Chengwen Pei

Person

Danbury, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Anti-fuse with reduced programming voltage
- Patent number 10,886,284
- Issue date Jan 5, 2021
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal trench capacitor and improved isolation and methods of manufa...
- Patent number 10,818,668
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Roger A. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse with reduced programming voltage
- Patent number 10,586,800
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical and optical via connections on a same chip
- Patent number 10,403,772
- Issue date Sep 3, 2019
- GLOBALFOUNDRIES Inc.
- Juntao Li
- G02 - OPTICS
Information Patent Grant
Wafer reinforcement to reduce wafer curvature
- Patent number 10,304,783
- Issue date May 28, 2019
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal-insulator-metal (MIM) decoupling capacitor in monoli...
- Patent number 10,290,574
- Issue date May 14, 2019
- GLOBALFOUNDRIES Inc.
- Geng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse with reduced programming voltage
- Patent number 10,224,334
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit fabrication with boron etch-stop layer
- Patent number 10,224,418
- Issue date Mar 5, 2019
- GLOBALFOUNDRIES Inc.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with asymmetrical transistor, asymmetrical transistor a...
- Patent number 10,181,468
- Issue date Jan 15, 2019
- GLOBALFOUNDRIES Inc.
- Ziyan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric FET
- Patent number 10,079,280
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin structure in sublitho dimension for high performance CMOS appli...
- Patent number 9,972,621
- Issue date May 15, 2018
- GLOBALFOUNDRIES Inc.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire-based vertical memory cell array having a back plate and n...
- Patent number 9,966,431
- Issue date May 8, 2018
- GLOBALFOUNDRIES Inc.
- Waikin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density capacitor structure and method
- Patent number 9,960,226
- Issue date May 1, 2018
- GLOBALFOUNDRIES Inc.
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical and optical via connections on a same chip
- Patent number 9,929,290
- Issue date Mar 27, 2018
- GLOBALFOUNDRIES Inc.
- Juntao Li
- G02 - OPTICS
Information Patent Grant
Metal trench capacitor and improved isolation and methods of manufa...
- Patent number 9,899,391
- Issue date Feb 20, 2018
- International Business Machines Corporation
- Roger A. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming mandrel and non-mandrel metal lines having variab...
- Patent number 9,870,942
- Issue date Jan 16, 2018
- GLOBALFOUNDRIES Inc.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric FET
- Patent number 9,859,373
- Issue date Jan 2, 2018
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuses with reduced programming voltages
- Patent number 9,852,982
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reinforcement to reduce wafer curvature
- Patent number 9,852,999
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit fabrication with boron etch-stop layer
- Patent number 9,842,913
- Issue date Dec 12, 2017
- GLOBALFOUNDRIES Inc.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Commonly-bodied field-effect transistors
- Patent number 9,818,652
- Issue date Nov 14, 2017
- GLOBALFOUNDRIES Inc.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse with reduced programming voltage
- Patent number 9,806,084
- Issue date Oct 31, 2017
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density capacitor structure and method
- Patent number 9,755,013
- Issue date Sep 5, 2017
- GLOBALFOUNDRIES Inc.
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigurable multi-stack inductor
- Patent number 9,741,485
- Issue date Aug 22, 2017
- International Business Machines Corporation
- Pinping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming metal semiconductor alloys in contact holes and...
- Patent number 9,735,268
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Christian Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip semiconductor device having enhanced variability
- Patent number 9,691,718
- Issue date Jun 27, 2017
- International Business Machines Corporation
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip finFET structures to implement physical unclonable function...
- Patent number 9,666,582
- Issue date May 30, 2017
- GLOBALFOUNDRIES Inc.
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal buffer layer in source and drain regions of fin-type tran...
- Patent number 9,634,084
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Christopher D. Sheraw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-type metal-semiconductor resistors and fabrication methods thereof
- Patent number 9,595,518
- Issue date Mar 14, 2017
- GLOBALFOUNDRIES Inc.
- Anthony I-Chih Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal trench capacitor and improved isolation and methods of manufa...
- Patent number 9,583,497
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Roger A. Booth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE
- Publication number 20200091161
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE
- Publication number 20190019803
- Publication date Jan 17, 2019
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURES INCLUDING NOTCH WI...
- Publication number 20180366562
- Publication date Dec 20, 2018
- GLOBALFOUNDRIES INC.
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL-INSULATOR-METAL (MIM) DECOUPLING CAPACITOR IN MONOLI...
- Publication number 20180204796
- Publication date Jul 19, 2018
- GLOBALFOUNDRIES INC.
- Geng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY MEMORY CELL STRUCTURES
- Publication number 20180190770
- Publication date Jul 5, 2018
- GLOBALFOUNDRIES INC.
- Waikin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL AND OPTICAL VIA CONNECTIONS ON A SAME CHIP
- Publication number 20180158967
- Publication date Jun 7, 2018
- GLOBALFOUNDRIES INC.
- Juntao Li
- G02 - OPTICS
Information Patent Application
MEMORY CELL WITH ASYMMETRICAL TRANSISTOR, ASYMMETRICAL TRANSISTOR A...
- Publication number 20180122795
- Publication date May 3, 2018
- GLOBALFOUNDRIES INC.
- Ziyan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TRENCH CAPACITOR AND IMPROVED ISOLATION AND METHODS OF MANUFA...
- Publication number 20180083009
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Roger A. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FABRICATION WITH BORON ETCH-STOP LAYER
- Publication number 20180061969
- Publication date Mar 1, 2018
- GLOBALFOUNDRIES INC.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE
- Publication number 20180012897
- Publication date Jan 11, 2018
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE
- Publication number 20180005961
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSES WITH REDUCED PROGRAMMING VOLTAGES
- Publication number 20170373005
- Publication date Dec 28, 2017
- GLOBALFOUNDRIES INC.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC FET
- Publication number 20170373148
- Publication date Dec 28, 2017
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL AND OPTICAL VIA CONNECTIONS ON A SAME CHIP
- Publication number 20170365725
- Publication date Dec 21, 2017
- GLOBALFOUNDRIES INC.
- Juntao Li
- G02 - OPTICS
Information Patent Application
Reconfigurable MOS Varactor
- Publication number 20170358691
- Publication date Dec 14, 2017
- GLOBALFOUNDRIES INC.
- Kai Xiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FABRICATION WITH BORON ETCH-STOP LAYER
- Publication number 20170338329
- Publication date Nov 23, 2017
- GLOBALFOUNDRIES INC.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR STRUCTURE AND METHOD
- Publication number 20170323937
- Publication date Nov 9, 2017
- GLOBALFOUNDRIES INC.
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES FOR CIRCUITS SHARING A SUBSTRATE
- Publication number 20170317166
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMONLY-BODIED FIELD-EFFECT TRANSISTORS
- Publication number 20170316986
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY MEMORY CELL STRUCTURES
- Publication number 20170278927
- Publication date Sep 28, 2017
- GLOBALFOUNDRIES INC.
- Waikin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TRENCH CAPACITOR AND IMPROVED ISOLATION AND METHODS OF MANUFA...
- Publication number 20170117280
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Roger A. Booth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE
- Publication number 20170098616
- Publication date Apr 6, 2017
- International Business Machines Corporation
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING METAL SEMICONDUCTOR ALLOYS IN CONTACT HOLES AND...
- Publication number 20160343664
- Publication date Nov 24, 2016
- International Business Machines Corporation
- Christian Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCING DEVICE VARIATION FOR SECURITY APPLICATIONS
- Publication number 20160329287
- Publication date Nov 10, 2016
- GLOBALFOUNDRIES INC.
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CAPACITOR STRUCTURE AND METHOD
- Publication number 20160315138
- Publication date Oct 27, 2016
- International Business Machines Corporation
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC FET
- Publication number 20160276437
- Publication date Sep 22, 2016
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP SEMICONDUCTOR DEVICE HAVING ENHANCED VARIABILITY
- Publication number 20160247770
- Publication date Aug 25, 2016
- International Business Machines Corporation
- Wai-Kin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FORMATION ON AN INSULATING LAYER
- Publication number 20160181164
- Publication date Jun 23, 2016
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO PREVENT DEEP TRENCH MOAT CHARGING AND MOAT ISOLATION F...
- Publication number 20160172314
- Publication date Jun 16, 2016
- GLOBALFOUNDRIES INC.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE FOR TRENCH FUSE COMPONENT WITH METHODS OF FABRICATION
- Publication number 20160163642
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Toshiaki Kirihata
- H01 - BASIC ELECTRIC ELEMENTS

Chengwen Pei

Person

Patents Grantslast 30 patents

Anti-fuse with reduced programming voltage

Metal trench capacitor and improved isolation and methods of manufa...

Anti-fuse with reduced programming voltage

Electrical and optical via connections on a same chip

Wafer reinforcement to reduce wafer curvature

Embedded metal-insulator-metal (MIM) decoupling capacitor in monoli...

Anti-fuse with reduced programming voltage

Integrated circuit fabrication with boron etch-stop layer

Memory cell with asymmetrical transistor, asymmetrical transistor a...

Asymmetric FET

Fin structure in sublitho dimension for high performance CMOS appli...

Nanowire-based vertical memory cell array having a back plate and n...

High density capacitor structure and method

Electrical and optical via connections on a same chip

Metal trench capacitor and improved isolation and methods of manufa...

Method of forming mandrel and non-mandrel metal lines having variab...

Asymmetric FET

Anti-fuses with reduced programming voltages

Wafer reinforcement to reduce wafer curvature

Integrated circuit fabrication with boron etch-stop layer

Commonly-bodied field-effect transistors

Anti-fuse with reduced programming voltage

High density capacitor structure and method

Reconfigurable multi-stack inductor

Method for forming metal semiconductor alloys in contact holes and...

On-chip semiconductor device having enhanced variability

On-chip finFET structures to implement physical unclonable function...

Conformal buffer layer in source and drain regions of fin-type tran...

Fin-type metal-semiconductor resistors and fabrication methods thereof

Metal trench capacitor and improved isolation and methods of manufa...

Patents Applicationslast 30 patents

ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE

ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE

METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURES INCLUDING NOTCH WI...

EMBEDDED METAL-INSULATOR-METAL (MIM) DECOUPLING CAPACITOR IN MONOLI...

HIGH DENSITY MEMORY CELL STRUCTURES

ELECTRICAL AND OPTICAL VIA CONNECTIONS ON A SAME CHIP

MEMORY CELL WITH ASYMMETRICAL TRANSISTOR, ASYMMETRICAL TRANSISTOR A...

METAL TRENCH CAPACITOR AND IMPROVED ISOLATION AND METHODS OF MANUFA...

INTEGRATED CIRCUIT FABRICATION WITH BORON ETCH-STOP LAYER

ANTI-FUSE WITH REDUCED PROGRAMMING VOLTAGE

WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE

ANTI-FUSES WITH REDUCED PROGRAMMING VOLTAGES

ASYMMETRIC FET

ELECTRICAL AND OPTICAL VIA CONNECTIONS ON A SAME CHIP

Reconfigurable MOS Varactor

INTEGRATED CIRCUIT FABRICATION WITH BORON ETCH-STOP LAYER

HIGH DENSITY CAPACITOR STRUCTURE AND METHOD

ISOLATION STRUCTURES FOR CIRCUITS SHARING A SUBSTRATE

COMMONLY-BODIED FIELD-EFFECT TRANSISTORS

HIGH DENSITY MEMORY CELL STRUCTURES

METAL TRENCH CAPACITOR AND IMPROVED ISOLATION AND METHODS OF MANUFA...

WAFER REINFORCEMENT TO REDUCE WAFER CURVATURE

METHOD FOR FORMING METAL SEMICONDUCTOR ALLOYS IN CONTACT HOLES AND...

INDUCING DEVICE VARIATION FOR SECURITY APPLICATIONS

HIGH DENSITY CAPACITOR STRUCTURE AND METHOD

ASYMMETRIC FET

ON-CHIP SEMICONDUCTOR DEVICE HAVING ENHANCED VARIABILITY

FIN FORMATION ON AN INSULATING LAYER

STRUCTURE TO PREVENT DEEP TRENCH MOAT CHARGING AND MOAT ISOLATION F...

WIRING STRUCTURE FOR TRENCH FUSE COMPONENT WITH METHODS OF FABRICATION