Chi-Hsing HO

Person

Huatan Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrying substrate, electronic package having the carrying substrat...
- Patent number 12,125,828
- Issue date Oct 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,051,641
- Issue date Jul 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrying substrate, electronic package having the carrying substrat...
- Patent number 11,923,337
- Issue date Mar 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,315,881
- Issue date Apr 26, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,991,197
- Issue date Jun 5, 2018
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,899,235
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and fabrication method thereof
- Patent number 9,265,154
- Issue date Feb 16, 2016
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,165,789
- Issue date Oct 20, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging substrate, and fabrication method o...
- Patent number 9,006,039
- Issue date Apr 14, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor package
- Patent number 8,810,045
- Issue date Aug 19, 2014
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance focusing actuator of a voice coil motor
- Patent number 7,576,455
- Issue date Aug 18, 2009
- Tricore Corporation
- Chi-Hsin Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Driving assembly of camera shutter and diaphragm
- Patent number 7,544,003
- Issue date Jun 9, 2009
- Tricore Corporation
- Shih-Hsien Huang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371721
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363545
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290701
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274519
- Publication date Aug 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240264389
- Publication date Aug 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang PU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153884
- Publication date May 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038685
- Publication date Feb 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20230420420
- Publication date Dec 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230282586
- Publication date Sep 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230253331
- Publication date Aug 10, 2023
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230154865
- Publication date May 18, 2023
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230111192
- Publication date Apr 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ANTENNA CIRCUIT
- Publication number 20230067595
- Publication date Mar 2, 2023
- Jabil Circuit (Singapore) Pte. Ltd.
- Chi-Neng Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220399246
- Publication date Dec 15, 2022
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220130769
- Publication date Apr 28, 2022
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20200350285
- Publication date Nov 5, 2020
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE HAVING REDISTRIBUTION STRUCTURE
- Publication number 20190043819
- Publication date Feb 7, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170294372
- Publication date Oct 12, 2017
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20170047230
- Publication date Feb 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE
- Publication number 20170033037
- Publication date Feb 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20150305162
- Publication date Oct 22, 2015
- Siliconware Precision Industries Co., Ltd.
- Shao-tzu Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOTORIZED SERVO DEVICE USING CASELESS MOTOR
- Publication number 20150207368
- Publication date Jul 23, 2015
- TRICORE CORPORATION
- Yen-Fu CHEN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20150187603
- Publication date Jul 2, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20150144384
- Publication date May 28, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE, AND FABRICATION METHOD O...
- Publication number 20140315353
- Publication date Oct 23, 2014
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140091462
- Publication date Apr 3, 2014
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD T...
- Publication number 20130334694
- Publication date Dec 19, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130292832
- Publication date Nov 7, 2013
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance focusing actuator of a voice coil motor
- Publication number 20080036304
- Publication date Feb 14, 2008
- Chi-Hsin Ho
- G02 - OPTICS
Information Patent Application
Driving assembly of camera shutter and diaphragm
- Publication number 20080025720
- Publication date Jan 31, 2008
- Shih-Hsien Huang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Chi-Hsing HO

Person

Patents Grantslast 30 patents

Carrying substrate, electronic package having the carrying substrat...

Electronic package and manufacturing method thereof

Carrying substrate, electronic package having the carrying substrat...

Electronic package and manufacturing method thereof

Fabrication method of semiconductor package

Fabrication method of packaging substrate

Packaging substrate and fabrication method thereof

Fabrication method of packaging substrate

Fabrication method of packaging substrate, and fabrication method o...

Packaging substrate and semiconductor package

High performance focusing actuator of a voice coil motor

Driving assembly of camera shutter and diaphragm

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH ANTENNA CIRCUIT

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

ELECTRONIC PACKAGE HAVING REDISTRIBUTION STRUCTURE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF PACKAGING SUBSTRATE

PACKAGING SUBSTRATE

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

MOTORIZED SERVO DEVICE USING CASELESS MOTOR

FABRICATION METHOD OF PACKAGING SUBSTRATE

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

FABRICATION METHOD OF PACKAGING SUBSTRATE, AND FABRICATION METHOD O...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD T...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

High performance focusing actuator of a voice coil motor

Driving assembly of camera shutter and diaphragm