Chi-Jung Song

Person

Daejon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Area array type semiconductor package fabrication method
- Patent number 7,122,401
- Issue date Oct 17, 2006
- Hyundai Electronics Industries Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and land grid array semiconductor package u...
- Patent number 6,682,957
- Issue date Jan 27, 2004
- Hyundai Electromics Industries Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation method for ball grid array semiconductor package
- Patent number 6,484,394
- Issue date Nov 26, 2002
- Hyundai Electronics Industries Co., Ltd.
- Seong-Jae Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and land grid array semiconductor package u...
- Patent number 6,441,498
- Issue date Aug 27, 2002
- Hyundai Electronics Industries Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area array type semiconductor package and fabrication method
- Patent number 6,316,837
- Issue date Nov 13, 2001
- Hyundai Electronics Industries Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package body and semiconductor chip package using same
- Patent number 6,031,284
- Issue date Feb 29, 2000
- LG Semicon Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack package
- Patent number 5,910,682
- Issue date Jun 8, 1999
- LG Semicon Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having leads with step-shaped dimples
- Patent number 5,834,837
- Issue date Nov 10, 1998
- LG Semicon Co., Ltd.
- Chi Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip package with reduced dimensions and leads exposed f...
- Patent number 5,770,888
- Issue date Jun 23, 1998
- LG Semicon Co., Ltd.
- Chi Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package with such lead frame
- Patent number 5,554,886
- Issue date Sep 10, 1996
- Goldstar Electron Co., Ltd.
- Chi J. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 5,471,088
- Issue date Nov 28, 1995
- Goldstar Electron Co., Ltd.
- Chi J. Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 5,444,301
- Issue date Aug 22, 1995
- Goldstar Electron Co. Ltd.
- Chi J. Song
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor substrate and land grid array semiconductor package u...
- Publication number 20020151112
- Publication date Oct 17, 2002
- Hyundai Electronics Industries Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulation method for ball grid array semiconductor package
- Publication number 20020148112
- Publication date Oct 17, 2002
- LG Semicon Co., Ltd.
- Seong-Jae Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Area array type semiconductor package and fabrication method
- Publication number 20020038904
- Publication date Apr 4, 2002
- Hyundai Electronics Industries Co., Ltd.
- Chi-Jung Song
- H01 - BASIC ELECTRIC ELEMENTS

Chi-Jung Song

Person

Patents Grantslast 30 patents

Area array type semiconductor package fabrication method

Semiconductor substrate and land grid array semiconductor package u...

Encapsulation method for ball grid array semiconductor package

Semiconductor substrate and land grid array semiconductor package u...

Area array type semiconductor package and fabrication method

Package body and semiconductor chip package using same

Semiconductor chip stack package

Semiconductor package having leads with step-shaped dimples

Integrated chip package with reduced dimensions and leads exposed f...

Lead frame and semiconductor package with such lead frame

Semiconductor package and method for manufacturing the same

Semiconductor package and method for manufacturing the same

Patents Applicationslast 30 patents

Semiconductor substrate and land grid array semiconductor package u...

Encapsulation method for ball grid array semiconductor package

Area array type semiconductor package and fabrication method