Chen-Ming CHEN

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming semiconductor device
- Patent number 12,159,812
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Lung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displays with reduced temperature luminance sensitivity
- Patent number 12,154,515
- Issue date Nov 26, 2024
- Apple Inc.
- Shinya Ono
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,148,671
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor gate structures and methods of forming the same
- Patent number 12,142,655
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistor and method of forming the same
- Patent number 12,136,657
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified polyurethane carrier substrate
- Patent number 12,129,334
- Issue date Oct 29, 2024
- KUROKI INDUSTRIAL CO., LTD.
- Chih-Lung Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with nickel layer
- Patent number 12,125,715
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having metal thermal interface material
- Patent number 12,119,237
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection apparatus and anti-bending device thereof
- Patent number 12,099,083
- Issue date Sep 24, 2024
- JTRON TECHNOLOGY CORP.
- Chen-Nan Chen
- G01 - MEASURING TESTING
Information Patent Grant
Multi-channel devices and methods of manufacture
- Patent number 12,087,638
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,074,193
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data storage device and data storage system
- Patent number 12,067,235
- Issue date Aug 20, 2024
- Silicon Motion, Inc.
- Chen-Hao Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package and package-on-package structure having elliptical columns...
- Patent number 12,051,634
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure
- Patent number 12,046,588
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer including a copper edge seal ring structure and methods...
- Patent number 12,040,289
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including gate structures with gate spacers
- Patent number 12,034,056
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithium battery structure
- Patent number 12,034,158
- Issue date Jul 9, 2024
- Industrial Technology Research Institute
- Li-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 12,027,624
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages including multiple encapsulated substrate blocks and overl...
- Patent number 12,027,435
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming probe head structure
- Patent number 12,019,097
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,002,716
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with metal-containing layer
- Patent number 12,002,746
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Huan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture
- Patent number 11,978,720
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer device, setting method for memory module, and mainboard
- Patent number 11,977,756
- Issue date May 7, 2024
- Giga-Byte Technology Co., Ltd.
- Chia-Chih Chien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Display with Silicon Gate Drivers and Semiconducting Oxide Pixels
- Publication number 20240420646
- Publication date Dec 19, 2024
- Apple Inc.
- Shinya Ono
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD AND SYSTEM FOR AUTOMATICALLY RECORDING AND TRANSMITTING PARK...
- Publication number 20240420572
- Publication date Dec 19, 2024
- TUNG THIH ELECTRONIC CO., LTD.
- TE-HSUAN FENG
- G08 - SIGNALLING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387275
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20240387192
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH EDGE DIELECTRIC FIN STRUCTURES AND METHO...
- Publication number 20240387539
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
- Publication number 20240387680
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bridge device and method for transferring command and data between...
- Publication number 20240378162
- Publication date Nov 14, 2024
- SILICON MOTION, INC.
- Chen-Hao Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379491
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory controller, bridge device and method for transferring comman...
- Publication number 20240377946
- Publication date Nov 14, 2024
- SILICON MOTION, INC.
- Chen-Hao Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIN-END GATE STRUCTURES AND METHOD FORMING SAME
- Publication number 20240379821
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHANNEL LAST PROCESS FOR DUMMY GATE VOID DEFECT REDUCTION
- Publication number 20240379827
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...
- Publication number 20240371656
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Li KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHANNEL DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240363425
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20240363676
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240355795
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dong-Han Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240332422
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...
- Publication number 20240332220
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS
- Publication number 20240321661
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER
- Publication number 20240312900
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Huan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Methods of Forming the Same
- Publication number 20240304535
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE HEAD STRUCTURE
- Publication number 20240302410
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240282639
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wen SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240266226
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Yao Lin
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240266209
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Han LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE
- Publication number 20240258266
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Stacked Layers and Devices Formed Thereof
- Publication number 20240243011
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLLOW COMPOSITE BICYCLE COMPONENT AND METHOD OF MANUFACTURING THE...
- Publication number 20240190050
- Publication date Jun 13, 2024
- SRAM, LLC
- Chia Chang CHANG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Chen-Ming CHEN

Person

Patents Grantslast 30 patents

Method of forming semiconductor device

Displays with reduced temperature luminance sensitivity

Semiconductor devices and methods of manufacturing thereof

Transistor gate structures and methods of forming the same

Field-effect transistor and method of forming the same

Modified polyurethane carrier substrate

Semiconductor package and method of manufacturing semiconductor pac...

Chip package structure with nickel layer

Semiconductor device package having metal thermal interface material

Package structure with protective lid

Stress reduction apparatus and method

Detection apparatus and anti-bending device thereof

Multi-channel devices and methods of manufacture

Bump structure having a side recess and semiconductor structure inc...

Semiconductor device structure with magnetic element

Data storage device and data storage system

Package and package-on-package structure having elliptical columns...

Package on package structure

Interposer including a copper edge seal ring structure and methods...

Semiconductor devices including gate structures with gate spacers

Lithium battery structure

Semiconductor devices and methods of manufacturing thereof

Packages including multiple encapsulated substrate blocks and overl...

Method for forming probe head structure

Method of manufacturing a semiconductor device and a semiconductor...

Chip package structure with metal-containing layer

Package structure with a barrier layer

Semiconductor device package and methods of manufacture

Computer device, setting method for memory module, and mainboard

Solderless interconnection structure and method of forming same

Patents Applicationslast 30 patents

Display with Silicon Gate Drivers and Semiconducting Oxide Pixels

METHOD AND SYSTEM FOR AUTOMATICALLY RECORDING AND TRANSMITTING PARK...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

SEMICONDUCTOR DEVICES WITH EDGE DIELECTRIC FIN STRUCTURES AND METHO...

FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME

Bridge device and method for transferring command and data between...

PACKAGE STRUCTURE WITH PROTECTIVE LID

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Memory controller, bridge device and method for transferring comman...

FIN-END GATE STRUCTURES AND METHOD FORMING SAME

CHANNEL LAST PROCESS FOR DUMMY GATE VOID DEFECT REDUCTION

METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...

MULTI-CHANNEL DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

PACKAGE ON PACKAGE STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...

PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS

CHIP PACKAGE STRUCTURE WITH METAL-CONTAINING LAYER

Integrated Circuit Package and Methods of Forming the Same

PROBE HEAD STRUCTURE

PACKAGE STRUCTURE WITH A BARRIER LAYER

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF MANUFACTURE

Methods for Forming Stacked Layers and Devices Formed Thereof

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

HOLLOW COMPOSITE BICYCLE COMPONENT AND METHOD OF MANUFACTURING THE...