1. The combination of the planar pipe wall 31 of the heat pipe 3 and the connecting portion 12 of the heat dissipating fin module 1 is, therefore, a high fitness multi-areas contact combination as illustrated in
Referring to
In aforementioned embodiments, because the heat pipe 3 has a plane bottom, the combination of the heat conducting member 2 and the heat conducting plate 4 is a planar surface attachment. In another embodiment the heat pipe 3 may has a cylindrical shape, while the heat conducting plate 4 may accordingly change the shape thereof. Referring to
