Number | Date | Country | Kind |
---|---|---|---|
11506/1993 | Jun 1993 | KRX |
Number | Name | Date | Kind |
---|---|---|---|
4604644 | Beckham et al. | Aug 1986 | |
4974057 | Tazima | Nov 1990 | |
5283446 | Tanisawa | Feb 1994 |
Number | Date | Country |
---|---|---|
6094744 | May 1985 | JPX |
63-254758 | Oct 1988 | JPX |
Entry |
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IBM Technical Disclosure Bulletin, vol. 33 No. 7 Dec. 1990, "Direct Chip Bonding for LCD", p. 213. |
IBM Technical Disclosure Bulletin, vol. 25 No. 4 Sep. 1982; "Photo-Defined Lamination for Chip Bonding", C. Edwards, Paper 1952/53. |