Chia-Pin Chiu

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package designs to enable dual-sided cooling on a laser chip
- Patent number 12,176,676
- Issue date Dec 24, 2024
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 12,113,026
- Issue date Oct 8, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Thermally conductive slugs/active dies to improve cooling of stacke...
- Patent number 12,094,800
- Issue date Sep 17, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,051,667
- Issue date Jul 30, 2024
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package system and package
- Patent number 12,009,321
- Issue date Jun 11, 2024
- Intel Corporation
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,984,396
- Issue date May 14, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,876,053
- Issue date Jan 16, 2024
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
STIM/liquid metal filled laser drill trench to improve cooling of s...
- Patent number 11,854,931
- Issue date Dec 26, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink cutout and insulating through silicon vias to cut thermal...
- Patent number 11,837,519
- Issue date Dec 5, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
- Patent number 11,824,008
- Issue date Nov 21, 2023
- Intel Corporation
- Henning Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,810,884
- Issue date Nov 7, 2023
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D buildup of thermally conductive layers to resolve die height dif...
- Patent number 11,670,561
- Issue date Jun 6, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal solutions for multi-package assemblies and methods for fabr...
- Patent number 11,652,020
- Issue date May 16, 2023
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading mechanism for passive or active socket and package c...
- Patent number 11,646,244
- Issue date May 9, 2023
- Intel Corporation
- Steven A. Klein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual collimating lens configuration for optical devices
- Patent number 11,579,426
- Issue date Feb 14, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Grant
Integrated circuit package socket housing to enhance package cooling
- Patent number 11,581,671
- Issue date Feb 14, 2023
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal TIM with STIM-like performance with no BSM and BGA com...
- Patent number 11,551,994
- Issue date Jan 10, 2023
- Intel Corporation
- Kelly Lofgreen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,515,248
- Issue date Nov 29, 2022
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling through conductive interconnect
- Patent number 11,515,232
- Issue date Nov 29, 2022
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal assemblies for multi-chip packages
- Patent number 11,456,232
- Issue date Sep 27, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with multiple channels for multichip packages
- Patent number 11,444,003
- Issue date Sep 13, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped metal features for cooling hotspots in stacked-die packages
- Patent number 11,398,414
- Issue date Jul 26, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 11,251,150
- Issue date Feb 15, 2022
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound parabolic concentrator including protrusion
- Patent number 11,156,815
- Issue date Oct 26, 2021
- Intel Corporation
- Chia-Pin Chiu
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board assembly
- Patent number 11,140,770
- Issue date Oct 5, 2021
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with patterned protective material
- Patent number 10,957,656
- Issue date Mar 23, 2021
- Intel Corporation
- Kyle Yazzie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TUNABLE EDGE-COUPLED INTERFACE FOR SILICON PHOTONIC INTEGRATED CIRC...
- Publication number 20250044537
- Publication date Feb 6, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...
- Publication number 20250004206
- Publication date Jan 2, 2025
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240429173
- Publication date Dec 26, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...
- Publication number 20240402442
- Publication date Dec 5, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240339428
- Publication date Oct 10, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PHOTONIC INTEGRATED CIRCUITS
- Publication number 20240329301
- Publication date Oct 3, 2024
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING A...
- Publication number 20240329313
- Publication date Oct 3, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...
- Publication number 20240319457
- Publication date Sep 26, 2024
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
- Publication number 20240319437
- Publication date Sep 26, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...
- Publication number 20240061192
- Publication date Feb 22, 2024
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20240038671
- Publication date Feb 1, 2024
- Intel Corporation
- Henning BRAUNISCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
- Publication number 20240021562
- Publication date Jan 18, 2024
- Intel Corporation
- Weng Hong TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM
- Publication number 20230420396
- Publication date Dec 28, 2023
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING
- Publication number 20230411369
- Publication date Dec 21, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING PACKAGE ARCHITECTURE FOR HIGH-SPEED INPUT/OUTPUT WITH...
- Publication number 20230369289
- Publication date Nov 16, 2023
- Intel Corporation
- Jong-Ru Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED BRIDGE STRUCTURE FOR A PHOTONIC INTEGRATED CIRCUIT
- Publication number 20230358952
- Publication date Nov 9, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC IN...
- Publication number 20230341638
- Publication date Oct 26, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC)
- Publication number 20230341622
- Publication date Oct 26, 2023
- Intel Corporation
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
ON-CAVITY PHOTONIC INTEGRATED CIRCUIT (OCPIC) TO ACHIEVE THE MOST U...
- Publication number 20230314850
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
UNDERCUT DESIGN WITH A BONDED BASE COVER FOR FRIENDLY ASSEMBLY AND...
- Publication number 20230314849
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
TEMPERATURE SENSOR TO ACHIEVE THERMAL STABILIZATION OF MICRO-RING R...
- Publication number 20230314704
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS OF THERMAL INSULATION FOR MICRO-RING RESONATOR (MRR) IN ON-...
- Publication number 20230314703
- Publication date Oct 5, 2023
- Intel Corporation
- Chia-Pin CHIU
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A GRIN LENS
- Publication number 20230194791
- Publication date Jun 22, 2023
- Intel Corporation
- Xiaoqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LENS ASSEMBLY
- Publication number 20230194783
- Publication date Jun 22, 2023
- Intel Corporation
- Kaveh Hosseini
- G02 - OPTICS
Information Patent Application
OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD
- Publication number 20230185034
- Publication date Jun 15, 2023
- Chia-Pin Chiu
- G02 - OPTICS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20230130944
- Publication date Apr 27, 2023
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20230040850
- Publication date Feb 9, 2023
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
- Publication number 20230016326
- Publication date Jan 19, 2023
- Intel Corporation
- Henning M. Braunisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT COOLING WITH A THERMAL DIE
- Publication number 20220413236
- Publication date Dec 29, 2022
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Pin Chiu

Person

Patents Grantslast 30 patents

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Package designs to enable dual-sided cooling on a laser chip

Multi-chip package and method of providing die-to-die interconnects...

Localized high density substrate routing

Completely encapsulated optical multi chip package

Thermally conductive slugs/active dies to improve cooling of stacke...

High density substrate routing in package

Package system and package

Localized high density substrate routing

Multi-chip package and method of providing die-to-die interconnects...

STIM/liquid metal filled laser drill trench to improve cooling of s...

Heatsink cutout and insulating through silicon vias to cut thermal...

Multi-chip package and method of providing die-to-die interconnects...

High density substrate routing in package

3D buildup of thermally conductive layers to resolve die height dif...

Thermal solutions for multi-package assemblies and methods for fabr...

Socket loading mechanism for passive or active socket and package c...

Dual collimating lens configuration for optical devices

Integrated circuit package socket housing to enhance package cooling

Liquid metal TIM with STIM-like performance with no BSM and BGA com...

Microelectronic assemblies having a cooling channel

Localized high density substrate routing

Liquid cooling through conductive interconnect

Thermal assemblies for multi-chip packages

Integrated heat spreader with multiple channels for multichip packages

Sloped metal features for cooling hotspots in stacked-die packages

High density substrate routing in package

Compound parabolic concentrator including protrusion

Printed circuit board assembly

Integrated circuit packages with patterned protective material

Patents Applicationslast 30 patents

TUNABLE EDGE-COUPLED INTERFACE FOR SILICON PHOTONIC INTEGRATED CIRC...

STACKED PACKAGE DESIGN FOR MORE RELIABLE FIBER COUPLING TO PHOTONIC...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

PHOTONIC INTEGRATED CIRCUIT EDGE COUPLING AND FIBER ATTACH UNIT ATT...

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

EMBEDDED PHOTONIC INTEGRATED CIRCUITS

TECHNOLOGIES FOR A MICROLENS DESIGN WITH DIFFERENT LIGHT EMITTING A...

UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC...

PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN

FIBER ARRAY UNIT (FAU) DESIGNS TO ENABLE A HIGHER IO BANDWIDTH PER...

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE

DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM

PHOTONICS PACKAGING WITH HIGH-DENSITY ROUTING

DIE STACKING PACKAGE ARCHITECTURE FOR HIGH-SPEED INPUT/OUTPUT WITH...

REDUCED BRIDGE STRUCTURE FOR A PHOTONIC INTEGRATED CIRCUIT

THERMAL STRUCTURE FOR A MICRO-RING RESONATOR (MRR) IN A PHOTONIC IN...

COVERED CAVITY FOR A PHOTONIC INTEGRATED CIRCUIT (PIC)

ON-CAVITY PHOTONIC INTEGRATED CIRCUIT (OCPIC) TO ACHIEVE THE MOST U...

UNDERCUT DESIGN WITH A BONDED BASE COVER FOR FRIENDLY ASSEMBLY AND...

TEMPERATURE SENSOR TO ACHIEVE THERMAL STABILIZATION OF MICRO-RING R...

DESIGNS OF THERMAL INSULATION FOR MICRO-RING RESONATOR (MRR) IN ON-...

ELECTRONIC DEVICE INCLUDING A GRIN LENS

ELECTRONIC DEVICE INCLUDING A LENS ASSEMBLY

OPEN CAVITY PHOTONIC INTEGRATED CIRCUIT AND METHOD

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...

PHOTONIC INTEGRATED CIRCUIT COOLING WITH A THERMAL DIE