Cheng-Jung Ko

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit substrate structure and manufacturing method thereof
- Patent number 12,243,838
- Issue date Mar 4, 2025
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP composition including anionic and cationic inhibitors
- Patent number 12,234,382
- Issue date Feb 25, 2025
- CMC MATERIALS LLC
- Hsin-Yen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and manufacturing method thereof
- Patent number 12,185,479
- Issue date Dec 31, 2024
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing carbide protective layer
- Patent number 12,084,388
- Issue date Sep 10, 2024
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Chih-Hsing Wang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Package structure and manufacturing method of the same
- Patent number 12,062,742
- Issue date Aug 13, 2024
- Unimicron Technology Corp.
- Hao-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,991,824
- Issue date May 21, 2024
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode package structure and manufacturing method the...
- Patent number 11,955,587
- Issue date Apr 9, 2024
- Unimicron Technology Corp.
- Jeng-Ting Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,943,877
- Issue date Mar 26, 2024
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal image-based temperature measurement calibration method and...
- Patent number 11,818,334
- Issue date Nov 14, 2023
- Industrial Technology Research Institute
- Cheng Da Ko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,764,344
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structure and manufacturing method thereof
- Patent number 11,764,120
- Issue date Sep 19, 2023
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,710,690
- Issue date Jul 25, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of carrier structure
- Patent number 11,690,180
- Issue date Jun 27, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,682,612
- Issue date Jun 20, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of chip package structure
- Patent number 11,637,047
- Issue date Apr 25, 2023
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium dioxide containing ruthenium chemical mechanical polishing...
- Patent number 11,629,271
- Issue date Apr 18, 2023
- CMC Materials, Inc.
- Jin-Hao Jhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,516,910
- Issue date Nov 29, 2022
- Unimicron Technology Corp.
- Chia-Yu Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,476,234
- Issue date Oct 18, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 11,462,452
- Issue date Oct 4, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber device and manufacturing method thereof
- Patent number 11,460,255
- Issue date Oct 4, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,445,617
- Issue date Sep 13, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device bonding structure and fabrication method thereof
- Patent number 11,424,216
- Issue date Aug 23, 2022
- Unimicron Technology Corp.
- Chia-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,410,971
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,410,933
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with structure reinforcing element and manufactur...
- Patent number 11,410,940
- Issue date Aug 9, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-machine-body device
- Patent number 11,366,497
- Issue date Jun 21, 2022
- Pegatron Corporation
- Cheng-Shi Jiang
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Mask structure and manufacturing method thereof
- Patent number 11,366,381
- Issue date Jun 21, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP COMPOSITION INCLUDING ANIONIC AND CATIONIC INHIBITORS
- Publication number 20240352280
- Publication date Oct 24, 2024
- CMC Materials LLC
- Hsin-Yen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
- Publication number 20240357748
- Publication date Oct 24, 2024
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE
- Publication number 20240306298
- Publication date Sep 12, 2024
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240248264
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240251504
- Publication date Jul 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING CARBIDE PROTECTIVE LAYER
- Publication number 20240239712
- Publication date Jul 18, 2024
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- CHIH-HSING WANG
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MANAGING PUBLIC LAND MOBILE NETWORK SELECT...
- Publication number 20240224161
- Publication date Jul 4, 2024
- MADIATEK INC.
- Shuang-An Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ANTI-DIFFUSION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240167163
- Publication date May 23, 2024
- Unimicron Technology Corp.
- YI LING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATER QUALITY DETECTION DEVICE AND CLEANING METHOD FOR SENSOR THEREOF
- Publication number 20240142428
- Publication date May 2, 2024
- Industrial Technology Research Institute
- Tsung-Yu TSAI
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138059
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AVOID ACCESS BARRING FOR MT SERVICE
- Publication number 20240057200
- Publication date Feb 15, 2024
- MEDIATEK INC.
- Yu-Hsin Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402391
- Publication date Dec 14, 2023
- Unimicron Technology Corp.
- Ying-Chu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING DEVICE AND ETCHING METHOD
- Publication number 20230335419
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230240023
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Wen-Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230231087
- Publication date Jul 20, 2023
- Unimicron Technology Corp.
- Hao-Wei TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ADJUSTING THERMAL FIELD OF SILICON CARBIDE SINGLE CRYSTA...
- Publication number 20230227998
- Publication date Jul 20, 2023
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- HSUEH-I CHEN
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF ENHANCING SILICON CARBIDE MONOCRYSTALLINE GROWTH YIELD
- Publication number 20230167579
- Publication date Jun 1, 2023
- NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- CHIH-WEI KUO
- C30 - CRYSTAL GROWTH
Information Patent Application
CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230163074
- Publication date May 25, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230164928
- Publication date May 25, 2023
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE
- Publication number 20230137841
- Publication date May 4, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE
- Publication number 20230067112
- Publication date Mar 2, 2023
- Unimicron Technology Corp.
- Ra-Min Tain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20220375919
- Publication date Nov 24, 2022
- Unimicron Technology Corp.
- Kai-Ming YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20220367307
- Publication date Nov 17, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220344248
- Publication date Oct 27, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS

Cheng-Jung Ko

Person

Patents Grantslast 30 patents

Circuit substrate structure and manufacturing method thereof

CMP composition including anionic and cationic inhibitors

Flexible circuit board and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Method for preparing carbide protective layer

Package structure and manufacturing method of the same

Circuit board structure and manufacturing method thereof

Light emitting diode package structure and manufacturing method the...

Circuit board structure and manufacturing method thereof

Manufacturing method of package structure

Thermal image-based temperature measurement calibration method and...

Package structure and manufacturing method thereof

Chip packaging structure and manufacturing method thereof

Package structure and manufacturing method thereof

Manufacturing method of carrier structure

Package structure and manufacturing method thereof

Circuit board structure and manufacturing method thereof

Manufacturing method of chip package structure

Titanium dioxide containing ruthenium chemical mechanical polishing...

Circuit board structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Vapor chamber device and manufacturing method thereof

Package structure and manufacturing method thereof

Electronic device bonding structure and fabrication method thereof

Chip package structure

Package structure and manufacturing method thereof

Package structure with structure reinforcing element and manufactur...

Multi-machine-body device

Mask structure and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

CMP COMPOSITION INCLUDING ANIONIC AND CATIONIC INHIBITORS

SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD STRUCTURE

PACKAGE STRUCTURE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR PREPARING CARBIDE PROTECTIVE LAYER

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND APPARATUS FOR MANAGING PUBLIC LAND MOBILE NETWORK SELECT...

ANTI-DIFFUSION SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

WATER QUALITY DETECTION DEVICE AND CLEANING METHOD FOR SENSOR THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

AVOID ACCESS BARRING FOR MT SERVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ETCHING DEVICE AND ETCHING METHOD

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD OF THE SAME

METHOD FOR ADJUSTING THERMAL FIELD OF SILICON CARBIDE SINGLE CRYSTA...

METHOD OF ENHANCING SILICON CARBIDE MONOCRYSTALLINE GROWTH YIELD

CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT CARRIER AND MANUFACTURING METHOD THEREOF AND PACKAGE STRUCTURE

VAPOR CHAMBER STRUCTURE

MANUFACTURING METHOD OF PACKAGE STRUCTURE

MANUFACTURING METHOD OF CHIP PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF