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Chengyu Niu
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Fishkill, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Methods and devices for enhancing mobility of charge carriers
Patent number
10,553,497
Issue date
Feb 4, 2020
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming metal-gate semiconductor devices with enhanced m...
Patent number
10,546,789
Issue date
Jan 28, 2020
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and devices for enhancing mobility of charge carriers
Patent number
10,438,856
Issue date
Oct 8, 2019
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method, apparatus, and system for MOL interconnects without titaniu...
Patent number
10,026,693
Issue date
Jul 17, 2018
GLOBALFOUNDRIES Inc.
Vimal Kamineni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Middle of the line (MOL) metal contacts
Patent number
9,859,217
Issue date
Jan 2, 2018
GLOBALFOUNDRIES Inc.
Chengyu C. Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Middle of the line (MOL) metal contacts
Patent number
9,721,889
Issue date
Aug 1, 2017
GLOBALFOUNDRIES Inc.
Chengyu C. Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method, apparatus, and system for MOL interconnects without titaniu...
Patent number
9,679,807
Issue date
Jun 13, 2017
GLOBALFOUNDRIES Inc.
Vimal Kamineni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper interconnect with CVD liner and metallic cap
Patent number
9,111,938
Issue date
Aug 18, 2015
International Business Machines Corporation
Frieder H. Baumann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper interconnect with CVD liner and metallic cap
Patent number
9,059,176
Issue date
Jun 16, 2015
International Business Machines Corporation
Frieder Hainrich Baumann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper seed layer for an interconnect structure having a doping con...
Patent number
8,729,702
Issue date
May 20, 2014
STMicroelectronics, Inc.
Chengyu Niu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Dual thin film precision resistance trimming
Patent number
8,493,171
Issue date
Jul 23, 2013
STMicroelectronics, Inc.
Olivier Le Neel
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Via-less thin film resistor with a dielectric cap
Patent number
8,400,257
Issue date
Mar 19, 2013
STMicroelectronics Pte Ltd
Ting Fang Lim
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Dual thin film precision resistance trimming
Patent number
8,242,876
Issue date
Aug 14, 2012
STMicroelectronics, Inc.
Olivier Le Neel
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
METHOD, APPARATUS, AND SYSTEM FOR MOL INTERCONNECTS WITHOUT TITANIU...
Publication number
20170243823
Publication date
Aug 24, 2017
GLOBALFOUNDRIES INC.
Vimal Kamineni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD, APPARATUS, AND SYSTEM FOR MOL INTERCONNECTS WITHOUT TITANIU...
Publication number
20170148669
Publication date
May 25, 2017
GLOBALFOUNDRIES INC.
Vimal Kamineni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND DEVICES FOR ENHANCING MOBILITY OF CHARGE CARRIERS
Publication number
20170011971
Publication date
Jan 12, 2017
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND DEVICES FOR ENHANCING MOBILITY OF CHARGE CARRIERS
Publication number
20160118307
Publication date
Apr 28, 2016
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP
Publication number
20150061135
Publication date
Mar 5, 2015
International Business Machines Corporation
Frieder H. Baumann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND DEVICES FOR ENHANCING MOBILITY OF CHARGE CARRIERS
Publication number
20140299938
Publication date
Oct 9, 2014
STMicroelectronics, Inc.
John H. Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SANDWICHED DIFFUSION BARRIER AND METAL LINER FOR AN INTERCONNECT ST...
Publication number
20140138837
Publication date
May 22, 2014
STMicroelectronics, Inc.
Chengyu Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER SEED LAYER FOR AN INTERCONNECT STRUCTURE HAVING A DOPING CON...
Publication number
20140138832
Publication date
May 22, 2014
International Business Machines Corporation
Chengyu Niu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
COPPER INTERCONNECT WITH CVD LINER AND METALLIC CAP
Publication number
20130277842
Publication date
Oct 24, 2013
International Business Machines Corporation
Frieder Hainrich Baumann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL THIN FILM PRECISION RESISTANCE TRIMMING
Publication number
20120266452
Publication date
Oct 25, 2012
STMicroelectronics (Grenoble) SAS
Olivier Le Neel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIA-LESS THIN FILM RESISTOR WITH A DIELECTRIC CAP
Publication number
20120049997
Publication date
Mar 1, 2012
STMicroelectronics, Inc.
Ting Fang Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL THIN FILM PRECISION RESISTANCE TRIMMING
Publication number
20100073122
Publication date
Mar 25, 2010
STMicroelectronics, Inc.
Olivier Le Neel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Hybrid ionized physical vapor deposition of via and trench liners
Publication number
20070232060
Publication date
Oct 4, 2007
STMicroelectronics, Inc.
Chengyu Niu
H01 - BASIC ELECTRIC ELEMENTS